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公开(公告)号：US20090035972A1
公开(公告)日：2009-02-05
申请号：US12250474
申请日：2008-10-13
Applicant: Jeffrey A. Lev , Paul J. Doczy , Jonathan R. Harris
Inventor： Jeffrey A. Lev , Paul J. Doczy , Jonathan R. Harris
IPC: H01R13/62
CPC classification number: H01R13/4538 , H01R33/945 , H01R33/975 , H01R2201/06
Abstract: A computer device comprising a connector configured to be coupled to an external device, the connector configured to be disposed flush with an opening in a housing of the computer device in an extended position, the connector configured to retract from the opening in a retracted position.
Abstract translation: 一种计算机设备，包括被配置为联接到外部设备的连接器，所述连接器被配置为在延伸位置与所述计算机设备的壳体中的开口齐平地布置，所述连接器被配置为在缩回位置从所述开口缩回。
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公开(公告)号：US20080269954A1
公开(公告)日：2008-10-30
申请号：US11799185
申请日：2007-04-30
Applicant: Jeffrey A. Lev , Jeffrey Kevin Jeansonne , Walter G. Fry
Inventor： Jeffrey A. Lev , Jeffrey Kevin Jeansonne , Walter G. Fry
IPC: G05D23/00
CPC classification number: G05D23/19
Abstract: An electronic device thermal management system comprising a thermal management controller configured to maintain a temperature level within a housing of an electronic device based on a signal indicative of a temperature of at least a portion of a wall of the housing of the electronic device.
Abstract translation: 一种电子设备热管理系统，包括热管理控制器，其被配置为基于指示电子设备的壳体的壁的至少一部分的温度的信号来将电子设备的壳体内的温度水平维持在电子设备的壳体内。
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公开(公告)号：US20080267457A1
公开(公告)日：2008-10-30
申请号：US11799271
申请日：2007-04-30
Applicant: Valiuddin Y. Ali , Jeffrey A. Lev , Paul J. Doczy , Jeffrey C. Parker
Inventor： Valiuddin Y. Ali , Jeffrey A. Lev , Paul J. Doczy , Jeffrey C. Parker
IPC: G06K9/00
CPC classification number: G06K9/00053
Abstract: An electronic device comprises a biometric module having a contact-based sensor configured to capture a biometric image, the biometric module configured to discharge electrostatic energy from a user of the biometric module before activating the sensor.
Abstract translation: 电子设备包括具有配置成捕获生物测定图像的基于接触的传感器的生物测定模块，所述生物测定模块被配置为在激活传感器之前从生物测定模块的用户排出静电能量。
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公开(公告)号：US20080259557A1
公开(公告)日：2008-10-23
申请号：US11788462
申请日：2007-04-20
Applicant: Jeffrey A. Lev , Mark S. Tracy
Inventor： Jeffrey A. Lev , Mark S. Tracy
IPC: H05K7/20
CPC classification number: G06F1/203 , G06F2200/201
Abstract: A device cooling system comprises a heat pipe disposed in a device, the heat pipe having a condenser portion and at least two divergent evaporator portions, the at least two evaporator portions coupled to at least one heat-generating component of the device.
Abstract translation: 装置冷却系统包括设置在装置中的热管，所述热管具有冷凝器部分和至少两个发散蒸发器部分，所述至少两个蒸发器部分联接到所述装置的至少一个发热部件。
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85.发明申请SYSTEM COMPRISING A SLOT CONFIGURABLE TO RECEIVE A DEVICE HAVING AN INTERFACE TYPE THAT DIFFERS FROM THE INTERFACE TYPE OF THE SLOT 有权包含可配置以接收具有不同接口类型的接口类型的设备的系统的系统公开(公告)号：US20080182458A1
公开(公告)日：2008-07-31
申请号：US11669434
申请日：2007-01-31
Applicant: Mark S. TRACY , Jeffrey A. Lev , Walter J. Rankins , Walter Fry
Inventor： Mark S. TRACY , Jeffrey A. Lev , Walter J. Rankins , Walter Fry
IPC: H01R27/00
CPC classification number: H01R31/06 , Y10S439/945
Abstract: A system comprises a chassis and a slot that is externally accessible on the chassis. The slot is configured to receive a first electronic device having a first electrical interface type. The slot is also configured to receive an adapter comprising a second electrical device having a second electrical interface type that is different than the first electrical interface type.
Abstract translation: 一个系统包括一个底盘和一个在机箱外部可以访问的插槽。 该槽被配置为接收具有第一电接口类型的第一电子设备。 插槽还被配置为接收包括具有不同于第一电接口类型的第二电接口类型的第二电气设备的适配器。
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Patent Agency Ranking
公开(公告)号：US20080100518A1
公开(公告)日：2008-05-01
申请号：US11591248
申请日：2006-10-31
Applicant: Jeffrey A. Lev , Paul J. Doczy , Mark S. Tracy
Inventor： Jeffrey A. Lev , Paul J. Doczy , Mark S. Tracy
IPC: H01Q1/24
Abstract: An electronic device detachable antenna assembly comprises a connector member coupled to an electronic device and configured to receive an external antenna in pluggable engagement therewith, the antenna and the connector member movable between a stored position on the electronic device and an extended position relative to the electronic device.
Abstract translation: 电子设备可拆卸天线组件包括连接到电子设备并被配置为接收与其可插拔接合的外部天线的连接器构件，天线和连接器构件可在电子设备上的存储位置和相对于电子设备的延伸位置之间移动 设备。
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公开(公告)号：US07345871B2
公开(公告)日：2008-03-18
申请号：US11047902
申请日：2005-02-01
Applicant: Jeffrey A. Lev , Earl W. Moore
Inventor： Jeffrey A. Lev , Earl W. Moore
CPC classification number: G06F1/1632 , G06F1/162 , G06F1/1679 , G06F1/1681 , Y10S248/917 , Y10T16/54025 , Y10T16/547 , Y10T16/5472 , Y10T16/551
Abstract: Disclosed are systems and methods for locking a movable appendage (e.g., a display) of an electronic device (e.g., a tablet computer) comprising a rotational lock interfaced with a display hinge assembly of the display, and a docking member disposed to engage at least a portion of the rotational lock when the electronic device is interfaced with an external device.
Abstract translation: 公开了一种用于锁定电子设备（例如，平板计算机）的可移动附件（例如，显示器）的系统和方法，包括与显示器的显示器铰链组件接口的旋转锁和至少与 当电子设备与外部设备接口时旋转锁定的一部分。
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公开(公告)号：US06301107B1
公开(公告)日：2001-10-09
申请号：US09537032
申请日：2000-03-28
Applicant: Jeffrey A. Lev , Ronald E. Deluga
Inventor： Jeffrey A. Lev , Ronald E. Deluga
IPC: G06F116
CPC classification number: G06F1/203
Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A laterally Enlarged heat sink section is integrally formed on the evaporating end portion and has a flat bottom side and an arcuate top side. The integral heat sink section is resiliently deflected into the die recess, and has its flat bottom side resiliently pressed against the thermal interface pad, by a spring plate portion of a clamping structure downwardly engaging the arcuate top side of the heat sink section. During operator of the microprocessor, die heat is transferred to the metal shield wall sequentially through the thermal pad and the heat pipe, and then dissipated from the shield wall using fan-generated cooling air flowed along the shield wall.
Abstract translation: 计算机微处理器具有在其顶侧壁中形成有凹部的壳体部分，并且在凹部内插入模具部分。 通过散热装置消除来自管芯的工作热量，该散热装置自动适应微处理器接合线厚度的变化，并且包括覆盖微处理器的金属板EMI屏蔽壁，并且具有固定到其底侧的热虹吸管的冷凝端部， 其中热管的蒸发端部覆盖在模具凹部上，并且朝向安装在模具的顶侧上的相变热垫弹性地偏转，并插入到壳体模具凹部中。 横向扩大的散热部分整体地形成在蒸发端部上，并且具有平坦的底侧和弧形顶侧。 一体式散热器部分弹性地偏转到模具凹部中，并且其平坦的底侧通过向下接合散热器部分的弧形顶侧的夹紧结构的弹簧板部分弹性地压靠在热界面垫上。 在微处理器的操作者期间，模具热量依次通过热垫和热管传递到金属屏蔽壁，然后使用沿屏蔽壁流动的风扇产生的冷却空气从屏蔽壁消散。
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公开(公告)号：US20150220108A1
公开(公告)日：2015-08-06
申请号：US14426960
申请日：2012-09-12
Applicant: Jeffrey A. Lev , Chia-Ming Tsai , Hui Leng Lim
Inventor： Jeffrey A. Lev , Chia-Ming Tsai , Hui Leng Lim
CPC classification number: G06F1/16 , G06F1/1679 , H05K5/0221 , Y10T29/49895
Abstract: A latch is disclosed. The latch has a hook that rotates to engage with a case for a computer. The hook has one side fabricated from a ferrous material. The hook is unlatched by placing a magnet near the ferrous material thereby causing the hook to rotate and disengage with the top case.
Abstract translation: 公开了一种闩锁。 闩锁具有旋转以与计算机的壳体接合的钩。 钩子有一边用黑色金属材料制成。 通过将铁磁体放置在铁质材料附近，从而使钩旋转并与顶壳分离，从而解锁钩。
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公开(公告)号：US08798806B2
公开(公告)日：2014-08-05
申请号：US11799185
申请日：2007-04-30
Applicant: Jeffrey A. Lev , Jeffrey Kevin Jeansonne , Walter G. Fry
Inventor： Jeffrey A. Lev , Jeffrey Kevin Jeansonne , Walter G. Fry
IPC: G05D23/00
CPC classification number: G05D23/19
Abstract: An electronic device thermal management system comprising a thermal management controller configured to maintain a temperature level within a housing of an electronic device based on a signal indicative of a temperature of at least a portion of a wall of the housing of the electronic device.
Abstract translation: 一种电子设备热管理系统，包括热管理控制器，其被配置为基于指示电子设备的壳体的壁的至少一部分的温度的信号来将电子设备的壳体内的温度水平维持在电子设备的壳体内。
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