公开(公告)号：US20060066215A1

公开(公告)日：2006-03-30

申请号：US11239215

申请日：2005-09-30

Applicant: Toshiaki Kusunoki ,  Masakazu Sagawa ,  Kazutaka Tsuji ,  Hiroshi Kikuchi ,  Yasushi Sano ,  Nobuyuki Ushifusa ,  Nobuhiko Fukuoka ,  Etsuko Nishimura ,  Takuya Takahashi

Inventor： Toshiaki Kusunoki ,  Masakazu Sagawa ,  Kazutaka Tsuji ,  Hiroshi Kikuchi ,  Yasushi Sano ,  Nobuyuki Ushifusa ,  Nobuhiko Fukuoka ,  Etsuko Nishimura ,  Takuya Takahashi

IPC: H01J63/04 ,  H01J1/62 ,  H01J1/05

CPC classification number: H01J29/02 ,  H01J9/02 ,  H01J31/127

Abstract: An upper bus electrode is formed as a laminated wire of a metal film lower layer, a metal film intermediate layer and a metal film upper layer. Al lower in electrode potential is used as a low resistance material for the metal film intermediate layer of the upper bus electrode, while Cr high in heat resistance and oxidation resistance and higher in electrode potential than Al is used for the metal film lower and upper layers disposed as upper and lower layers. Al and Cr are selectively etched so that the metal film lower layer projects on one side and has an undercut on the other side with respect to the metal film intermediate layer. Thus, when the upper bus electrode has a structure using a laminated wire made of metal high in heat resistance and oxidation resistance, and metal low in resistance and sandwiched in the metal high in heat resistance and oxidation resistance, so as to separate an upper electrode from upper electrodes by self-alignment, deformation of the undercut portion due to oxidization of a side surface of the low-resistance metal is suppressed to improve the self-alignment separation characteristic of the upper electrode.

Abstract translation: 上部总线电极形成为金属膜下层，金属膜中间层和金属膜上层的层叠线。 电极电位的低电位被用作上部总线电极的金属膜中间层的低电阻材料，而与Al相比，耐热性和抗氧化性高，电极电位高的Cr用于金属膜下层和上层 作为上层和下层排列。 Al和Cr被选择性地蚀刻，使得金属膜下层在一侧突出，并且在金属膜中间层的另一侧具有底切。 因此，当上部总线电极具有使用由耐热性和抗氧化性高的金属制成的层叠线的结构，并且具有低电阻的金属并且被夹在金属中的耐热性和抗氧化性高的结构时，分离上电极 通过自对准从上部电极，抑制由于低电阻金属的侧面的氧化引起的底切部分的变形，从而提高上部电极的自对准分离特性。

公开(公告)号：US20060057338A1

公开(公告)日：2006-03-16

申请号：US11220742

申请日：2005-09-08

Applicant: Makoto Abe ,  Hiroki Kaneko ,  Takuya Takahashi ,  Etsuko Nishimura ,  Yoshitaka Tsutsui ,  Takaaki Suzuki

Inventor： Makoto Abe ,  Hiroki Kaneko ,  Takuya Takahashi ,  Etsuko Nishimura ,  Yoshitaka Tsutsui ,  Takaaki Suzuki

IPC: G03G7/00

CPC classification number: G02F1/136286 ,  G02F2001/136295 ,  H05K3/125 ,  H05K2203/013 ,  Y10S428/901 ,  Y10T428/24802

Abstract: A substrate with plane patterns formed in a liquid process wherein the plane patterns are formed based on a combination of plane shapes by which a difference in internal pressure of a solution between any two points of the solution is small, the solution being ejected onto the substrate so as to form the plane patterns by the liquid process.

Abstract translation: 具有在液体处理中形成的平面图案的基板，其中基于平面形状的组合形成平面图案，通过该平面形状的组合，溶液的任何两个点之间的溶液的内部压力差异小，溶液被喷射到基板上 以便通过液体过程形成平面图案。

公开(公告)号：US06921016B2

公开(公告)日：2005-07-26

申请号：US10347297

申请日：2003-01-21

Applicant: Takuya Takahashi

Inventor： Takuya Takahashi

IPC: H01L25/18 ,  B23K20/00 ,  B23K20/10 ,  H01L21/60 ,  H01L21/607 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  B23K31/00

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/007 ,  B23K20/10 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: A tip of a wire is bonded to a first electrode by using a tool. The wire is drawn from the first electrode to a bump on a second electrode. Apart of the wire is bonded to the center of the bump or a portion of the bump beyond the center in a drawing direction of the wire by using a part of the tool on a first electrode side in the drawing direction of the wire.

Abstract translation: 通过使用工具将导线的尖端接合到第一电极。 导线从第一电极拉到第二电极上的凸块。 除了通过在线的拉拔方向上的第一电极侧上的工具的一部分之外，将线焊接到凸块的中心或凸块的一部分超过中心的线的拉伸方向。

公开(公告)号：US06731364B2

公开(公告)日：2004-05-04

申请号：US10101166

申请日：2002-03-20

Applicant: Takuya Takahashi ,  Toshiki Kaneko ,  Katsumi Tamura ,  Kenichi Onisawa

Inventor： Takuya Takahashi ,  Toshiki Kaneko ,  Katsumi Tamura ,  Kenichi Onisawa

IPC: G02F11343

CPC classification number: G02F1/136286 ,  G02F1/134363 ,  G02F2001/13629

Abstract: A liquid crystal display device has image signal lines of a bottom gate type TFT, in which the image signal lines comprise a laminated film formed of a first conductive film disposed as a lower layer and a second conductive film disposed as an upper layer. The first conductive film is made of an alloy comprising Mo as a main ingredient and W, and the second conductive film is made of an alloy comprising Mo as a main ingredient and Zr. The device is capable of satisfying requirements of reduced resistance, improved dry etching resistance, selective wet etching with respect to the gate insulative film, the number of laminated layer of two or less, and tapered fabrication for the cross section.

Abstract translation: 液晶显示装置具有底栅型TFT的图像信号线，其中图像信号线包括由布置为下层的第一导电膜和作为上层布置的第二导电膜形成的层叠膜。 第一导电膜由以Mo为主成分的合金和W构成，第二导电膜由以Mo为主成分的合金和Zr构成。 该装置能够满足降低电阻，改善的耐干蚀刻性，相对于栅极绝缘膜的选择性湿蚀刻，层叠层数为2以下的截面以及截面的锥形制造的要求。

公开(公告)号：US06628361B2

公开(公告)日：2003-09-30

申请号：US09790638

申请日：2001-02-23

Applicant: Takuya Takahashi ,  Yoichi Sakaki ,  Isao Ikuta ,  Katsumi Tamura ,  Ken-ichi Onisawa

Inventor： Takuya Takahashi ,  Yoichi Sakaki ,  Isao Ikuta ,  Katsumi Tamura ,  Ken-ichi Onisawa

IPC: G02F11343

CPC classification number: G02F1/136286 ,  G02F2001/13629 ,  G02F2001/136295

Abstract: A wiring structure is provided, the wiring structure being formed by forming a laminated film of silver (Ag) or an alloy containing silver (Ag) as the major constituent and the other metallic material, and by forming a wiring pattern through a single process of photolithography. The wiring structure comprises a plurality of first parallel wires; a plurality of second parallel wires intersecting with the first parallel wires; and a plurality of active elements, each of the active elements being arranged at a position near an intersection of the first parallel wire and the second parallel wire and connected to the first parallel wire and the second parallel wire, wherein part or all of the first parallel wires and the second parallel wires are of a laminated structure of a layer made of silver (Ag) or an alloy containing silver (Ag) as a major constituent and a layer made of a metallic element having standard electrode potential of dissolution reaction lower than the standard electrode potential of silver (Ag) or an alloy containing said metallic element as a major constituent, and are formed through a single process of photolithography.

Abstract translation: 提供一种布线结构，该布线结构通过以下方式形成：银（Ag）或含有银（Ag）的合金作为主要成分和另一种金属材料的叠层膜，并通过单一工艺形成布线图案 布线结构包括多个第一平行线; 与所述第一平行线相交的多个第二平行线; 以及多个有源元件，所述有源元件中的每一个被布置在靠近所述第一平行线和所述第二平行线的交叉点并且连接到所述第一平行线和所述第二平行线的位置，其中所述第一平行线和所述第二平行线的部分或全部 平行线和第二平行线是由银（Ag）或含有银（Ag）作为主要成分的合金层构成的层的层压结构，以及由金属元素制成的层，其具有溶解反应的标准电极电位低于 银（Ag）或包含所述金属元素作为主要成分的合金的标准电极电位，并且通过单一光刻工艺形成。

公开(公告)号：USD475714S1

公开(公告)日：2003-06-10

申请号：US29165834

申请日：2002-08-19

Applicant: Toshiyuki Taniguchi ,  Kazuhiro Yamamoto ,  Minoru Ohara ,  Takuya Takahashi

Designer： Toshiyuki Taniguchi ,  Kazuhiro Yamamoto ,  Minoru Ohara ,  Takuya Takahashi

公开(公告)号：USD475056S1

公开(公告)日：2003-05-27

申请号：US29165822

申请日：2002-08-19

Applicant: Toshiyuki Taniguchi ,  Kazuhiro Yamamoto ,  Minoru Ohara ,  Takuya Takahashi

Designer： Toshiyuki Taniguchi ,  Kazuhiro Yamamoto ,  Minoru Ohara ,  Takuya Takahashi

公开(公告)号：US06548747B2

公开(公告)日：2003-04-15

申请号：US10081295

申请日：2002-02-20

Applicant: Takaaki Shibata ,  Hiroaki Takahashi ,  Takuya Takahashi ,  Atsushi Yamaura

Inventor： Takaaki Shibata ,  Hiroaki Takahashi ,  Takuya Takahashi ,  Atsushi Yamaura

IPC: G09B1504

CPC classification number: G06F17/30864 ,  G06F17/30749 ,  G06F17/30775 ,  G10H1/0058 ,  G10H1/365 ,  G10H2230/015 ,  G10H2230/021 ,  G10H2240/111 ,  G10H2240/115 ,  G10H2240/251 ,  G10H2240/305 ,  H04L29/06027 ,  H04L65/4092

Abstract: In an information service system whereby a server apparatus distributes music performance data to a telephony terminal apparatus through a network, the telephony terminal apparatus includes a storage section that stores an application program to be executed by a processing section for sending to the server apparatus a search query effective to specify target music performance data and acquiring the target music performance data from the server apparatus for exclusive use by the application program. In the server apparatus, a first distributing section responds to the search query in the form of contents that are dedicated for use by the application program. A second distributing section of the server apparatus responds to a request from the telephony terminal apparatus for distributing second contents of the same target music performance data to the telephony terminal apparatus such that the second contents can be treated by the telephony terminal apparatus independently of the application program.

Abstract translation: 在服务器装置通过网络将音乐演奏数据分发到电话终端装置的信息服务系统中，电话终端装置包括：存储单元，存储由处理单元执行的应用程序，用于向服务器装置发送搜索 查询有效地指定目标音乐演奏数据，并从应用程序独占使用的服务器装置获取目标音乐演奏数据。 在服务器装置中，第一分发部以专用于应用程序的内容的形式对搜索查询进行响应。 服务器装置的第二分发部分响应来自电话终端装置的用于将相同目标音乐演奏数据的第二内容分发给电话终端装置的请求，使得第二内容可以被电话终端装置独立于应用程序 程序。

公开(公告)号：US06433842B1

公开(公告)日：2002-08-13

申请号：US09537395

申请日：2000-03-29

Applicant: Toshiki Kaneko ,  Masaru Takabatake ,  Takahiro Ochiai ,  Takuya Takahashi ,  Katsumi Tamura ,  Kenichi Onisawa ,  Kenichi Cyahara ,  Masatomo Terakado ,  Yuichi Harano ,  Hideaki Yamamoto

Inventor： Toshiki Kaneko ,  Masaru Takabatake ,  Takahiro Ochiai ,  Takuya Takahashi ,  Katsumi Tamura ,  Kenichi Onisawa ,  Kenichi Cyahara ,  Masatomo Terakado ,  Yuichi Harano ,  Hideaki Yamamoto

IPC: G02F1136

CPC classification number: G02F1/136286 ,  G02F2001/13629

Abstract: The method of fabrication of a liquid crystal display device includes the steps of: forming a metal thin film on a glass substrate; forming a resist pattern on the metal thin film by photolithography; and wet-etching the metal thin film with an etchant formed of a mixture including phosphoric acid, nitric acid in a range between 7 mol % and 12 mol % inclusive, and at least one of ammonium fluoride and hydrogen fluoride in a trace amount of about 0.01 to 0.1 mol %.

Abstract translation: 制造液晶显示装置的方法包括以下步骤：在玻璃基板上形成金属薄膜; 通过光刻在金属薄膜上形成抗蚀剂图案; 并用由包括磷酸，硝酸在7摩尔％至12摩尔％之间的混合物的混合物形成的蚀刻剂湿蚀刻金属薄膜，以及微量约为的氟化铵和氟化氢中的至少一种 0.01〜0.1摩尔％。

公开(公告)号：US06333212B1

公开(公告)日：2001-12-25

申请号：US09707850

申请日：2000-11-08

Applicant: Jun Ohmori ,  Hiroshi Iwasaki ,  Takuya Takahashi ,  Takanori Jin ,  Masatoshi Fukuda

Inventor： Jun Ohmori ,  Hiroshi Iwasaki ,  Takuya Takahashi ,  Takanori Jin ,  Masatoshi Fukuda

IPC: H01L2144

CPC classification number: H01L23/3121 ,  H01L23/49531 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.

Abstract translation: 公开了一种厚度为1mm以下的半导体器件，其包括厚度为0.1mm至0.25mm的框架板主体，设置在框架板主体的第一表面上并具有 厚度在0.2mm至0.3mm的范围内，外部连接引线，其一端连接到框架板主体的第一表面的周边部分，其另一端延伸到框架主体的外部 电连接半导体芯片的电极和外部连接引线的端部的连接部分的接合线，以及用于覆盖和密封至少包括半导体芯片，接合线和 连接部分。