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公开(公告)号:US20210305778A1
公开(公告)日:2021-09-30
申请号:US17210098
申请日:2021-03-23
Applicant: DENSO CORPORATION , TOHOKU UNIVERSITY , WASEDA UNIVERSITY
Inventor: MASASHIGE SATO , TAKU SUZUKI , HIROSHI YASAKA , NOBUHIDE YOKOTA , TOMOHIRO KITA
IPC: H01S5/0687 , H01S5/042 , H01S5/062 , H01S5/00
Abstract: A laser apparatus includes: a light source configured to generate laser light; and an optical negative feedback unit configured to narrow a spectral line of the laser light using optical negative feedback. A modulation signal is input to the light source to modulate a frequency of the laser light. A modulation amount in the frequency of the laser light is detected. A modulation sensitivity is calculated from (i) the modulation amount and (ii) an intensity of the modulation signal.
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公开(公告)号:US20210225794A1
公开(公告)日:2021-07-22
申请号:US17187452
申请日:2021-02-26
Applicant: WASEDA UNIVERSITY
Inventor: Kohei Tatsumi , Yasunori Tanaka
IPC: H01L23/00
Abstract: A semiconductor element bonding structure capable of strongly bonding a semiconductor element and an object to be bonded and relaxing thermal stress caused by a difference in thermal expansion, by interposing metal particles and Ni between the semiconductor element and the object to be bonded, the metal particles having a lower hardness than Ni and having a micro-sized particle diameter. A plurality of metal particles 5 (aluminum (Al), for example) having a lower hardness than nickel (Ni) and having a micro-sized particle diameter are interposed between a semiconductor chip 3 and a substrate 2 to be bonded to the semiconductor chip 3, and the metal particles 5 are fixedly bonded by the nickel (Ni). Optionally, aluminum (Al) or an aluminum alloy (Al alloy) is used as the metal particles 5, and aluminum (Al) or an aluminum alloy (Al alloy) is used on the surface of the semiconductor chip 3 and/or the surface of the substrate 2.
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公开(公告)号:US20210222536A1
公开(公告)日:2021-07-22
申请号:US17256014
申请日:2018-09-11
Applicant: Japan E&P International Corporation , Waseda University
Inventor: Yuchen LIU , Masanori KURIHARA
Abstract: [Problem] In the production of sand reservoir type methane hydrate, there are problems, such as compaction of reservoir or production of sand in the mine, and the effect of existing methods to counter the production of sand is inadequate.
[Solution] The present invention can prevent the fluidization of sand occurred when methane hydrate is decomposed by injecting a grouting agent capable of adequately adhere sand particles into gaps (pore gaps) within sand particles which are unsolidified or weakly solidified and constitute the reservoir to be developed. In addition, provided is a technique capable of suppressing the production of sand in the mine, contributing to the stable production of gas, by injecting a filling material into the target reservoir around a mine well and thus constructing a porous grouting body having sufficient strength and good permeability. Further, the present invention also performs permeability restoration measures such as hydraulic fracturing or chemical treatment on the reservoir which has been subjected to the abovementioned grouting, thereby achieving both of stabilization of the reservoir and productivity of gas.-
公开(公告)号:US20200277618A1
公开(公告)日:2020-09-03
申请号:US16828146
申请日:2020-03-24
Inventor: Motoki TOMINAGA , Kohji ITO
IPC: C12N15/82
Abstract: A transgenic plant which exhibits a growth capacity which is enhanced compared to that of a host plant, and has a chimeric protein of a peptide containing an amino acid sequence derived from a motor domain of myosin XI of a donor plant 1, which is a plant species other than the host plant, and a peptide containing an amino acid sequence derived from a domain other than the motor domain of myosin XI of a donor plant 2, which is the host plant or a plant species other than the host plant, the transgenic plant being characterized in that the motor domain loop 2 region has EEPKQGGKGGGKSSFSSIG or EEPKQGGGKGGSKSSFSSIG, and in addition to these sequences, has an amino acid sequence in which one to six amino acids have been deleted, replaced or added.
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公开(公告)号:US10698670B2
公开(公告)日:2020-06-30
申请号:US15856306
申请日:2017-12-28
Applicant: WASEDA UNIVERSITY
Inventor: Hironori Kasahara , Keiji Kimura , Dan Umeda , Hiroki Mikami
IPC: G06F8/41
Abstract: There is provided a parallel program generating method capable of generating a static scheduling enabled parallel program without undermining the possibility of extracting parallelism. The parallel program generating method executed by the parallelization compiling apparatus 100 includes a fusion step (FIG. 2/STEP026) of fusing, as a new task, a task group including a reference task as a task having a conditional branch, and subsequent tasks as tasks control dependent, extended-control dependent, or indirect control dependent on respective of all branch directions of the conditional branch included in the reference task.
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公开(公告)号:US20200009536A1
公开(公告)日:2020-01-09
申请号:US16483843
申请日:2018-02-16
Applicant: WASEDA UNIVERSITY , ZEON CORPORATION
Inventor: Suguru NODA , Risa MAEDA , Akiyoshi SHIBUYA , Takayoshi HONGO
IPC: B01J23/745 , B01J37/02 , B01J37/18 , C01B32/162
Abstract: A manufacturing method for supported catalysts comprising a step A of forming a mixed layer having a catalyst component and a catalyst carrier component on at least a portion of the surface of a support body having a catalytic layer by bringing a mixed solution comprising a catalyst raw material and a catalyst carrier raw material into contact with the support body having a catalytic layer on the surface. Furthermore, such a manufacturing method for supported catalysts preferably comprises a step B in which the catalyst component is made to segregate to a surface of the mixed layer after step A.
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87.
公开(公告)号:US20190267967A1
公开(公告)日:2019-08-29
申请号:US16413356
申请日:2019-05-15
Applicant: Kouhei KURIMOTO , Kazuhito KISHIDA , Rinzo KAYANO , Shoji KAKIO , WASEDA UNIVERSITY
Inventor: Kouhei KURIMOTO , Kazuhito KISHIDA , Rinzo KAYANO , Jun MIZUNO , Shoji KAKIO
Abstract: A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure. After the irradiation, the bonding surface of the quartz substrate and the bonding surface of the piezoelectric substrate are brought into contact. And the quartz substrate and the piezoelectric substrate are pressurized in a thickness direction to bond the bonding surfaces.
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88.
公开(公告)号:US10392329B2
公开(公告)日:2019-08-27
申请号:US14889834
申请日:2014-04-30
Applicant: WASEDA UNIVERSITY , JX NIPPON OIL & ENERGY CORPORATION , MITSUBISHI CHEMICAL CORPORATION , HITACHI ZOSEN CORPORATION , CHIYODA CORPORATION
Inventor: Masahiko Matsukata , Kenichi Kawazuishi , Kenichi Mimura
Abstract: A method and a device for condensing a water-soluble organic matter, which can collect a highly concentrated water-soluble organic matter, save energy, and reduce cost of the device by reducing a membrane area.According to the present invention, the permeability ratio of a vapor-permeation separation membrane disposed at least immediately before a final outlet on a non-permeation side in the separation membrane device is lower than those of the other vapor-permeation separation membranes while a hybrid process combining distillation by the distillation column with membrane separation by the separation membrane devices including a plurality of vapor-permeation separation membranes is used and energy saving performance is maintained. Therefore, a highly concentrated and condensed component of a water-soluble organic matter is obtained. In addition, it is possible to reduce a membrane area of the vapor-permeation separation membranes in the whole separation membrane devices and to provide a technology leading to cost reduction.
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公开(公告)号:US20190229103A1
公开(公告)日:2019-07-25
申请号:US16257722
申请日:2019-01-25
Inventor: Kohei TATSUMI , Kazuhito KAMEI , Rikiya Kamimura , Koji SHIMIZU , Kazutoshi UEDA , Nobuaki SATO , Keiji TODA , Masayuki HIKITA , Akihiro IMAKIIRE
IPC: H01L25/18 , H01L23/367 , H01L23/00 , H05K7/20
Abstract: A semiconductor device includes: a first switching element that is provided on a high side; a first diode element that is connected in parallel to the first switching element; a second switching element that is provide on a low side and connected in series to the first switching element; and a second diode element that is connected in parallel to the second switching element, wherein the first switching element and one of the first diode element and the second diode element are stacked adjacently to each other in a vertical direction of respective electrode surfaces thereof via a conductive electrode, the second switching element and the other of the first diode element and the second diode element that is different from the diode element adjacent to the first switching element are stacked adjacently to each other in a vertical direction of respective electrode surfaces thereof via a conductive electrode, and the first switching element and the second switching element are not adjacent in a vertical direction of respective electrode surfaces thereof.
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公开(公告)号:US10356896B2
公开(公告)日:2019-07-16
申请号:US15241871
申请日:2016-08-19
Applicant: WASEDA UNIVERSITY
Inventor: Eiji Iwase , Tomoya Koshi
Abstract: A self-healing wire includes, an electric wire arranged on a substrate, and a hybrid structure in which the electric wire is covered with at least one fluid selected from the group consisting of a fluid having conductive particles dispersed therein and a fluid having metal ions dissolved therein, formed on a healing portion for a crack to be generated in the electric wire. And a stretchable device includes the self-healing wire formed on a stretchable base material and an electric element mounted only on a base material higher in rigidity than the stretchable base material. Even when a crack is generated in the electric wire due to stretching of the substrate having flexibility, the crack is bridged by the conductive particles or a solid metal deposited from the metal ions in the fluid. Thus the self-healing wire and the stretchable device having both high conductivity and high stretchability are provided.
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