公开(公告)号：US20080036049A1

公开(公告)日：2008-02-14

申请号：US11696750

申请日：2007-04-05

Applicant: Jae-Hyuck Lee ,  Young-Min Lee ,  Shin-Hee Cho ,  Jae-Young Huh ,  Ji-Hyun Jung

Inventor： Jae-Hyuck Lee ,  Young-Min Lee ,  Shin-Hee Cho ,  Jae-Young Huh ,  Ji-Hyun Jung

IPC: H01L23/552 ,  H01L21/60

CPC classification number: H01L25/16 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/32145 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/021 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/183 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Disclosed is a stacked integration module having a small thickness while guaranteeing thermal and operational stabilities when operated at high frequencies. The stacked integration module includes a printed circuit board having first and second surfaces facing each other, at least one hole extending through the first and second surfaces, and a recess formed on the second surface; and a metallic member having an upper surface, the second surface of the printed circuit board being seated on the upper surface while making contact with the upper surface. The stacked integration module is simpler than conventional modules in terms of structure and process. The metallic member, which is made of a plate-shaped material having a larger area than conventional heat-radiation means, is advantageous for cooling and electromagnetic wave shielding.

Abstract translation: 公开了一种具有小厚度的堆叠集成模块，同时在高频率操作时保证热稳定性和操作稳定性。 堆叠集成模块包括具有彼此面对的第一和第二表面的印刷电路板，延伸穿过第一和第二表面的至少一个孔和形成在第二表面上的凹部; 以及具有上表面的金属构件，印刷电路板的第二表面位于上表面上，同时与上表面接触。 在结构和过程方面，堆叠集成模块比传统模块简单。 由具有比常规散热装置更大面积的板状材料制成的金属构件对于冷却和电磁波屏蔽是有利的。

公开(公告)号：US20080012112A1

公开(公告)日：2008-01-17

申请号：US11752790

申请日：2007-05-23

Applicant: Young-Min LEE

Inventor： Young-Min LEE

IPC: H01L23/02

CPC classification number: H01L23/3128 ,  H01L23/13 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are a semiconductor package having an advantage for stacking and a stack-type semiconductor package using the semiconductor package. In one embodiment, the semiconductor package includes a wing-type substrate comprising a first surface, a second surface opposite the first surface, a chip pad area, an external terminal area on the first surface and a stack-type terminal pad on the second surface, wherein the chip pad area is lower than the external terminal area; a semiconductor chip mounted on the wing-type substrate within the chip pad area, wherein the semiconductor chip is electrically connected to the wing-type substrate; a sealing part on the wing-type substrate, the sealing part sealing the semiconductor chip and the wing-type substrate; and a conductive connecting member on the external terminal area, wherein a height of the conductive connecting member is greater than a height of the wing-type substrate.

Abstract translation: 提供了具有堆叠优点的半导体封装和使用半导体封装的堆叠型半导体封装。 在一个实施例中，半导体封装包括翼型衬底，其包括第一表面，与第一表面相对的第二表面，芯片焊盘区域，第一表面上的外部端子区域和第二表面上的堆叠型端子焊盘 ，其中所述芯片焊盘区域低于所述外部端子区域; 安装在所述芯片焊盘区域内的所述翼型基板上的半导体芯片，其中所述半导体芯片电连接到所述翼型基板; 翼型基板上的密封部，密封半导体芯片和翼型基板的密封部; 以及在所述外部端子区域上的导电连接构件，其中所述导电连接构件的高度大于所述机翼型衬底的高度。

公开(公告)号：US20070227680A1

公开(公告)日：2007-10-04

申请号：US11565875

申请日：2006-12-01

Applicant: Chul hwan Kim ,  Young min Lee ,  Dae bin Song

Inventor： Chul hwan Kim ,  Young min Lee ,  Dae bin Song

IPC: D21J3/00 ,  B31F7/00

CPC classification number: D21J3/00 ,  B31D5/02 ,  B31D2205/0017 ,  B65D81/025 ,  B65D81/133 ,  D21J7/00 ,  Y02W90/11

Abstract: A method for manufacturing shock absorbing materials using wastepaper using vacuum forming principle and wastepaper shock absorbing materials using the method are disclosed, wherein the method comprises: disintegrating wastepaper selected from at least one or more of Korea Old Corrugated Container (KOCC), Korea Old Newspaper (KONP) and milk carton, using a blender; diluting the disintegrated wastepaper to manufacture pulp suspension; mixing the pulp suspension with cationic starch; vacuum-dehydrating the pulp cationic starch mixed with the pulp suspension to a dual direction using a vacuum forming capable of dual vacuuming to manufacture a shock absorbing material; drying the shock absorbing material; and performing a surface sizing process on a surface of the dried shock absorbing material, such that a shock absorbing material having a remarkably low elastic modulus and density can be effectively manufactured without recourse to the conventional press performed by a press plate.

Abstract translation: 公开了使用该方法使用真空成形原理的废纸和使用该方法的废纸冲击吸收材料制造减震材料的方法，其中所述方法包括：从韩国老瓦楞纸箱（KOCC），韩国旧报纸中选择至少一种或多种废纸， （KONP）和牛奶纸箱，使用搅拌机; 稀释废纸废纸以制造纸浆悬浮液; 将纸浆悬浮液与阳离子淀粉混合; 使用能够进行双重抽真空的真空成形将纸浆悬浮液混合的纸浆阳离子淀粉真空脱水至双重方向，以制造减震材料; 干燥减震材料; 并且在干燥的吸震材料的表面上进行表面施胶处理，使得可以有效地制造具有非常低的弹性模量和密度的减震材料，而不用追求由压板执行的常规压机。

公开(公告)号：US07245644B2

公开(公告)日：2007-07-17

申请号：US10716653

申请日：2003-11-19

Applicant: Byung-Kwon Kang ,  Shi-Yun Cho ,  In Kim ,  Do-Young Rhee ,  Tae-Il Kim ,  Dong-Hoon Jang ,  Seung-Won Lee ,  Duk-Ho Jeon ,  June-Hyeon Ahn ,  Young-Min Lee ,  Jong-Ryeol Kim

Inventor： Byung-Kwon Kang ,  Shi-Yun Cho ,  In Kim ,  Do-Young Rhee ,  Tae-Il Kim ,  Dong-Hoon Jang ,  Seung-Won Lee ,  Duk-Ho Jeon ,  June-Hyeon Ahn ,  Young-Min Lee ,  Jong-Ryeol Kim

IPC: H01S5/00

CPC classification number: H01S5/026 ,  H01S5/0265

Abstract: A semiconductor monolithic integrated optical transmitter including a plurality of active layers formed on a semiconductor substrate is disclosed, which comprises: a distributed feedback laser diode including a grating for reflecting light with a predetermined wavelength and a first active layer for oscillating received light from the grating; an electro-absorption modulator including a second active layer for receiving light from the first active layer, wherein the received light intensity is modulated through a change of absorbency in accordance with an applied voltage; an optical amplifier including a third active layer for amplifying received light from the second active layer; a first optical attenuator between the first active layer and the second active layer; and a second optical attenuator between the second active layer and the third active layer.

Abstract translation: 公开了一种包括形成在半导体衬底上的多个有源层的半导体单片集成光发射器，其包括：分布反馈激光二极管，包括用于反射具有预定波长的光的光栅和用于振荡来自光栅的接收光的第一有源层 ; 一种电吸收调制器，包括用于接收来自第一有源层的光的第二有源层，其中根据施加的电压通过吸收变化改变接收的光强度; 光放大器，包括用于放大来自第二有源层的接收光的第三有源层; 第一有源层和第二有源层之间的第一光衰减器; 以及在第二有源层和第三有源层之间的第二光衰减器。

公开(公告)号：US07228857B2

公开(公告)日：2007-06-12

申请号：US10883732

申请日：2004-07-06

Applicant: Wan Soo Kim ,  Yang Kyeong Kim ,  Jong Sik Kim ,  Young Min Lee

Inventor： Wan Soo Kim ,  Yang Kyeong Kim ,  Jong Sik Kim ,  Young Min Lee

IPC: F23M7/04 ,  F24C15/04

CPC classification number: F24C15/006 ,  F24C15/04

Abstract: An electric oven with a door cooling structure includes a cavity formed in the case to provide a high temperature environment, a door for selectively opening and closing the cavity, inner, intermediate and outer panels provided in the door; an airflow shielding panel for blocking a space formed below the intermediate panel to guide introduced air upward; a door cover for blocking a top of the door, which is defined between the inner and outer panels, and a fan for applying negative pressure to gaps defined between the inner, intermediate and outer panels so that the panels can be cooled by the air flowing upward and downward in the gaps.

Abstract translation: 具有门冷却结构的电烤箱包括形成在壳体中以提供高温环境的空腔，用于选择性地打开和关闭空腔的门，设置在门中的内部，中间和外部面板; 用于阻挡形成在中间板下方的空间以将引入空气向上引导的气流屏蔽板; 限定在内板和外板之间的门的顶部的门盖以及用于向限定在内板，中间板和外板之间的间隙施加负压的风扇，使得板可以被空气流动 上下差距。

公开(公告)号：US20060234965A1

公开(公告)日：2006-10-19

申请号：US10529169

申请日：2003-10-09

Applicant: Young-Min Lee ,  Sang-Im Yun ,  Seung Lee

Inventor： Young-Min Lee ,  Sang-Im Yun ,  Seung Lee

IPC: A61K48/00 ,  C12Q1/70 ,  C07H21/04 ,  C12N7/00 ,  C07K14/18

CPC classification number: C12N7/00 ,  A61K39/00 ,  A61K48/00 ,  A61K2039/5256 ,  C07K14/005 ,  C12N15/86 ,  C12N2770/24121 ,  C12N2770/24122 ,  C12N2800/204 ,  C12N2840/20 ,  C12N2840/203 ,  Y02A50/39

Abstract: The present invention relates to a novel genomic RNA of Japanese encephalitis virus (JEV) and an infectious JEV cDNA therefrom. Particularly, the present invention relates to a full-length genomic RNA of JEV represented by SEQ. ID. No 15 and an infectious JEV cDNA therefrom. JEV genomic RNA and infectious JEV cDNA of the present invention can be used not only for the identification of the JEV genes, but also for the molecular biological studies including JEV replication, transcription, and translation. Moreover, they can also be applied to the development of the therapeutic agents, vaccines, diagnostic reagents, and diagnostic devices for Japanese encephalitis, and can be used as an expression vector for the various foreign genes.

Abstract translation: 本发明涉及日本脑炎病毒（JEV）的新型基因组RNA及其感染性JEV cDNA。 特别地，本发明涉及由SEQ ID NO：1所示的JEV的全长基因组RNA。 ID。 15号和来自其的感染性JEV cDNA。 本发明的JEV基因组RNA和感染性JEV cDNA不仅可用于鉴定JEV基因，而且可用于包括JEV复制，转录和翻译在内的分子生物学研究。 此外，它们还可以用于日本脑炎的治疗剂，疫苗，诊断试剂和诊断装置的开发，并且可以用作各种外来基因的表达载体。

公开(公告)号：US20060050486A1

公开(公告)日：2006-03-09

申请号：US11213702

申请日：2005-08-30

Applicant: Young-min Lee ,  Kun-dae Yeom

Inventor： Young-min Lee ,  Kun-dae Yeom

IPC: H05K7/20

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package may include a stack of unit chip packages, and each unit chip package may include a printed circuit board. The printed circuit board may support a semiconductor chip and a connection terminal for connecting to an adjacent unit chip package within the stack. A dummy package substrate may be disposed on the semiconductor chip of the uppermost unit chip package for protecting the semiconductor chip of the uppermost unit chip package. A method of fabricating a package may involve stacking unit chip packages so that the printed circuit board of a lower unit chip package abuts against a solder bump of an upper unit chip package, and stacking a dummy package substrate on the printed circuit board of an uppermost unit chip package.

公开(公告)号：US06812442B2

公开(公告)日：2004-11-02

申请号：US10414232

申请日：2003-04-16

Applicant: Eung-Soo Kim ,  Yang-Kyeong Kim ,  Young-Min Lee

Inventor： Eung-Soo Kim ,  Yang-Kyeong Kim ,  Young-Min Lee

IPC: H05B676

CPC classification number: H05B6/763

Abstract: A door of a microwave oven comprising: a door panel which is installed on a front surface of a casing having a cavity corresponding to a cooking space of food to be opened and closed; a door frame which is combined with the door panel to be located at a front of the cavity; a choke cover which is inserted in the door frame, for covering a choke seal; and a frame subsidiary plate which is positioned to opposed to the choke cover and is combined with the door frame to remove a gap formed between the choke cover and a lateral surface of the door frame.

Abstract translation: 一种微波炉的门，包括：门板，其安装在壳体的前表面上，所述壳体具有与要打开和关闭的食物的烹饪空间相对应的空腔; 门框，其与门板组合以定位在空腔的前部; 扼流圈，其插入门框中，用于覆盖扼流圈; 以及框架辅助板，其定位成与阻风门盖相对并且与门框架组合以去除形成在阻风门盖和门框架的侧表面之间的间隙。

公开(公告)号：US06381838B1

公开(公告)日：2002-05-07

申请号：US09115826

申请日：1998-07-15

Applicant: Eun Chul Ahn ,  Woong Ky Ha ,  Young Min Lee

Inventor： Eun Chul Ahn ,  Woong Ky Ha ,  Young Min Lee

IPC: H01K322

CPC classification number: H01L21/486 ,  H01L23/055 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0201 ,  H05K1/0206 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/3484 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2203/041 ,  Y10T29/49144 ,  Y10T29/49158 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A BGA package includes a semiconductor chip, and a PCB having a board body, a plurality of circuit patterns, a plurality of signal via holes, a solder resist, and a plurality of thermal emissive vias. The thermal emissive vias are holes located beneath a chip attach area, and these holes are filled with metal having a low melting point. The metal prevents moisture from being absorbed, while effectively transferring heat. The semiconductor chip is attached to the chip attach area of the PCB and is connected to circuit patterns of the PCB with bonding wires. The bonding wires and the semiconductor chip are encapsulated to protect them from external environmental stress. Solder bumps are formed on circuit patterns of the PCB. The BGA package has advantages in that it prevents moisture from penetrating to the chip through the thermal emissive vias, and effectively transfers the heat generated by the chip to the outside.

Abstract translation: BGA封装包括半导体芯片和具有板体，多个电路图案，多个信号通孔，阻焊剂和多个热发射通孔的PCB。 热发射通孔是位于芯片连接区域下方的孔，并且这些孔用低熔点的金属填充。 金属防止水分被吸收，同时有效地传递热量。 半导体芯片连接到PCB的芯片连接区域，并通过接合线连接到PCB的电路图案。 接合线和半导体芯片被封装以保护它们免受外部环境压力。 在PCB的电路图形上形成焊点。 BGA封装具有通过热发射通孔防止湿气渗透到芯片的优点，并且有效地将由芯片产生的热量传递到外部。

公开(公告)号：US5432548A

公开(公告)日：1995-07-11

申请号：US018411

申请日：1993-02-17

Applicant: Sang-Du Byen ,  Young-Min Lee ,  Do-Young Kim

Inventor： Sang-Du Byen ,  Young-Min Lee ,  Do-Young Kim

IPC: G01R31/00 ,  G01R31/28 ,  H04N7/18 ,  H04N17/00 ,  H04N17/04

CPC classification number: H04N17/00 ,  H04N7/18 ,  G01R31/2825

Abstract: An apparatus for testing and adjusting audio/video signal waveforms in a color television, comprising a computer unit, a program logic controller, a measurement device, first and second interface units, a printed wiring board remote controller, an adjustment motor driving circuit, adjustment motors, an adjustment motor select circuit and an adjustment motor moving circuit. Therefore, according to the invention, the waveform test and adjustment for the printed wiring board are performed by the present apparatus, resulting in reduction in an inferiority rate and a labor cost in manufacturing the goods.

Abstract translation: 一种用于测试和调整彩色电视中的音频/视频信号波形的装置，包括计算机单元，程序逻辑控制器，测量装置，第一和第二接口单元，印刷线路板遥控器，调节马达驱动电路，调整 电动机，调节电动机选择电路和调节电动机移动电路。 因此，根据本发明，通过本装置进行印刷电路板的波形测试和调整，导致制造商品时的劣化率和劳动力成本降低。