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    BOARD MODULE AND ELECTRICAL JUNCTION BOX
    1.
    发明公开
    BOARD MODULE AND ELECTRICAL JUNCTION BOX 审中-公开

    公开(公告)号：US20240339773A1

    公开(公告)日：2024-10-10

    申请号：US18575957

    申请日：2022-06-29

    Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

    Inventor： Shun TAKAMIZAWA

    IPC: H01R12/71 ,  H02G3/08 ,  H05K1/02 ,  H05K1/14

    CPC classification number: H01R12/712 ,  H05K1/0201 ,  H05K1/144 ,  H02G3/081 ,  H05K2201/042

    Abstract: An object is to improve heat dissipation performance while reducing a distance between boards when circuits on the boards are electrically connected to each other. The board module includes a first board including a first circuit, and a first connector provided on the first board, and the first connector is connected to a second connector, a through hole is formed in the first board, the first connector includes a connector housing disposed in the through hole and a first terminal, the first terminal includes a first board-side end portion connected to the first circuit, a first terminal portion held by the connector housing, and a heat dissipation portion provided between a first board-side end portion and the first terminal portion and exposed as seen from the opposite side to the second connector with respect to the connector housing.

    Thermal management systems having signal transfer routing for use with electronic devices
    2.
    发明授权
    Thermal management systems having signal transfer routing for use with electronic devices 有权

    公开(公告)号：US12082332B2

    公开(公告)日：2024-09-03

    申请号：US17131166

    申请日：2020-12-22

    Applicant: Intel Corporation

    Inventor： Juha Paavola ,  Sami Heinisuo ,  Kari Mansukoski

    IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

    CPC classification number: H05K1/0201 ,  H05K7/20163 ,  H05K7/2039 ,  G06F1/203

    Abstract: thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.

    Circuit board, semiconductor device, power converter, and moving object
    3.
    发明授权
    Circuit board, semiconductor device, power converter, and moving object 有权

    公开(公告)号：US12075556B2

    公开(公告)日：2024-08-27

    申请号：US17290461

    申请日：2019-02-25

    Applicant: Mitsubishi Electric Corporation

    Inventor： Yuta Fukushima

    IPC: H05K1/00 ,  H05K1/02

    CPC classification number: H05K1/0201 ,  H05K1/0269

    Abstract: The first and second electronic components are mounted on a printed circuit board. A temperature indicating resin comes in contact with not the second electronic component but the first electronic component. The temperature indicating resin visually changes upon increase in the temperature. Alternatively, an electronic component is mounted on the printed circuit board. The temperature indicating resin comes in contact with not the electronic component but the printed circuit board. The temperature indicating resin visually changes upon increase in the temperature.

    Ceramic carrier substrate and power module
    6.
    发明授权
    Ceramic carrier substrate and power module 有权

    公开(公告)号：US12028974B2

    公开(公告)日：2024-07-02

    申请号：US17789124

    申请日：2021-02-04

    Applicant: Robert Bosch GmbH

    Inventor： Peter Tauber ,  Josef Weber ,  Ralf Winkler

    IPC: H05K1/03 ,  H05K1/02 ,  H05K3/46

    CPC classification number: H05K1/0306 ,  H05K1/0201 ,  H05K1/0265 ,  H05K3/4667 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/066

    Abstract: A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.

    FLEXIBLE INTERCONNECT CIRCUITS FOR BATTERY PACKS
    7.
    发明公开
    FLEXIBLE INTERCONNECT CIRCUITS FOR BATTERY PACKS 审中-公开

    公开(公告)号：US20240215173A1

    公开(公告)日：2024-06-27

    申请号：US18595910

    申请日：2024-03-05

    Applicant: CelLink Corporation

    Inventor： Jean-Paul Ortiz ,  Malcolm Parker Brown ,  Casey Anderson ,  Will Findlay ,  Gabrielle Tate ,  Shawn D'Gama ,  Arturo Cantu-Chavez

    IPC: H05K3/46 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K3/46 ,  H05K1/0201 ,  H05K1/118 ,  H05K2201/10037

    Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.

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