公开(公告)号：US08240022B2

公开(公告)日：2012-08-14

申请号：US11831987

申请日：2007-08-01

Applicant: David Finn

Inventor： David Finn

IPC: H01R4/00

CPC classification number: H01Q1/2225 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01Q1/38 ,  H01Q7/00 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/49128 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076

Abstract: Method of connecting an antenna wire to a transponder chip. A transponder chip or chip module in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions spanning the recess. The end portions are spaced wider than the chip, to allow the chip to be inserted (installed) into the recess from the same side as the antenna past the end portions of the antenna wire. The chip may be moved in the recess so that its terminals are under the wires, or the wires may be repositioned to be over the terminals, for subsequently bonding thereto. Prior to installing the chip in the recess, insulation may be removed from the end portions of the antenna wire, which may also be flattened to improve bonding.

Abstract translation: 将天线连接到应答器芯片的方法。 在基板的凹部中的应答器芯片或芯片模块，以及安装在基板的表面上且具有跨越凹部的端部的天线。 端部的间隔比芯片宽，以使芯片从天线穿过天线的端部的同一侧被插入（安装）到凹槽中。 芯片可以在凹部中移动，使得其端子在导线下方，或者导线可以重新定位在端子上，以便随后结合到其上。 在将芯片安装在凹槽中之前，可以从天线线的端部去除绝缘体，其也可以被平坦化以改善结合。

公开(公告)号：US20120055013A1

公开(公告)日：2012-03-08

申请号：US13294578

申请日：2011-11-11

Applicant: David Finn

Inventor： David Finn

IPC: H01P11/00

CPC classification number: H01Q1/2225 ,  H01Q7/00 ,  H05K3/0032 ,  H05K3/103 ,  H05K3/321 ,  H05K3/3431 ,  H05K2201/09036 ,  H05K2201/10098 ,  Y10T29/49016

Abstract: Microstructures such as connection areas, contact pads, antennas, coils, plates for capacitors and the like may be formed using nanostructures such as nanoparticles, nanowires and nanotubes. A laser may be used to assist in the process of microstructure formation, and may also be used to form other features on a substrate such as recesses or channels for receiving the microstructures. A smart mobile phone sticker (MPS) mounted to a cell phone with a self-sticking shielding element comprising a core layer having ferrite particles.

Abstract translation: 可以使用诸如纳米颗粒，纳米线和纳米管的纳米结构来形成诸如连接区域，接触焊盘，天线，线圈，电容器板等的微结构。 可以使用激光来辅助微结构形成的过程，并且还可以用于在诸如用于接收微结构的凹部或沟道的基底上形成其它特征。 一种安装在具有自粘屏蔽元件的手机上的智能手机贴纸（MPS），包括具有铁氧体颗粒的芯层。

公开(公告)号：US20120040128A1

公开(公告)日：2012-02-16

申请号：US13224351

申请日：2011-09-02

Applicant: David Finn

Inventor： David Finn

IPC: B32B3/24 ,  H05K13/04 ,  B32B5/02 ,  H01P11/00

CPC classification number: G06K19/07783 ,  G06K19/07722 ,  G06K19/07752 ,  G06K19/07779 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01Q1/2208 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/5313 ,  Y10T428/1476 ,  Y10T428/23986 ,  H01L2924/00 ,  H01L2924/01033

Abstract: Forming antenna structures having turns of wire, foil or conductive material on a an antenna substrate or in a layer of adhesive layer on a carrier substrate, transferring the antenna structures individually or many at once to corresponding transponder sites on an inlay substrate and connecting the aligned termination ends of the antenna structures to terminal areas of RFID chip modules at the transponder sites. Transferring may be performed by various means such as laminating (heat and pressure), or heating the antenna structures directly or indirectly. The antenna substrate may be in web format or sheet format. Automated manufacturing procedures are disclosed. Kits having components for manufacturing inlay substrates, inlays and secure documents are disclosed. Various features of an inlay substrate and chip module are disclosed.

Abstract translation: 形成天线结构，其在天线基板上或载体基板上的粘合剂层中具有线，箔或导电材料的转动，将天线结构单独或多次转移到嵌入式基板上的对应的应答器位置，并将对准 将天线结构的终端端接到转发器站点处的RFID芯片模块的终端区域。 可以通过诸如层压（热和压力）或直接或间接加热天线结构的各种手段来进行转移。 天线基板可以是网格格式或纸张格式。 公开了自动化制造程序。 公开了具有用于制造镶嵌衬底，嵌体和安全文件的部件的套件。 公开了嵌入式衬底和芯片模块的各种特征。

公开(公告)号：US20120038445A1

公开(公告)日：2012-02-16

申请号：US13205600

申请日：2011-08-08

Applicant: David Finn

Inventor： David Finn

IPC: H01F38/14

CPC classification number: G06K19/07794 ,  G06K19/07783 ,  H01F38/14 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  Y10T29/49018

Abstract: A transponder with an antenna module having a chip module and an antenna; a booster antenna having a first antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end, and a second antenna structure in the form of a flat coil having a number of turns, an outer end and an inner end; the inner end of the second antenna structure connected with the outer end of the first antenna structure. The antenna module may be positioned so that its antenna overlaps one of the first antenna structure or the second antenna structure. An antenna module having two additional antenna structures is disclosed. Methods of enhancing coupling are disclosed.

Abstract translation: 一种具有天线模块的转发器，具有芯片模块和天线; 一种具有第一天线结构的增强天线，该第一天线结构具有多个匝数的扁平线圈，一个外端和一个内端，以及一个具有多个匝数的扁平线圈形式的第二天线结构，外端 和内端; 第二天线结构的内端与第一天线结构的外端连接。 天线模块可以被定位成使得其天线与第一天线结构或第二天线结构之一重叠。 公开了一种具有两个附加天线结构的天线模块。 公开了增强耦合的方法。

公开(公告)号：US07971339B2

公开(公告)日：2011-07-05

申请号：US11860162

申请日：2007-09-24

Applicant: David Finn

Inventor： David Finn

IPC: H01P11/00

CPC classification number: H01L23/49855 ,  G06K19/07749 ,  G06K19/0775 ,  H01F41/041 ,  H01F41/064 ,  H01L23/48 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/6677 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/4809 ,  H01L2224/4813 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/2076 ,  H01L2924/30107 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49071 ,  Y10T29/49117 ,  Y10T29/49128 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas.

Abstract translation: 提供了一种用于制造射频（RF）嵌体的方法和装置。 RF嵌体包括集成电路和固定到承载集成电路的基板材料的天线。 在处理期间，形成天线的线的部分位于与集成电路相邻而不是直接位于集成电路上。 在随后的处理步骤中，将导线端部放置成与集成电路端子区域接触并固定到集成电路端子区域。

公开(公告)号：US20110023289A1

公开(公告)日：2011-02-03

申请号：US12877085

申请日：2010-09-07

Applicant: David Finn

Inventor： David Finn

IPC: H01Q17/00 ,  H01R43/00 ,  B23P19/00

CPC classification number: G06K19/07783 ,  G06K19/07722 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/78301 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49167 ,  Y10T29/49174 ,  Y10T29/5313 ,  Y10T29/532 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for nicking the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.

Abstract translation: 在安装到嵌入式基板期间，天线的至少一个端部（包括端部）直接定位在芯片模块的端子上，用于随后连接到芯片模块。 公开了一种超声波发生器，其具有用于切割线的毛细管上方的切割器。 天线可以包括两个单独的短截线，每个短截线具有位于芯片模块的端子上的端部（包括端部）。 公开了用于安装天线线的附加技术。

公开(公告)号：US20090229109A1

公开(公告)日：2009-09-17

申请号：US12430085

申请日：2009-04-26

Applicant: David Finn

Inventor： David Finn

IPC: H01P11/00 ,  H01Q1/22

CPC classification number: H05K3/103 ,  G06K19/07327 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07781 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/78 ,  H01L2224/78313 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01063 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q1/2225 ,  H05K2201/10287 ,  H05K2203/0285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49073 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49174 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076

Abstract: Forming an inlay comprising an antenna wire having two end portions and a site for a transponder chip, comprises: mounting the wire to a surface of substrate; and leaving the end portions of the antenna wire free-standing, as loops adjacent terminal areas of a site on the substrate for the transponder chip. With the transponder chip installed on the substrate, the free-standing loops are repositioned to be substantially directly over the terminals of the transponder chip, in preparation for interconnection of the loops to the terminals of the transponder chip, then are bonded to the terminals. An embedding tool for mounting the wire on the substrate may embed the wire in or adhesively place a self-bonding wire on a surface of the substrate. The substrate may have two transponder chips, and function as a secure inlay. An anti-skimming feature is included in the inlay.

Abstract translation: 形成包括具有两个端部的天线线和用于应答器芯片的位置的嵌体，包括：将线安装到衬底的表面; 并且使天线的端部自由站立，作为用于应答器芯片的衬底上的位置的终端区域的环路。 通过将转发器芯片安装在基板上，独立环路重新定位成基本上直接位于应答器芯片的端子上，以准备将环路连接到应答器芯片的端子，然后结合到端子上。 用于将导线安装在基板上的嵌入工具可以将线嵌入或粘合地将自粘接线放置在基板的表面上。 基板可以具有两个应答器芯片，并且用作安全嵌入。 镶嵌中包含防滑功能。

公开(公告)号：US20080150817A1

公开(公告)日：2008-06-26

申请号：US11860210

申请日：2007-09-24

Applicant: Lionel Carre ,  David Finn ,  Viroel-Marian Hasegan ,  Ulrich Lang

Inventor： Lionel Carre ,  David Finn ,  Viroel-Marian Hasegan ,  Ulrich Lang

IPC: H01Q11/12

CPC classification number: H01Q1/38 ,  H01L2924/14 ,  H01Q7/00 ,  H01Q9/27 ,  Y10T29/49018 ,  Y10T29/49169

Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit such that the wire may be subject to further processing, such as removing insulation without potentially damaging the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. Methods of the invention include forming loops with the wire ends wherein the loops extend above a plane of the substrate, and in another processing step, the loops are displaced to be electrically connected to the terminal areas. Methods also include repositioning the wire and using a brush or comb device.

Abstract translation: 提供了一种用于制造射频（RF）嵌体的方法和装置。 RF嵌体包括集成电路和固定到承载集成电路的基板材料的天线。 在处理期间，形成天线的线的部分位于集成电路附近而不是直接位于集成电路上，使得电线可以进行进一步的处理，例如去除绝缘而不会潜在地损坏集成电路。 在随后的处理步骤中，将导线端部放置成与集成电路端子区域接触并固定到集成电路端子区域。 本发明的方法包括形成具有线端的环，其中环在衬底的平面上延伸，并且在另一处理步骤中，环被移位以电连接到终端区。 方法还包括重新定位导线并使用刷子或梳子装置。

公开(公告)号：US06310778B1

公开(公告)日：2001-10-30

申请号：US09043531

申请日：1998-03-18

Applicant: David Finn ,  Manfred Rietzler

Inventor： David Finn ,  Manfred Rietzler

IPC: H05K114

CPC classification number: G06K19/07747 ,  G06K19/07743 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07775 ,  G06K19/07779 ,  G06K19/07781 ,  H01L2224/48091 ,  H01L2924/01057 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An IC card module (20) for producing an IC card (118) having at least one coil (46) and at least one chip (23) for the formation of a transponder unit, with the chip and the coil being connected together by way of a module carrier (21) which renders possible not only an electrically conductive connection between the chip and the coil, but also an electrically conductive connection with an external contact face (38) of the module carrier and the chip, wherein the IC card module (20) has a retaining device (41) which is at a distance from the external contact face (38) by an offset R and projects laterally beyond the external contact face, and also a method for producing an IC card with use of such an IC card module.

Abstract translation: 一种用于制造具有至少一个线圈（46）和至少一个用于形成应答器单元的芯片（23）的IC卡（118）的IC卡模块（20），芯片和线圈通过连接在一起 的模块载体（21），其不仅可以使芯片和线圈之间的导电连接成为可能，而且还可以与模块载体和芯片的外部接触面（38）的导电连接，其中IC卡模块 （20）具有保持装置（41），所述保持装置（41）通过偏移R与所述外部接触面（38）隔开一定距离，并且侧向突出超出所述外部接触面，并且还具有使用这样的方式制造IC卡的方法 IC卡模块。

公开(公告)号：US6067235A

公开(公告)日：2000-05-23

申请号：US913751

申请日：1997-09-22

Applicant: David Finn ,  Manfred Rietzler

Inventor： David Finn ,  Manfred Rietzler

IPC: G01V3/00 ,  G01V15/00 ,  G06K19/07 ,  G06K19/077 ,  H04B1/59 ,  A61B5/07

CPC classification number: G01V15/00 ,  Y10T29/49018 ,  Y10T29/49071

Abstract: A process and a device for the production of a transponder unit (11) comprising a coil (13) and at least one electronic component (23, 24), such as a chip or the like, wherein the component (23, 24) is connected to the coil (13) directly or via a substrate (14), with a plurality of process phases in which the equipping of a winding tool (40) with a substrate (14), winding of the coil (13) in the winding tool (40), and connection of winding wire ends (21, 22) of the coil (13) to terminal surfaces (17, 18) of the substrate in the winding tool (40) take place in such manner that the winding tool (40) serves as operating platform in all of the aforementioned process phases.

Abstract translation: PCT No.PCT / DE96 / 00400 Sec。 371日期：1997年9月22日 102（e）1997年9月22日PCT PCT 1996年3月7日PCT公布。 公开号WO96 / 29618 PCT 日期1996年9月26日一种用于生产应变器单元（11）的方法和装置，包括线圈（13）和至少一个电子部件（23,24），例如芯片等，其中部件 23，24）直接地或经由衬底（14）连接到线圈（13），其中多个处理阶段，其中卷绕工具（40）与衬底（14）的装配，线圈的绕组 在卷绕工具（40）中，将线圈（13）的绕组线端部（21,22）与绕组工具（40）中的基板的端子表面（17,18）的连接以这种方式进行 卷绕工具（40）用作所有上述处理阶段中的操作平台。