公开(公告)号：US06001671A

公开(公告)日：1999-12-14

申请号：US634464

申请日：1996-04-18

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: D21F1/06 ,  D21G9/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L25/18

CPC classification number: H01L21/568 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/49 ,  H01L24/97 ,  H01L25/18 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3011

Abstract: A method of manufacturing a semiconductor chip package. A sacrificial layer is used as a base to selectively form an array of conductive pads such that a central region is defined by the pads. A back surface of a semiconductor chip is next attached to the sacrificial layer within the central region between the pads so that the contact bearing surface of the chip faces away from the sacrificial layer. The chip contacts are then electrically connected to respective pads, typically by wire bonding a wire therebetween. A curable, dielectric liquid encapsulant is then deposited on the sacrificial layer such that the pads, electrical connections and chip are fully encapsulated, as by an overmolding operation. The encapsulant is then cured and the sacrificial layer is either completely removed or is selectively removed to expose a surface of the pads for electrical attachment to a PWB and the back surface of the chip for creating a direct thermal path from the chip to the PWB.

Abstract translation: 一种制造半导体芯片封装的方法。 牺牲层用作基底以选择性地形成导电焊盘的阵列，使得中心区域由焊盘限定。 接下来，半导体芯片的背面附着在焊盘之间的中心区域内的牺牲层，使得芯片的接触支承表面背离牺牲层。 芯片触点然后电连接到相应的焊盘，通常通过在其间引线接合线。 然后将可固化的介电液体密封剂沉积在牺牲层上，使得焊盘，电连接和芯片被完全封装，如通过包覆成型操作。 然后将密封剂固化并且牺牲层被完全去除或者被选择性地去除以暴露焊盘的表面以电连接到PWB和芯片的后表面，以形成从芯片到PWB的直接热路径。

公开(公告)号：US5983492A

公开(公告)日：1999-11-16

申请号：US999758

申请日：1997-11-26

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H05K3/40 ,  H01R9/00

CPC classification number: H05K3/4092 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  Y10T29/49117 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A connector for microelectronic elements includes electrically conductive, elongated leads having contact portions underlying a compliant layer. The contact portion of each lead overlies a pedestal portion of the compliant layer. The pedestal portion is at least partially isolated from the remaining portion of the compliant layer by gaps in the compliant layer. The pedestals may thus deflect horizontally, compensating for relative movement between the connector and the microelectronic element. Portions of the leads spanning the gaps may be curved to facilitate deflection. The pedestals may be attached to a substrate having terminals. A terminal end of each lead is then electrically connected to the terminal in the substrate, either through a plated through-hole, or by bending downward and bonding. The pedestals may support a plurality of leads along their length. Alternatively, the pedestals may support only a single respective lead, in which case the pedestal is isolated from neighboring pedestals and may deflect in a plurality of horizontal directions.

Abstract translation: 用于微电子元件的连接器包括导电的细长导线，其具有位于柔顺层下面的接触部分。 每个引线的接触部分覆盖柔性层的基座部分。 通过顺应层中的间隙，基座部分至少部分地与柔性层的剩余部分隔离。 因此，基座可能水平偏转，补偿连接器和微电子元件之间的相对运动。 跨越间隙的引线的一些部分可以是弯曲的以便于偏转。 基座可以附接到具有端子的基板。 然后，每个引线的末端通过电镀通孔或通过向下弯曲和结合而电连接到衬底中的端子。 基座可以沿其长度支撑多个引线。 或者，基座可以仅支撑单个相应的引线，在这种情况下，基座与相邻的基座隔离并且可以在多个水平方向上偏转。

公开(公告)号：US5980270A

公开(公告)日：1999-11-09

申请号：US753539

申请日：1996-11-26

Applicant: Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

Inventor： Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.

Abstract translation: 制造焊接连接的方法。 带有焊料块的元件被强制地与另一个带有弹性金属接触件的元件接合，使得接触件擦拭焊料块的表面，并使触头变形并且抵靠擦拭表面。 当接触处于其变形状态时，接触和焊料质量达到足以软化焊料的升高的粘合温度，使得接触在其自身弹性的影响下渗透到焊料块中。 触点与焊料中的纯焊料接合，从而即使没有焊剂也可以实现有效的接合。

公开(公告)号：US5834339A

公开(公告)日：1998-11-10

申请号：US610610

申请日：1996-03-07

Applicant: Thomas H. Distefano ,  Joseph Fjelstad

Inventor： Thomas H. Distefano ,  Joseph Fjelstad

IPC: H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/80203 ,  H01L2224/80207 ,  H01L2224/81192 ,  H01L2224/81904 ,  H01L2224/83209 ,  H01L2224/9212 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311

Abstract: A method for the removal of voids and gas bubbles within uncured or partially cured microelectronic component encapsulants and adhesive/chip attach layers. A sealed void or gas bubble within a gap between a microelectronic component and a supporting substrate is substantially eliminated through the application of a uniform pressure (isostatic or hydrostatic) and energy such that a substantially void/bubble free interposer layer is created.

Abstract translation: 在未固化或部分固化的微电子部件密封剂和粘合剂/芯片附着层中去除空隙和气泡的方法。 通过施加均匀的压力（等静压或静水压）和能量使得产生基本上无空隙/无气泡的中间层，基本上消除了微电子部件和支撑基板之间的间隙内的密封的空隙或气泡。

公开(公告)号：US5632631A

公开(公告)日：1997-05-27

申请号：US306205

申请日：1994-09-14

Applicant: Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

Inventor： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC: B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06744 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R3/00 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L24/81 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224

Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

Abstract translation: 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。

公开(公告)号：US5629239A

公开(公告)日：1997-05-13

申请号：US408262

申请日：1995-03-21

Applicant: Thomas H. DiStefano ,  John W. Smith ,  Konstantine Karavakis ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Konstantine Karavakis ,  Joseph Fjelstad

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/498

CPC classification number: H01L24/86 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10T29/49121

Abstract: A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads. The process avoids the need for especially fine etching to form notches in the lateral edges of the leads.

Abstract translation: 一种半导体芯片连接部件，其具有多个引线，跨越支撑结构中的间隙并排延伸，每个引线具有易碎部分，以允许引线的一端在接合过程中从支撑结构脱离。 通过在延伸的处理区域中处理引线形成材料形成脆性部分，该处理区域延伸穿过由许多引线占据的区域。 该工艺避免了在引线的侧边缘上特别细蚀刻形成凹口的需要。

公开(公告)号：US5615824A

公开(公告)日：1997-04-01

申请号：US410324

申请日：1995-03-24

Applicant: Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

Inventor： Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  B23K1/00

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.

Abstract translation: 制造焊接连接的方法。 带有焊料块的元件被强制地与另一个带有弹性金属接触件的元件接合，使得接触件擦拭焊料块的表面，并使触头变形并且抵靠擦拭表面。 当接触处于其变形状态时，接触和焊料质量达到足以软化焊料的升高的粘合温度，使得接触在其自身弹性的影响下渗透到焊料块中。 触点与焊料中的纯焊料接合，从而即使没有焊剂也可以实现有效的接合。

公开(公告)号：US10285270B2

公开(公告)日：2019-05-07

申请号：US13573309

申请日：2012-09-07

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/44 ,  H05K3/46

Abstract: A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.

公开(公告)号：US20120319595A1

公开(公告)日：2012-12-20

申请号：US13507080

申请日：2012-05-31

Applicant: Nicholas Antonopoulos ,  Arockiyaswamy Venkidu ,  Joseph Fjelstad

Inventor： Nicholas Antonopoulos ,  Arockiyaswamy Venkidu ,  Joseph Fjelstad

IPC: H05B37/02 ,  H01J5/50

CPC classification number: H05B33/0803 ,  H01R33/945

Abstract: An LED lighting element comprised of at least two pieces designed for use with legacy lighting fixtures having a separable transformer and lighting element to improve efficacy and economy of LED lighting. In addition, the assembly can be provided with intelligent electronics for wireless control, operation and monitoring and/or with a battery for operation during power outages and/or as a warning system for the hearing impaired by stroboscopically flashing the LED lights and/or as sensing elements which cause activation due to some other sensed stimulus.

Abstract translation: LED照明元件由至少两件设计，用于与具有可分离变压器和照明元件的传统照明设备一起使用，以改善LED照明的功效和经济性。 此外，组件可以提供用于无线控制，操作和监视的智能电子设备和/或用于在停电期间操作的电池和/或作为用于通过频闪地闪烁LED灯的听觉障碍的警告系统和/或作为 由于一些其他感测到的刺激而导致激活的感测元件。

公开(公告)号：USRE43404E1

公开(公告)日：2012-05-22

申请号：US12728630

申请日：2010-03-22

Applicant: Thomas H. DiStefano ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad

IPC: H01L21/44

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/80203 ,  H01L2224/80207 ,  H01L2224/81192 ,  H01L2224/81904 ,  H01L2224/83209 ,  H01L2224/9212 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/80001 ,  H01L2224/81

Abstract: A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic component to form a void free layer.

Abstract translation: 一种利用可固化密封剂为一个或多个倒装芯片组件或一个或多个微电子部件提供基本无空隙的方法。 还公开了将密封剂注入到组件中的方法以及处理微电子部件以形成无空隙层的方法。