公开(公告)号：US20180199431A1

公开(公告)日：2018-07-12

申请号：US15740378

申请日：2016-05-20

Applicant: OSRAM GmbH

Inventor： Michael Schoewel ,  Peter Helbig ,  Jozsef Szekely ,  Sven Seifritz

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/20 ,  H05K13/00 ,  F21S41/19

CPC classification number: H05K1/0296 ,  F21S41/19 ,  F21V21/00 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/202 ,  H05K3/4092 ,  H05K13/0069 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/10113 ,  H05K2201/10318 ,  H05K2203/166

Abstract: Various embodiments relate to a circuit support for an electronic circuit. The circuit support may include at least one conductor track, and an insulating matrix that is injection-molded over the at least one conductor path in such a way as to leave open at least a first region for connecting at least one electronic component of the electronic circuit. The circuit support may include at least one fastening aid that is formed from the material for the insulating matrix and/or from the material of the at least one conductor.

公开(公告)号：US20180063955A1

公开(公告)日：2018-03-01

申请号：US15406360

申请日：2017-01-13

Applicant: Apple Inc.

Inventor： Charles W. WERLEY ,  Haran BALARAM ,  Richard L. WINSLOW

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K1/113 ,  H05K1/181 ,  H05K3/328 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2203/107

Abstract: An electronic device having a circuit board and a battery is disclosed. The circuit board may include a through hole and an electrical pad surrounding the through hole. In order to electrically couple the circuit board to the battery, and in particular, an electrode of the battery, a tab (or plaque) is placed between the electrical pad and the electrode. The tab electrically couples with the electrical pad by a soldering operation. To couple (electrically and mechanically) the tab with the electrode, a welding operation is used. The welding operation may include a laser weld providing thermal energy through a laser beam. In this regard, the laser beam passes through the through hole, thereby (partially) melting the tab and forming a weld between the tab and the electrode. Accordingly, the tab covers the through hole such that the tab is positioned to receive the laser beam.

公开(公告)号：US09801269B1

公开(公告)日：2017-10-24

申请号：US15150834

申请日：2016-05-10

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01P3/08 ,  H01P3/06

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

公开(公告)号：US09631799B2

公开(公告)日：2017-04-25

申请号：US14943358

申请日：2015-11-17

Applicant: LongWide Technology Inc.

Inventor： Huan-Jan Chien ,  Tsung-Hong Tsai

IPC: F21V21/00 ,  F21V15/01 ,  H05K3/20 ,  F21V29/77 ,  F21V23/00 ,  F21K9/232 ,  H05K1/18 ,  F21Y101/00 ,  F21Y115/10 ,  F21Y107/20 ,  F21Y113/13 ,  F21Y113/17

CPC classification number: F21V21/00 ,  F21K9/232 ,  F21V15/01 ,  F21V23/001 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2107/20 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  H05K1/181 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/09263 ,  H05K2201/10106

Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.

公开(公告)号：US09485857B2

公开(公告)日：2016-11-01

申请号：US14134467

申请日：2013-12-19

Applicant: Samsung Display Co., Ltd.

Inventor： Dae-Jin Park ,  Bum-Soo Kam ,  Ha-Young Park ,  Gil-Hwan Yeo

IPC: G02F1/1345 ,  H05K1/02 ,  H01L27/12 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H01L27/124 ,  H01L27/1262 ,  H05K3/0044 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/10136 ,  H05K2203/0228 ,  H05K2203/107

Abstract: A flat panel display apparatus for reducing a bezel size and a method for manufacturing the same. The flat panel display apparatus includes a lower substrate having a display area and a peripheral area surrounding the display area, an upper substrate corresponding to the lower substrate, a sealing member disposed along the peripheral area of the lower substrate and bonding the lower substrate and the upper substrate, a first flexible layer disposed on a surface of the lower substrate in a direction facing the upper substrate, in the peripheral area of the lower substrate, the first flexible layer extending to an outside of the lower substrate, and a first wiring disposed between the lower substrate and the sealing member and extending to the outside of the lower substrate and along the first flexible layer.

Abstract translation: 一种用于减小边框尺寸的平板显示装置及其制造方法。 平板显示装置包括具有显示区域的周边区域和围绕显示区域的周边区域的下基板，与下基板对应的上基板，沿着下基板的周边区域配置的密封构件， 上基板，在下基板的面向上基板的方向上设置在下基板的表面上的第一柔性层，在下基板的周边区域中，第一柔性层延伸到下基板的外侧，第一布线设置 在下基板和密封构件之间并且延伸到下基板的外部并且沿着第一柔性层延伸。

公开(公告)号：US20160174376A1

公开(公告)日：2016-06-16

申请号：US14905728

申请日：2014-07-24

Applicant: LG CHEM, LTD.

Inventor： Ducksu OH ,  Sung Soo PARK ,  Minsoo KANG

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/142 ,  H01L51/5203 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/147 ,  H05K3/361 ,  H05K3/363 ,  H05K3/403 ,  H05K2201/0397 ,  H05K2201/05 ,  H05K2201/097 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

Abstract translation: 提供了一种安装在显示装置的基板上的柔性印刷电路板。

公开(公告)号：US20160069544A1

公开(公告)日：2016-03-10

申请号：US14943201

申请日：2015-11-17

Applicant: LongWide Technology Inc.

Inventor： Huan-Jan CHIEN ,  Tsung-Hong TSAI

IPC: F21V21/00 ,  H05K3/20 ,  H05K1/18 ,  F21K99/00

CPC classification number: F21V21/00 ,  F21K9/232 ,  F21V15/01 ,  F21V23/001 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2107/20 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  H05K1/181 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/09263 ,  H05K2201/10106

Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.

公开(公告)号：US09198278B2

公开(公告)日：2015-11-24

申请号：US14188998

申请日：2014-02-25

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： Khai Loke Lim ,  Kow Chee Chong ,  Macwien Krishnamurthi ,  Swee Theam Thor

IPC: H01L23/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H01L21/44

CPC classification number: H05K1/0218 ,  H05K1/0366 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/0097 ,  H05K3/403 ,  H05K3/427 ,  H05K3/429 ,  H05K2201/0397 ,  H05K2201/09545 ,  H05K2201/1034 ,  H05K2203/063 ,  H05K2203/0703 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board includes at least one plated-through hole via drilled into at least one of a first layer on a first side of the printed circuit board and a second layer on a second side of the printed circuit board. The printed circuit board also includes a core section laminated between the first layer and the second layer, wherein a length of the core section is shorter than a length of the first layer and a length of the second layer. The printed circuit board further includes an open slot configured to house a connection tab of an electronic product connected to the printed circuit board, wherein the open slot is formed adjacent to the core section and between sections of the first layer and the second layer that are longer than the core section.

Abstract translation: 印刷电路板包括穿过印刷电路板的第一侧上的第一层和印刷电路板的第二面上的第二层中的至少一个的至少一个电镀通孔。 印刷电路板还包括层叠在第一层和第二层之间的芯部，其中芯部的长度短于第一层的长度和第二层的长度。 印刷电路板还包括开口槽，其构造成容纳连接到印刷电路板的电子产品的连接片，其中所述开口狭缝形成在所述芯部分附近以及在所述第一层和所述第二层的部分之间 比核心部分长。

公开(公告)号：US09184520B2

公开(公告)日：2015-11-10

申请号：US14253885

申请日：2014-04-16

Applicant: Unimicron Technology Corp.

Inventor： Chih-Peng Fan ,  Yin-Hwa Cheng ,  Ching-Ho Hsieh ,  Ling-Kai Su ,  Yung-Hao Hsueh

IPC: H01R12/00 ,  H01R12/71 ,  H05K3/32 ,  H05K3/40

CPC classification number: H01R12/718 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/10265 ,  H05K2201/10719

Abstract: An electrical connector includes a base and an elastic terminal. The base has a recess. The elastic terminal is connected to the base and extends to the recess. The elastic terminal has a fixed end and a free end, the fixed end is connected to the base, and the free end is located at the recess and is curved. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to bend towards the bottom of the recess so that the free end leans against the bottom of the recess. The electrical connector may further include a contact protrusion connected to the elastic terminal. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to make the elastic terminal bend towards the bottom portion of the recess so that the free end leans against the bottom of the recess.

Abstract translation: 电连接器包括基座和弹性端子。 底座有一个凹槽。 弹性端子连接到基座并延伸到凹部。 弹性端子具有固定端和自由端，固定端连接到基座，自由端位于凹槽处并弯曲。 当接触件朝向凹部移动时，触头能够推动接触突起朝向凹部的底部弯曲，使得自由端靠在凹部的底部。 电连接器还可以包括连接到弹性端子的接触突起。 当接触件朝向凹部移动时，触头能够推动接触突起，以使弹性端子朝向凹部的底部弯曲，使得自由端靠在凹部的底部。

公开(公告)号：US09025311B1

公开(公告)日：2015-05-05

申请号：US13868660

申请日：2013-04-23

Applicant: Kemet Electronics Corporation

Inventor： John Bultitude ,  John E. McConnell ,  Abhijit Gurav

IPC: H01G4/38 ,  H01G4/40

CPC classification number: H01G4/38 ,  H01G2/065 ,  H01G4/228 ,  H01G4/30 ,  H05K1/189 ,  H05K2201/0397 ,  H05K2201/051 ,  H05K2201/055 ,  H05K2201/10015

Abstract: An improved high capacitance module for multi-layer ceramic capacitors is described. The module contains a flexible substrate comprising at least one first conductive trace and at least one second conductive trace. A first termination trace is in electrical connection with each first trace and a second termination trace is in electrical connection with each second trace. Each capacitor comprises interleaved conductors wherein alternate conductors are terminated to a first external termination and adjacent conductors are terminated to a second external termination. Each capacitor is mounted on the substrate with the first termination in electrical contact with the first trace and the second termination in electrical contact with the second trace. A housing with the substrate is received in the housing. A first lead tab is in electrical contact with the first termination wherein the first lead tab extends from the housing.

Abstract translation: 描述了一种用于多层陶瓷电容器的改进的高电容模块。 该模块包含柔性基板，该基板包括至少一个第一导电迹线和至少一个第二导电迹线。 第一终止迹线与每个第一迹线电连接，并且第二终止迹线与每个第二迹线电连接。 每个电容器包括交错的导体，其中交替的导体端接到第一外部端子，并且相邻的导体终止于第二外部端接。 每个电容器安装在基板上，其中第一端子与第一迹线电接触，而第二端接件与第二迹线电接触。 具有基板的壳体被容纳在壳体中。 第一引线片与第一端接电接触，其中第一引线片从壳体延伸。