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    LED Metal Substrate Package and Method of Manufacturing Same
    82.
    发明申请
    LED Metal Substrate Package and Method of Manufacturing Same 有权

    公开(公告)号：US20170117448A1

    公开(公告)日：2017-04-27

    申请号：US15392090

    申请日：2016-12-28

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park

    IPC: H01L33/62 ,  H01L33/38 ,  H01L33/48

    CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/486 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014

    Abstract: The present invention relates to an LED metal substrate package, and particularly, to an LED metal substrate package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a metal substrate that is electrically separated by at least one vertical insulation layer, the cavity having one vertical insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the metal substrate formed in the respective cavities, with shadow masking; removing an oxide film formed on the surface portions that have not been treated with masking; depositing an electrode layer on each of the surface portions of the oxide layer that have been removed; removing the shadow mask; performing Au/Sn soldering on the electrode layer and bonding an optical device chip; and wire bonding one electrode of the optical device, disposed on one side of the metal substrate with respect to each of the vertical insulation layers, through wires to the metal substrate disposed on the other side of each of the vertical insulation layers. The present invention forms solder using Au/Sn material, which has good heat dissipating characteristics and good bonding characteristics, on the electrode layer to bond an optical device chip, so as to have excellent heat dissipating performance compared to existing LED metal packages that use Ag epoxy.

    Micro Heater and Micro Sensor
    84.
    发明申请
    Micro Heater and Micro Sensor 审中-公开
    微加热器和微型传感器

    公开(公告)号：US20170067842A1

    公开(公告)日：2017-03-09

    申请号：US15247530

    申请日：2016-08-25

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01N27/12 ,  H05B3/26 ,  G01N33/00 ,  H05B3/03

    CPC classification number: G01N27/123 ,  G01N27/125 ,  G01N27/128 ,  G01N33/0027 ,  H05B3/03 ,  H05B3/265

    Abstract: The present invention relates to a micro heater and a micro sensor wherein an anti-etching dam is formed on the first supporting portion, and thus, the first supporting portion maintains its initial shape thereby so that the heat capacity of the first supporting portion becomes small, and temperature uniformity thereof is enhanced.

    Abstract translation: 微加热器和微型传感器技术领域本发明涉及一种微加热器和微型传感器，其中在第一支撑部分上形成有抗蚀刻凹槽，因此第一支撑部分保持其初始形状，使得第一支撑部分的热容变小 ，并且其温度均匀性增强。

    Chip Substrate and Chip Package Module
    85.
    发明申请
    Chip Substrate and Chip Package Module 有权
    芯片基板和芯片封装模块

    公开(公告)号：US20160126414A1

    公开(公告)日：2016-05-05

    申请号：US14931432

    申请日：2015-11-03

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park

    IPC: H01L33/10 ,  H01L33/64 ,  H01L33/40 ,  H01L33/58 ,  H01L33/38

    CPC classification number: H01L33/644 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/00 ,  H01L2924/00

    Abstract: A chip substrate includes conductive portions, insulation portions, cavities and a heat dissipating portion. The insulation portions are alternately bonded to the conductive portions to electrically isolate the conductive portions. The lens insertion portions are formed on an upper surface of the chip substrate at a predetermined depth so as to extend across each of the insulation portions. Each of the lens insertion portions includes a predetermined number of straight sides and a predetermined number of arc-shaped corners formed in regions where the straight sides meet with each other. The cavities are formed inward of the lens insertion portions at a predetermined depth so as to extend across each of the insulation portions. The heat dissipating portion is bonded to a lower surface of the chip substrate.

    Abstract translation: 芯片基板包括导电部分，绝缘部分，空腔和散热部分。 绝缘部分交替地接合到导电部分以电绝缘导电部分。 透镜插入部分以预定深度形成在芯片基板的上表面上，以便延伸穿过每个绝缘部分。 每个透镜插入部分包括预定数量的直边和形成在直边彼此相交的区域中的预定数量的弧形拐角。 这些空腔以预定的深度形成在透镜插入部的内侧，以便延伸穿过每个绝缘部分。 散热部分结合到芯片基板的下表面。

    OPTICAL DEVICE AND METHOD FOR MANUFACTURING SAME
    86.
    发明申请
    OPTICAL DEVICE AND METHOD FOR MANUFACTURING SAME 有权
    光学装置及其制造方法

    公开(公告)号：US20150372209A1

    公开(公告)日：2015-12-24

    申请号：US14765457

    申请日：2014-02-06

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/62 ,  H01L33/54

    CPC classification number: H01L33/62 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: An optical device includes a metal substrate wherein at least one vertical insulation layer is formed from the upper to the lower surface; a metal plated layer formed on the upper surface of the metal substrate except for the vertical insulation layer; and an optical device chip bonded to one portion of the metal plated layer. One electrode of the optical device chip is electrically connected to a bonded surface of the metal plated layer, and the other electrode of the optical device chip is wire bonded to the other portion of metal plated layer. The optical device chip and a peripheral region thereof is shielded with a sealant, and at least one groove is formed on a partial surface of the metal plated layer so that a portion of the sealant is directly bonded to the metal substrate.

    Abstract translation: 光学装置包括金属基板，其中至少一个垂直绝缘层从上表面到下表面形成; 形成在所述金属基板的除了所述垂直绝缘层之外的上表面上的金属镀层; 以及与金属镀层的一部分接合的光学器件芯片。 光器件芯片的一个电极与金属镀层的接合表面电连接，并且光学器件芯片的另一个电极被引线接合到金属镀层的另一部分。 光学元件芯片及其外围区域用密封剂屏蔽，并且在金属镀层的部分表面上形成至少一个凹槽，使得密封剂的一部分直接接合到金属基底。

    Method for Manufacturing Optical Device and Optical Device Manufactured by Same
    87.
    发明申请
    Method for Manufacturing Optical Device and Optical Device Manufactured by Same 审中-公开
    制造光学装置及光学装置的方法

    公开(公告)号：US20150243864A1

    公开(公告)日：2015-08-27

    申请号：US14418966

    申请日：2013-08-01

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Ki Myung Nam ,  Young Chul Jun

    IPC: H01L33/64 ,  H01L33/00 ,  H01L33/44 ,  H01L33/62

    CPC classification number: H01L33/644 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: The present invention relates to a method for manufacturing an optical device and to an optical device manufactured by the method, in which heat-dissipating performance by a heat sink and thermal insulation performance between a substrate and the heat sink are improved and workability is enhanced. According to a first characteristic of the present invention, the method for manufacturing an optical device comprises: (a) a step of preparing a disk for an optical device having a vertical thermal insulation layer; (b) a step of forming a groove along a cut line formed on the lower surface of the disk for an optical device; (c) a step of applying liquid insulation material to the surface on which the groove is formed and hardening the liquid insulation material to form an electrically insulating layer having a planar surface; and (d) a step of forming a fixing hole penetrating in a vertical direction through both the disk for an optical device and the groove.

    Abstract translation: 本发明涉及一种制造光学元件的方法和通过该方法制造的光学器件的方法，其中通过散热器的散热性能和衬底与散热器之间的绝热性能得到提高，并且可操作性得到提高。 根据本发明的第一特征，光学装置的制造方法包括：（a）制备具有垂直绝热层的光学装置的盘的步骤; （b）沿着形成在用于光学装置的盘的下表面上的切割线形成凹槽的步骤; （c）将液体绝缘材料施加到其上形成有槽的表面的步骤，并使所述液体绝缘材料硬化以形成具有平坦表面的电绝缘层; 以及（d）形成沿垂直方向穿过光盘装置盘和凹槽的固定孔的步骤。

    Method for Manufacturing Optical Element for Backlight Unit and Optical Element and Optical Element Array Manufactured by Method
    88.
    发明申请
    Method for Manufacturing Optical Element for Backlight Unit and Optical Element and Optical Element Array Manufactured by Method 有权
    方法制造的背光单元和光学元件光学元件阵列的光学元件制造方法

    公开(公告)号：US20150143678A1

    公开(公告)日：2015-05-28

    申请号：US14610145

    申请日：2015-01-30

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Ki Myung Nam

    IPC: H01L33/48 ,  H05K3/00

    CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L25/13 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12041 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/10106 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit.Provided is a method of manufacturing an optical device for a back light unit, the method comprising: (a) preparing an original substrate having vertical insulating layers interposed therebetween; (b) partially cutting the original substrate to a predetermined depth from an upper surfaces thereof such that the cut portion is orthogonal at least to the vertical insulation layers, and exposing a region where a plating layer for soldering is to be formed; (c) performing plating; (d) mounting optical device chips on a plurality of chip substrate regions divided to include the vertical insulating layers; and (e) cutting each chip substrate region.

    Abstract translation: 本发明涉及一种制造背光单元的光学装置的方法，以及通过该方法制造的光学装置和光学装置阵列，其中构成光学装置阵列的光学装置芯片各自被放置在 印刷电路板，使得光可以从光学元件芯片沿横向发射，从而减小背光单元的整体厚度。 本发明提供一种背光单元的光学元件的制造方法，其特征在于，包括：（a）准备具有插入其间的垂直绝缘层的原稿基板; （b）将原始基板从其上表面部分地切割到预定深度，使得切割部分至少垂直于绝缘层正交，并暴露要形成用于焊接的镀层的区域; （c）进行电镀; （d）将光学器件芯片安装在划分为包括垂直绝缘层的多个芯片衬底区域上; 和（e）切割每个芯片衬底区域。

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