公开(公告)号：US20100148284A1

公开(公告)日：2010-06-17

申请号：US12710773

申请日：2010-02-23

Applicant: Toru WATANABE ,  Akira SATO ,  Shogo INABA ,  Takeshi MORI

Inventor： Toru WATANABE ,  Akira SATO ,  Shogo INABA ,  Takeshi MORI

IPC: H01L29/84

CPC classification number: B81B3/0086 ,  B81B2201/0271

Abstract: A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode.

Abstract translation: 微机电系统（MEMS）器件包括半导体衬底，包括固定电极的MEMS和通过绝缘层形成在半导体衬底上的可移动电极，以及形成在固定电极下方的半导体衬底中的阱。 井是n型井和p型井之一。 p型阱对固定电极施加正电压，而n型阱对固定电极施加负电压。

公开(公告)号：US20100112743A1

公开(公告)日：2010-05-06

申请号：US12612008

申请日：2009-11-04

Applicant: Hironobu KAWAUCHI

Inventor： Hironobu KAWAUCHI

IPC: H01L21/302

CPC classification number: B81C1/0015 ,  B81B2201/0271 ,  B81B2203/0118 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

Abstract: A method of manufacturing a semiconductor device includes partially etching the upper surface of the semiconductor substrate to form side grooves and expose side surfaces of the vibrators, partially etching the upper surface of the semiconductor substrate to form separation grooves where insulating separation regions between the vibrators and the semiconductor substrate are to be formed, thermally oxidizing surfaces of the separation grooves to form the insulating separation region composed of oxidized films filled in the separation grooves, thermally oxidizing the side surfaces of the vibrators to form side insulating film, and performing release etching of the semiconductor substrate using the side insulating film as a mask to expose bottom surfaces of the vibrators and form the vibrators arranged in the recess formed in the semiconductor substrate.

Abstract translation: 制造半导体器件的方法包括：部分地蚀刻半导体衬底的上表面以形成侧槽并暴露振动器的侧表面，部分蚀刻半导体衬底的上表面，形成分隔槽，其中振动器和 要形成半导体衬底，热氧化分离槽的表面以形成由填充在分离槽中的氧化膜构成的绝缘分离区域，热氧化振动器的侧表面以形成侧绝缘膜，并进行剥离蚀刻 使用侧绝缘膜作为掩模的半导体衬底以暴露振动器的底表面并形成设置在形成于半导体衬底中的凹部中的振动器。

公开(公告)号：US20100096745A1

公开(公告)日：2010-04-22

申请号：US12254536

申请日：2008-10-20

Applicant: Richard Ruby ,  James P. Roland ,  Frank S. Geefay

Inventor： Richard Ruby ,  James P. Roland ,  Frank S. Geefay

IPC: H01L23/12 ,  H01L21/00

CPC classification number: H03H9/0547 ,  B81B2201/0271 ,  B81C1/00333 ,  B81C2203/0118 ,  B81C2203/032 ,  H01L21/187 ,  H01L23/10 ,  H01L2924/0002 ,  H03H9/1014 ,  H01L2924/00

Abstract: A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to create a void in the polymer. The method also comprises placing the first wafer over the second wafer and in contact with the polymer; and curing the polymer to bond the first wafer to the second wafer. A bonded wafer structure is also described.

Abstract translation: 包装电子器件的方法包括提供第一晶片并提供第二晶片。 该方法还包括在第一晶片的表面上沉积聚合物材料; 并且从第一晶片选择性地去除聚合物的一部分以在聚合物中产生空隙。 该方法还包括将第一晶片放置在第二晶片上并与聚合物接触; 并固化聚合物以将第一晶片结合到第二晶片。 还描述了接合晶片结构。

公开(公告)号：US20100074458A1

公开(公告)日：2010-03-25

申请号：US12233919

申请日：2008-09-19

Applicant: Bang-Chiang Lan ,  Ming-I Wang ,  Li-Hsun Ho ,  Hui-Min Wu ,  Min Chen ,  Chien-Hsin Huang

Inventor： Bang-Chiang Lan ,  Ming-I Wang ,  Li-Hsun Ho ,  Hui-Min Wu ,  Min Chen ,  Chien-Hsin Huang

IPC: H04R3/00 ,  H04R31/00

CPC classification number: B81B3/0021 ,  B81B2201/0271 ,  H04R3/00 ,  H04R7/00 ,  H04R19/005 ,  H04R31/00 ,  H04R2499/11 ,  Y10T29/49002

Abstract: A structure of a micro-electro-mechanical systems (MEMS) electroacoustic transducer includes a substrate, a diaphragm, a silicon material layer, and a conductive pattern. The substrate includes an MEMS device region. The diaphragm has openings, and is disposed in the MEMS device region. A first cavity is formed between the diaphragm and the substrate. The silicon material layer is disposed on the diaphragm and seals the diaphragm. The conductive pattern is disposed beneath the diaphragm in the MEMS device region.

Abstract translation: 微电子机械系统（MEMS）电声换能器的结构包括基板，隔膜，硅材料层和导电图案。 衬底包括MEMS器件区域。 隔膜具有开口，并且设置在MEMS器件区域中。 在隔膜和基板之间形成第一空腔。 硅材料层设置在隔膜上并密封隔膜。 导电图案设置在MEMS器件区域中的隔膜下方。

公开(公告)号：US07666700B2

公开(公告)日：2010-02-23

申请号：US12044060

申请日：2008-03-07

Applicant: Yasushi Igarashi

Inventor： Yasushi Igarashi

IPC: H01L21/00

CPC classification number: B81C1/00579 ,  B81B2201/0271

Abstract: The present invention is an etching mask used for fabricating of the MEMS resonator including an oscillator which both edges are fixed to a base substance and vibrates to a vibrating direction, and an electrode which is fixed to a base substance by vibration is impossible in parallel for the oscillator, and is placed every one or more at the both sides of the oscillator. The etching mask includes a mask pattern 36 for oscillators which covers an oscillator formation scheduled region 34 on a conductive film 30 formed all over a sacrificial film which covers a region of the principal surface except both edges of the oscillator, and a mask pattern 40 for electrodes which covers an electrode formation scheduled region 38 on a conductive film. The width about a vibrating direction of a mask pattern for oscillators and a mask pattern for electrodes is made the same, and a gap between a mask pattern for oscillators and a mask pattern for electrodes and a gap between adjoining mask patterns for electrodes are made the same.

Abstract translation: 本发明是用于制造MEMS谐振器的蚀刻掩模，其包括两个边缘固定到基底物质并振动到振动方向的振荡器，并且不可能通过振动固定到基底物质的电极并联， 振荡器，并被放置在振荡器两侧的每一个或多个。 蚀刻掩模包括用于振荡器的掩模图案36，其覆盖覆盖除了振荡器的两个边缘之外的主表面的区域的覆盖牺牲膜的导电膜30上的振荡器形成调度区域34和用于 覆盖导电膜上的电极形成调度区域38的电极。 使振荡器的掩模图案的振动方向的宽度和电极的掩模图案相同，并且使用于振动器的掩模图案和电极的掩模图案之间的间隙以及用于电极的相邻掩模图案之间的间隙 相同。

公开(公告)号：US20100032789A1

公开(公告)日：2010-02-11

申请号：US12187443

申请日：2008-08-07

Applicant: Florian Schoen ,  Robert Gruenberger ,  Mohsin Nawaz ,  Bernhard Winkler

Inventor： Florian Schoen ,  Robert Gruenberger ,  Mohsin Nawaz ,  Bernhard Winkler

IPC: H01L23/34 ,  H01L21/52

CPC classification number: B81B3/007 ,  B81B3/0081 ,  B81B2201/0271 ,  B81B2203/0118 ,  H01L2924/0002 ,  H03H3/0076 ,  H03H9/2431 ,  H03H9/2452 ,  H03H9/2457 ,  H03H9/2463 ,  H01L2924/00

Abstract: The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element comprising a semiconducting material, and at least one trench formed in the resonator element and filled with a material comprising oxide. Further embodiments comprise additional devices, systems and methods.

Abstract translation: 本发明涉及MEMS装置。 在一个实施例中，微机电系统（MEMS）装置包括包括半导体材料的谐振元件和形成在谐振器元件中并填充有包含氧化物的材料的至少一个沟槽。 另外的实施例包括附加的装置，系统和方法。

公开(公告)号：US07612484B2

公开(公告)日：2009-11-03

申请号：US11630773

申请日：2005-06-29

Applicant: Amyot Tripard ,  Yves Brechet

Inventor： Amyot Tripard ,  Yves Brechet

IPC: H03H9/00 ,  H03H9/24

CPC classification number: H03H3/0072 ,  B81B3/0078 ,  B81B2201/0271 ,  B81B2203/0118 ,  H03H9/2436 ,  H03H2009/02503 ,  Y10T29/42

Abstract: An electromechanical resonator including a vibrating body, at least one excitation electrode, and at least one detection electrode. The vibrating body includes a first part made of a first material with a first Young's modulus and a second part made of a second material with a second Young's modulus, less than the first Young's modulus, the second part being at least partially located facing the detection electrode.

Abstract translation: 一种机电谐振器，包括振动体，至少一个激励电极和至少一个检测电极。 振动体包括由具有第一杨氏模量的第一材料制成的第一部分和由具有小于第一杨氏模量的第二杨氏模量的第二材料制成的第二部分，第二部分至少部分地定位成面向检测 电极。

公开(公告)号：US20090267706A1

公开(公告)日：2009-10-29

申请号：US12388157

申请日：2009-02-18

Applicant: Yun-kwon PARK ,  Byeoung-Ju Ha ,  Byeong-Kwon Ku ,  Jae-Sung Rieh ,  In-Sang Song ,  Jin-Woo Lee ,  Jea-shik Shin ,  Young-Min Park

Inventor： Yun-kwon PARK ,  Byeoung-Ju Ha ,  Byeong-Kwon Ku ,  Jae-Sung Rieh ,  In-Sang Song ,  Jin-Woo Lee ,  Jea-shik Shin ,  Young-Min Park

IPC: H03H9/00 ,  G03F7/20

CPC classification number: H03H9/462 ,  B81B2201/0271 ,  B81C1/00142 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H03H3/0072 ,  H03H9/2463

Abstract: A resonator fabrication method is provided. A method includes providing a plurality of electrode patterns disposed apart from each other on a substrate using a nano-imprint technique; and forming an extended electrode pattern connected to a plurality of electrode patterns, and forming a nano structure laid across an extended electrode patterns. Therefore, a nano-electromechanical system (NEMS) resonator is easily fabricated at a nanometer level.

Abstract translation: 提供了一种谐振器制造方法。 一种方法包括使用纳米压印技术在基板上提供彼此分离的多个电极图案; 以及形成连接到多个电极图案的延伸电极图案，并且形成跨越延伸的电极图案的纳米结构。 因此，纳米机电系统（NEMS）谐振器容易在纳米级制造。

公开(公告)号：US20090200899A1

公开(公告)日：2009-08-13

申请号：US11814557

申请日：2006-01-19

Applicant: Tsutomu Osaka ,  Susumu Sato

Inventor： Tsutomu Osaka ,  Susumu Sato

IPC: H03H9/17 ,  B81C1/00 ,  H01L41/04

CPC classification number: H03H9/173 ,  B81B2201/0271 ,  B81C1/00476 ,  H01L21/31111 ,  H03H3/02 ,  H03H9/02149 ,  H03H2003/021 ,  Y10T29/42

Abstract: A method of manufacturing a micromachine in which corrosion of a structure is restrained and the micromachine are provided. The method of manufacturing a micromachine includes a first step of patterningly forming a sacrificial layer 12 having a silicon oxide based material containing a hydrogen fluoride dissociating species on a substrate 11, a second step of forming a structure 16 on the substrate 11 in the state of covering the sacrificial layer 12, a third step of forming the structure 16 on the sacrificial layer 12 with a hole part or parts 18 reaching the sacrificial layer 12, and a fourth step of forming a vibrating space between the substrate 11 and the structure 16 by introducing only a hydrogen fluoride gas or only the hydrogen fluoride gas and an inert gas through the hole part or parts 18 and etching the sacrificial layer 12 by use of the dissociating species contained in the sacrificial layer 12. The micromachine is manufactured by the method.

Abstract translation: 制造其中抑制了结构的腐蚀并且提供微机械的微机械的方法。 制造微加工机的方法包括在基板11上图案化地形成具有含有氟化氢解离物质的氧化硅基材料的牺牲层12的第一步骤，在基板11上形成结构16的第二步骤 覆盖牺牲层12的第三步骤，在牺牲层12上形成具有到达牺牲层12的孔部分18的结构16的第三步骤，以及在衬底11和结构16之间形成振动空间的第四步骤 仅通过孔部分18仅引入氟化氢气体或仅氟化氢气体和惰性气体，并通过使用包含在牺牲层12中的解离物质来蚀刻牺牲层12.微机械通过该方法制造。

公开(公告)号：US20090197061A1

公开(公告)日：2009-08-06

申请号：US12160179

申请日：2007-01-05

Applicant: Claude Lucat ,  Francis Menil ,  Helene Debeda-Hickel ,  Patrick Ginet

Inventor： Claude Lucat ,  Francis Menil ,  Helene Debeda-Hickel ,  Patrick Ginet

IPC: B32B3/10 ,  B05D5/12 ,  C25D5/00

CPC classification number: B81C99/0095 ,  B81B2201/0271 ,  B81B2201/031 ,  B81B2203/0109 ,  B81B2203/0118 ,  H01L41/107 ,  H01L41/27 ,  H01L41/29 ,  H01L41/314 ,  Y10T29/42 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics.The method consists in depositing on a substrate one or more films of an ink P, and one or more films of an ink M, each film being deposited in a predefined pattern selected according to the structure of the microcomponent, each film of ink P and each film of ink M being at least partially consolidated before deposition of the next film; effecting a total consolidation of the films of ink M partially consolidated after their deposition, to convert them to films of material M; totally or partially removing the material of each of the films of ink P. An ink P consists of a thermoset resin containing a mineral filler or a mixture comprising a mineral filler and an organic binder. An ink M consists of a mineral material precursor of the material M and an organic binder. The inks are deposited by pouring or by extrusion.

Abstract translation: 本发明涉及多层微组件的制备，其包括一种或多种膜，每个膜由选自金属，金属合金，玻璃，陶瓷和玻璃陶瓷的材料M组成。 该方法包括在基底上沉积一个或多个油墨P的膜，以及一个或多个油墨M膜，每个膜以按照微组件的结构选择的预定图案沉积，每个油墨P和 油墨M的每个薄膜在沉积下一个薄膜之前被至少部分固结; 在沉积后进行部分固化的墨水M的总体固结，将其转化成材料M的膜; 完全或部分地去除油墨P的每个薄膜的材料。油墨P由含有矿物填料或包含矿物填料和有机粘合剂的混合物的热固性树脂组成。 油墨M由材料M的矿物材料前体和有机粘合剂组成。 油墨通过倾倒或挤压沉积。