公开(公告)号：US20160201558A1

公开(公告)日：2016-07-14

申请号：US14594362

申请日：2015-01-12

Applicant: Hamilton Sundstrand Corporation

Inventor： Debabrata Pal

IPC: F02C7/16 ,  H05K7/20

CPC classification number: F02C7/16 ,  F01D25/12 ,  F02C7/12 ,  F02C7/224 ,  F02C7/26 ,  F02C9/00 ,  F05D2260/20 ,  F05D2270/54 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/38 ,  H05K7/20509 ,  Y02T50/675

Abstract: A controller according to an exemplary aspect of the present disclosure includes, among other things, a cold plate and at least one electronic component mounted to the cold plate by an intermediate thermoelectric cooler.

Abstract translation: 根据本公开的示例性方面的控制器尤其包括冷板和通过中间热电冷却器安装到冷板的至少一个电子部件。

公开(公告)号：US20160157388A1

公开(公告)日：2016-06-02

申请号：US14555799

申请日：2014-11-28

Applicant: Elwha LLC

Inventor： Christian L. Belady ,  Douglas M. Carmean ,  William Gates ,  Shaun L. Harris ,  Roderick A. Hyde ,  Muriel Y. Ishikawa ,  Sean M. James ,  Brian A. Janous ,  Jordin T. Kare ,  Jie Liu ,  Max N. Mankin ,  Gregory J. McKnight ,  Craig J. Mundie ,  Nathan P. Myhrvold ,  Tony S. Pan ,  Clarence T. Tegreene ,  Yaroslav A. Urzhumov ,  Charles Whitmer ,  Lowell L. Wood,, JR. ,  Victoria Y.H. Wood

IPC: H05K7/20 ,  G05B15/02 ,  G06F1/26

CPC classification number: H05K7/20763 ,  G06F1/20 ,  G06F1/26 ,  G06F2200/201 ,  H01M8/18 ,  H01M8/186 ,  H01M8/188 ,  H01M8/20 ,  H05K7/20836

Abstract: A power supply system for a data center includes a cooling circuit, an electrochemical power generator, a sensor, and a processor. The cooling circuit includes a fluid configured to receive heat energy generated by a server located in the data center. The electrochemical power generator is configured to receive and/or generate the fluid of the cooling circuit and to generate electrical energy for the server using the fluid. The sensor is configured to obtain data regarding the server. The processor is configured to control an amount of heat energy transferred from the server to the fluid based on the data.

Abstract translation: 用于数据中心的电源系统包括冷却回路，电化学发电机，传感器和处理器。 冷却回路包括被配置为接收由位于数据中心中的服务器产生的热能的流体。 电化学发电机被配置为接收和/或产生冷却回路的流体并且使用流体为服务器产生电能。 传感器被配置为获得有关服务器的数据。 处理器被配置为基于数据来控制从服务器传送到流体的热量的量。

公开(公告)号：US09342120B2

公开(公告)日：2016-05-17

申请号：US14458614

申请日：2014-08-13

Applicant: OCZ Storage Solutions Inc.

Inventor： Dokyun Kim ,  Karl Reinke

IPC: H05K7/20 ,  G06F1/20 ,  F28D15/02 ,  G06F1/18 ,  H01L23/427 ,  H05K5/02 ,  H05K7/14

CPC classification number: G06F1/20 ,  F28D15/02 ,  G06F1/185 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K5/0213 ,  H05K7/1417 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.

Abstract translation: 一种安装结构，其适于将扩展卡安装在计算机外壳内并且被配置为直接吸收并将热量从卡上的热源（例如IC芯片）传导到围绕外壳的环境大气。 安装结构包括安装支架，适于接触膨胀卡上的热源的表面的散热器，将散热器和安装支架相互连接的延伸件，用于将热量从散热器传导到安装件的一个或多个特征 支架和与安装支架相关联的一个或多个特征，用于将热量从安装结构散发到围绕外壳的周围环境。

公开(公告)号：US09310139B2

公开(公告)日：2016-04-12

申请号：US13842444

申请日：2013-03-15

Applicant: QUALCOMM Incorporated

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Mulugeta K. Berhe ,  Vinay Mitter ,  Ankur Jain ,  Paras S. Doshi

IPC: H05K7/20 ,  G06F1/20 ,  F28D15/02 ,  F28D21/00

CPC classification number: F28D15/02 ,  F28D2021/0028 ,  G06F1/203 ,  G06F2200/201 ,  H05K7/2029 ,  Y10T29/49359

Abstract: An apparatus for managing heat generated by at least one electronic component of a mobile device, the apparatus comprising: a housing for containing the electronic component of the mobile device; and a vapor chamber arranged in the housing, the vapor chamber having a cavity defined by a front wall and a rear wall opposite the rear wall, the front wall for receiving heat generated by the electronic component of the mobile device to evaporate fluid in the cavity into a vapor, the rear wall for receiving the vapor to allow the vapor to condense to liquid thereby cooling the rear wall of the vapor chamber; wherein an outer surface of the housing comprises at least a portion of the rear wall of the vapor chamber.

Abstract translation: 一种用于管理移动装置的至少一个电子部件产生的热量的装置，所述装置包括：用于容纳移动装置的电子部件的壳体; 以及布置在所述壳体中的蒸气室，所述蒸气室具有由前壁和与所述后壁相对的后壁限定的空腔，所述前壁用于接收由所述移动装置的电子部件产生的热量以使所述空腔中的流体蒸发 蒸汽，用于接收蒸汽的后壁，以允许蒸气冷凝至液体，从而冷却蒸气室的后壁; 其中壳体的外表面包括蒸气室的后壁的至少一部分。

公开(公告)号：US20160088768A1

公开(公告)日：2016-03-24

申请号：US14532377

申请日：2014-11-04

Applicant: DELTA ELECTRONICS, INC.

Inventor： Hui-Hsiung WANG ,  Meng-Sheng CHANG ,  Wei-Chien MA

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G03B21/16 ,  G06F2200/201

Abstract: A rotatable-type liquid-cooled heat sink and a disposition method for the same are provided. The liquid-cooled heat sink is disposed in a three-dimensional space and includes a pump, a liquid storage tank, a liquid-cooled head, a cooling module, and plural pipes. The pipes communicate the pump, the liquid storage tank, the liquid-cooled head, and the cooling module. Any of the liquid storage tank, the liquid-cooled head, the cooling module, and the pipes exceeds the pump in any of an X axis, a Y axis, a Z axis of a three-dimensional space.

Abstract translation: 提供了一种可旋转式液冷散热器及其配置方法。 液冷式散热器设置在三维空间中，包括泵，液体储存罐，液冷头，冷却模块和多个管。 管道与泵，液体储存罐，液冷头和冷却模块相通。 液体储存罐，液冷头，冷却模块和管道中的任一个在三维空间的X轴，Y轴，Z轴中的任一个中超过泵。

公开(公告)号：US09292057B2

公开(公告)日：2016-03-22

申请号：US13774766

申请日：2013-02-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Aaron R. Cox ,  William J. Grady, IV ,  Michael S. Miller ,  Jason E. Minyard

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/20 ,  G06F1/18

CPC classification number: H05K7/20781 ,  G06F1/182 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1489

Abstract: A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line.

Abstract translation: 系统包括支撑架和部件壳体。 支撑架包括一对垂直延伸的面板，并且一对垂直延伸面板中的每个面板具有从支撑架向外延伸的水接头对的一个或多个第一配合构件。 部件壳体可滑动地设置在一对垂直延伸的面板之间，并且具有前面板，从前面板向后延伸的一对侧壁，部件水线以及彼此连接的水耦合器对的两个第二配合部件 通过组件水线。

公开(公告)号：US20160066472A1

公开(公告)日：2016-03-03

申请号：US14780482

申请日：2013-03-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Tahir Cader ,  Niru Kumari ,  John Franz ,  Cullen E. Bash ,  David A. Moore ,  Sergio Escobar-Vargas

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/04 ,  F28D15/06 ,  F28D2021/0028 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/427 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20836 ,  Y02D10/16

Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

Abstract translation: 根据一个实例，冷却系统包括冷却流体储存器，与冷却流体储存器流体连通的冷却装置，具有与发热部件的一部分热接触的一侧的室，其中由 冷却装置将通过从发热部件接收热量，一定距离并与腔室分离的冷却板加热，以及连接腔室和冷却板的冷却流体管，其中加热的冷却流体为 流经冷却流体管至冷却板。 冷却板也将与热交换器热接触，热交换器是从冷却流体中除去热量。

公开(公告)号：US09277675B2

公开(公告)日：2016-03-01

申请号：US14014222

申请日：2013-08-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nobuto Fujiwara

IPC: H02B1/00 ,  H02B1/56 ,  G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  F28F7/00 ,  F28D15/00

CPC classification number: H05K7/20336 ,  F28D15/00 ,  F28F7/00 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H05K7/20 ,  H05K7/2029 ,  H05K7/20445

Abstract: According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat pipe. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. At least a portion of the heat pipe is buried in the wall from the first region to the second region.

Abstract translation: 根据一个实施例，电子设备包括加热部件，壳体和热管。 壳体容纳加热部件并且包括壁。 壁包括构造成从部件接受热量的第一区域和被配置为具有比第一区域的温度更低的温度的第二区域。 热管的至少一部分从第一区域到第二区域被埋在壁中。

公开(公告)号：US20160054769A1

公开(公告)日：2016-02-25

申请号：US14929372

申请日：2015-11-01

Applicant: International Business Machines Corporation

Inventor： David A. Gilbert ,  Patrick Varley

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system for providing cooling of a memory device comprises a cooling system arranged to store a coolant, a valve system connected to the output of the cooling system, and a control system connected to the valve system and arranged to open the valve system when power is lost to the control system. The system further comprises a delivery system connected to the output of the valve system and arranged to deliver the coolant to the memory device and the cooling system comprises a canister of low boiling point fluid.

Abstract translation: 一种用于提供存储装置的冷却的系统包括布置成存储冷却剂的冷却系统，连接到冷却系统的输出的阀系统以及连接到阀系统的控制系统，并且被布置成当电力为 失去了控制系统。 该系统还包括连接到阀系统的输出并且布置成将冷却剂输送到存储装置的输送系统，并且冷却系统包括低沸点流体的罐。

公开(公告)号：US20160044824A1

公开(公告)日：2016-02-11

申请号：US14455580

申请日：2014-08-08

Applicant: DELL PRODUCTS, L.P.

Inventor： TRAVIS C. NORTH ,  AUSTIN MICHAEL SHELNUTT ,  CHRISTOPHER M. HELBERG ,  RENE JASON SALAS

IPC: H05K7/20 ,  B23P15/26 ,  G06F1/20

CPC classification number: B23P15/26 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink.

Abstract translation: 一种用于冷却散热装置的组件，其减小散热器和散热装置之间的热接触/界面电阻，包括：具有散热表面的散热装置; 具有吸热表面的散热器; 垫片，其在所述散热表面和所述吸热表面之间延伸以提供密封的间隙腔; 以及设置在腔内的工作流体。 工作流体具有特定的热性质，其导致流体（i）在散热装置的运行期间吸收潜热并从液体蒸发到在液体表面与蒸发表面接触的蒸汽，和（ii）从 当蒸汽接触散热器的吸热表面时，蒸汽回到液体，从而将潜热从蒸气释放到散热器。