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    Optical conduction unit and image reader using the same
    82.
    发明授权
    Optical conduction unit and image reader using the same 有权
    光传导单元和图像读取器使用相同

    公开(公告)号：US07419274B2

    公开(公告)日：2008-09-02

    申请号：US10538240

    申请日：2003-12-10

    Applicant: Hideki Sawada

    Inventor： Hideki Sawada

    IPC: G01D11/28

    CPC classification number: H04N1/02815 ,  H04N1/0318 ,  H04N2201/02495 ,  H04N2201/03112 ,  H04N2201/03125 ,  H04N2201/03133 ,  H04N2201/03141 ,  H04N2201/03145

    Abstract: An optical conduction unit (U) has a configuration in which one portion (Sb) and another portion (58a) of an optical conduction body (5) are mated in mutually orthogonal x, y directions with first and second fitting means (64), (64a) of the first member (60A) of a reflector (6). A portion (65b) and another portion (65c) of the second member (60B) of the reflector (6) are mated in the x, y directions with the third and fourth fitting means (64b), (64c) of the first member (60A). With such a configuration, the reflector (6) and optical conduction body (5) can be reliably assembled so that they cannot be easily separated.

    Abstract translation: 光传导单元（U）具有其中一个部分（Sb）和光导体（5）的另一部分（58a）在相互正交的x，y方向上与第一和第二拟合装置（64）配合的构造， ，反射器（6）的第一构件（60A）的（64a）。 反射器（6）的第二构件（60B）的一部分（65b）和另一部分（65c）与第三和第四装配装置（64b）在x，y方向上配合（64c ）的第一构件（60A）。 通过这样的结构，可以可靠地组装反射器（6）和光导体（5），使得它们不容易分离。

    Image Reading Device
    83.
    发明申请
    Image Reading Device 失效
    图像读取装置

    公开(公告)号：US20080121783A1

    公开(公告)日：2008-05-29

    申请号：US11666643

    申请日：2005-10-28

    Applicant: Toshio Amano

    Inventor： Toshio Amano

    IPC: H01L27/00

    CPC classification number: H04N1/0318 ,  H04N1/0083 ,  H04N1/00994 ,  H04N1/02835 ,  H04N1/0312 ,  H04N2201/02427 ,  H04N2201/02439 ,  H04N2201/02495 ,  H04N2201/02497 ,  H04N2201/03112 ,  H04N2201/03125 ,  H04N2201/03133 ,  H04N2201/03141 ,  H04N2201/03145 ,  H04N2201/0458

    Abstract: An image reader (A) includes a conductive case (1), a substrate (3) and a plurality of light receiving elements. The image reader (A) further includes a first electrode (10) formed at the case (1) and a second electrode (11) formed on the substrate (3). The case (1) is formed with an accommodation recess (1g), in which a conductive contact member (20) is provided. The conductive contact member (20) is held in contact with the first electrode (10) and the second electrode (11) to electrically connect the two electrodes to each other while separating the first electrode (10) and the second electrode (11) from each other.

    Abstract translation: 图像读取器（A）包括导电壳体（1），基板（3）和多个光接收元件。 图像读取器（A）还包括形成在壳体（1）上的第一电极（10）和形成在基板（3）上的第二电极（11）。 壳体（1）形成有容纳凹部（1g），其中设置有导电接触构件（20）。 导电接触构件（20）与第一电极（10）和第二电极（11）保持接触以将两个电极彼此电连接，同时将第一电极（10）和第二电极（11）从 彼此。

    Scanning module
    84.
    发明申请
    Scanning module 审中-公开
    扫描模块

    公开(公告)号：US20080084625A1

    公开(公告)日：2008-04-10

    申请号：US11903372

    申请日：2007-09-21

    Applicant: Hsien-Chi Lin ,  Heng-Hsiang Chang

    Inventor： Hsien-Chi Lin ,  Heng-Hsiang Chang

    IPC: G02B5/08

    CPC classification number: G02B26/0816 ,  H04N1/0281 ,  H04N1/195 ,  H04N2201/03112 ,  H04N2201/03116 ,  H04N2201/03137 ,  H04N2201/03145

    Abstract: A scanning module includes a body, a reflecting unit, and an image capture unit. The body includes a reflecting chamber disposed in a surrounding wall. The surrounding wall is formed with an incident hole allowing an incident light field to be transmitted into the reflecting chamber therethrough along an incident axis. The reflecting unit is disposed within the reflecting chamber, and includes a first reflector for reflecting the incident light field, as well as second and third reflectors for reflecting light transmitted from the first reflector to the image capture unit. An angle formed between the incident axis and a normal line of the first reflector is not smaller than 30 degrees. The image capture unit is disposed nearer to the incident hole than the first reflector along a direction of the incident axis, and includes a lens, and a sensing member.

    Abstract translation: 扫描模块包括主体，反射单元和图像捕获单元。 身体包括设置在周围壁中的反射室。 周围壁形成有入射孔，允许入射光场沿着入射轴线传递到反射室中。 反射单元设置在反射室内，并且包括用于反射入射光场的第一反射器以及用于将从第一反射器传输的光反射到图像捕获单元的第二和第三反射器。 在第一反射器的入射轴与法线之间形成的角度不小于30度。 图像捕获单元沿着入射轴线的方向设置得比第一反射器更靠近入射孔，并且包括透镜和感测构件。

    Scanner carrier
    85.
    发明授权
    Scanner carrier 有权
    扫描仪载体

    公开(公告)号：US07342692B2

    公开(公告)日：2008-03-11

    申请号：US11203561

    申请日：2005-08-12

    Applicant: Wen-Yuan Chang

    Inventor： Wen-Yuan Chang

    IPC: H04N1/04 ,  H01L27/00

    CPC classification number: H04N1/031 ,  H04N1/1013 ,  H04N1/193 ,  H04N2201/02404 ,  H04N2201/03112 ,  H04N2201/0312 ,  H04N2201/03129 ,  H04N2201/03133 ,  H04N2201/03145 ,  H04N2201/0456

    Abstract: A carrier device for a contact image sense optical scanner. The carrier device incorporates a pair of magnets with identical poles facing each other or a fluid filled sealed chamber for exerting an equal pressure on a scanning module within the scanner and maintaining close contact with a document platform throughout a scanning operation.

    Abstract translation: 用于接触图像感测光学扫描仪的载体装置。 载体装置包括一对具有彼此面对的相同磁极的磁体或用于在扫描仪内的扫描模块上施加相等压力的流体填充的密封室，并在扫描操作期间保持与文件平台的紧密接触。

    Image reading apparatus with plural sensor IC chips
    86.
    发明授权
    Image reading apparatus with plural sensor IC chips 有权
    具有多个传感器IC芯片的图像读取装置

    公开(公告)号：US07317562B2

    公开(公告)日：2008-01-08

    申请号：US10406638

    申请日：2003-04-02

    Applicant: Hideki Sawada

    Inventor： Hideki Sawada

    IPC: H04N1/46

    CPC classification number: H04N1/0318 ,  H04N1/1215 ,  H04N1/193 ,  H04N2201/03112 ,  H04N2201/03133 ,  H04N2201/03137 ,  H04N2201/03145

    Abstract: An image reading apparatus includes a plurality of sensor IC chips aligned in a row. Each of the sensor IC chips incorporates a plurality of light receiving elements. The plurality of light receiving elements successively output image signals as serial analog signals corresponding to received amount of light upon receiving light from an object to be read. The number of the sensor IC chips is an integer multiple of three. The sensor IC chips are divided into blocks. The number of the blocks is an integer multiple of three. The image signals are outputted on a block-by-block basis.

    Abstract translation: 图像读取装置包括排成行的多个传感器IC芯片。 每个传感器IC芯片都包含多个光接收元件。 多个光接收元件在接收到要读取的对象的光时，连续输出图像信号作为对应于所接收的光量的串行模拟信号。 传感器IC芯片的数量为3的整数倍。 传感器IC芯片分为块。 块数是3的整数倍。 图像信号在逐块的基础上输出。

    Contact image sensor and method for manufacturing the same
    87.
    发明申请
    Contact image sensor and method for manufacturing the same 失效
    接触式图像传感器及其制造方法

    公开(公告)号：US20070057151A1

    公开(公告)日：2007-03-15

    申请号：US11516888

    申请日：2006-09-07

    Applicant: Tomihisa Saito ,  Harunobu Yoshida ,  Masahide Wakisaka ,  Masaki Kitaoka

    Inventor： Tomihisa Saito ,  Harunobu Yoshida ,  Masahide Wakisaka ,  Masaki Kitaoka

    IPC: H01L27/00

    CPC classification number: H04N1/0318 ,  H04N2201/02412 ,  H04N2201/02429 ,  H04N2201/02441 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02483 ,  H04N2201/03112 ,  H04N2201/03141 ,  H04N2201/03145

    Abstract: A contact image sensor is provided including a housing, a slit plate a lens, one or two light sources and a light-receiving element array mounted on a light-receiving element array substrate. The housing contains the slit plate, the lens, the one or two light sources and the light-receiving element array substrate. The optical system of the contact image sensor is aligned and one or more depressions are formed on an end of the substrate for the alignment. Power to the one or two light sources is applied through one or more leads. Each of the one or more depressions is large enough so that each of the leads can be passed through the respective depressions.

    Abstract translation: 提供一种接触图像传感器，包括壳体，狭缝板，透镜，一个或两个光源和安装在光接收元件阵列基板上的光接收元件阵列。 壳体包含狭缝板，透镜，一个或两个光源和光接收元件阵列基板。 接触图像传感器的光学系统对准，并且在用于对准的基板的端部上形成一个或多个凹陷。 对一个或两个光源的电力通过一个或多个引线施加。 一个或多个凹陷中的每一个都足够大，使得每个引线可以通过相应的凹陷。

    Method for manufacturing sensor frame for image sensor
    89.
    发明授权
    Method for manufacturing sensor frame for image sensor 有权
    图像传感器传感器框架的制造方法

    公开(公告)号：US07177056B2

    公开(公告)日：2007-02-13

    申请号：US10159125

    申请日：2002-06-03

    Applicant: Toshio Matsumoto

    Inventor： Toshio Matsumoto

    IPC: H04N1/04

    CPC classification number: H04N1/0318 ,  H04N2201/02487 ,  H04N2201/03112 ,  H04N2201/03141 ,  H04N2201/03145

    Abstract: A sensor frame for an image sensor is manufactured in the step of forming a sensor frame for an image sensor by extrusion molding so that a frame support portion for supporting the frame is formed above a lens array holding portion, and the step of removing the thus-formed sensor frame support portion by machining while leaving parts of the support portion located at the longitudinally corresponding to the upper ends of the lens array holding portion. Accordingly, machined surfaces subjected to the machining exist outside the hollow space where the sensor ICs are located.

    Abstract translation: 在通过挤压成型形成用于图像传感器的传感器框架的步骤中制造用于图像传感器的传感器框架，从而在透镜阵列保持部分上方形成用于支撑框架的框架支撑部分，并且移除由此 形成的传感器框架支撑部分，同时留下位于与透镜阵列保持部分的上端纵向对应的支撑部分的部分。 因此，进行加工的加工表面存在于传感器IC所在的中空空间的外部。

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