公开(公告)号：US07872401B2

公开(公告)日：2011-01-18

申请号：US12855288

申请日：2010-08-12

Applicant: Osamu Onitsuka ,  Kazuyoshi Sugama ,  Sumihiko Kurita

Inventor： Osamu Onitsuka ,  Kazuyoshi Sugama ,  Sumihiko Kurita

IPC: H01L41/08

CPC classification number: H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H9/1021 ,  H03H9/21 ,  H05K3/4061 ,  H05K2201/0248 ,  Y10T29/42 ,  H01L2924/00

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. Both surfaces of the base substrate 2 are polished. The lid substrate 3 includes a recess 3a for a cavity C and is bonded to the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the bonded piezoelectric vibrating reed. The through electrodes are formed by the hardening of paste that contains a plurality of nonspherical metal fine particles.

Abstract translation: 提供了一种压电振动器1，其包括基底基板2，盖基板3，压电振动片4，一对外部电极38和39，一对贯通电极32和33以及布线电极36和37。 对基底基板2的两面进行研磨。 盖基板3包括用于空腔C的凹部3a，并且与基板接合。 压电振动片4被接合到基底基板的上表面，从而被容纳在形成在基底基板和盖基板之间的空腔中。 一对外部电极38和39形成在基底基板的下表面上。 一对贯通电极32,33形成为通过基底基板，保持空腔内的气密性，并分别与一对外部电极电连接。 布线电极36和37形成在基底基板的上表面上，并将一对通孔电连接到键合的压电振动片上。 贯通电极通过含有多个非球形金属微粒的糊状物硬化而形成。

公开(公告)号：US20100301709A1

公开(公告)日：2010-12-02

申请号：US12855288

申请日：2010-08-12

Applicant: Osamu ONITSUKA ,  Kazuyoshi SUGAMA ,  Sumihiko KURITA

Inventor： Osamu ONITSUKA ,  Kazuyoshi SUGAMA ,  Sumihiko KURITA

IPC: H01L41/22 ,  H01L41/053 ,  H03B5/32

CPC classification number: H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H9/1021 ,  H03H9/21 ,  H05K3/4061 ,  H05K2201/0248 ,  Y10T29/42 ,  H01L2924/00

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. Both surfaces of the base substrate 2 are polished. The lid substrate 3 includes a recess 3a for a cavity C and is bonded to the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the bonded piezoelectric vibrating reed. The through electrodes are formed by the hardening of paste that contains a plurality of nonspherical metal fine particles.

Abstract translation: 提供了一种压电振动器1，其包括基底基板2，盖基板3，压电振动片4，一对外部电极38和39，一对贯通电极32和33以及布线电极36和37。 对基底基板2的两面进行研磨。 盖基板3包括用于空腔C的凹部3a，并且与基板接合。 压电振动片4被接合到基底基板的上表面，从而被容纳在形成在基底基板和盖基板之间的空腔中。 一对外部电极38和39形成在基底基板的下表面上。 一对贯通电极32,33形成为通过基底基板，保持空腔内的气密性，并分别与一对外部电极电连接。 布线电极36和37形成在基底基板的上表面上，并将一对通孔电连接到键合的压电振动片上。 贯通电极通过含有多个非球形金属微粒的糊状物硬化而形成。

公开(公告)号：US20100141376A1

公开(公告)日：2010-06-10

申请号：US12703701

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01C7/10 ,  B05D5/12 ,  B32B15/04 ,  B32B9/00

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US07341680B2

公开(公告)日：2008-03-11

申请号：US11070657

申请日：2005-03-02

Applicant: Alfred I-Tsung Pan ,  Scott T. Haubrich

Inventor： Alfred I-Tsung Pan ,  Scott T. Haubrich

IPC: H01B1/00 ,  H01B1/02 ,  B32B5/16

CPC classification number: H05K1/097 ,  H01B1/22 ,  H01B1/24 ,  H01L21/288 ,  H01L21/76801 ,  H01L29/78681 ,  H01L29/7869 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable composition further comprises a plurality of nanostructures of a second type that, upon printing and curing, at least partially fill the intermediate volumes to promote smooth surface topography and reduced porosity in the printed element.

Abstract translation: 描述了通过印刷和固化形成印刷元件的可印刷组合物。 可印刷组合物包括第一类型的多个纳米结构，其在印刷和固化时形成限定中间体积的布置。 可印刷组合物还包括第二类型的多个纳米结构，其在印刷和固化时至少部分地填充中间体积以促进印刷元件中的光滑表面形貌和降低的孔隙率。

公开(公告)号：US20060197064A1

公开(公告)日：2006-09-07

申请号：US11070657

申请日：2005-03-02

Applicant: Alfred Pan ,  Scott Haubrich

Inventor： Alfred Pan ,  Scott Haubrich

IPC: H01B1/12

CPC classification number: H05K1/097 ,  H01B1/22 ,  H01B1/24 ,  H01L21/288 ,  H01L21/76801 ,  H01L29/78681 ,  H01L29/7869 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable composition further comprises a plurality of nanostructures of a second type that, upon printing and curing, at least partially fill the intermediate volumes to promote smooth surface topography and reduced porosity in the printed element.

Abstract translation: 描述了通过印刷和固化形成印刷元件的可印刷组合物。 可印刷组合物包括第一类型的多个纳米结构，其在印刷和固化时形成限定中间体积的布置。 可印刷组合物还包括第二类型的多个纳米结构，其在印刷和固化时至少部分地填充中间体积以促进印刷元件中的光滑表面形貌和降低的孔隙率。

公开(公告)号：US20060043608A1

公开(公告)日：2006-03-02

申请号：US10711185

申请日：2004-08-31

Applicant: William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

Inventor： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

IPC: H01L23/48

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US20050277351A1

公开(公告)日：2005-12-15

申请号：US11152984

申请日：2005-06-14

Applicant: James Smith ,  Gary Stevens ,  John Wood

Inventor： James Smith ,  Gary Stevens ,  John Wood

IPC: B32B5/02 ,  B32B27/04 ,  B32B27/12 ,  C08K3/14 ,  C08K3/22 ,  C08K3/28 ,  H05K1/03

CPC classification number: C08K3/22 ,  C08K3/14 ,  C08K3/28 ,  C08K2201/016 ,  H05K1/0373 ,  H05K2201/0248 ,  Y10T428/24994 ,  Y10T428/249986 ,  Y10T428/28 ,  Y10T442/2418 ,  Y10T442/2992 ,  Y10T442/50

Abstract: In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.

Abstract translation: 在一个实施方案中，本发明提供了包含主体高度结构化树脂基质和高导热性填料30的高导热性高结构化树脂。高热导率填料的长度为1-1000nm，高导热性 填料的纵横比在3-100之间。 特别高度结构化的高度结构化树脂包括液晶40聚合物，互穿网络，树枝状聚合物基质，膨胀聚合物，梯形聚合物，星形聚合物和结构化有机 - 无机杂化物60中的至少一种。

公开(公告)号：US06938331B2

公开(公告)日：2005-09-06

申请号：US10703122

申请日：2003-11-06

Applicant: James J. deBlanc ,  David Dickey ,  Andrew Michael Cherniski

Inventor： James J. deBlanc ,  David Dickey ,  Andrew Michael Cherniski

IPC: H01P3/08 ,  H05K1/02 ,  H01R43/00

CPC classification number: H01P3/085 ,  H05K1/024 ,  H05K2201/0248 ,  H05K2201/0278 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract translation: 一种用于在诸如电路板或微电子器件的电子器件内制造丝状贴痕迹的方法。 导电迹线固定在复合衬底的表面上，该复合衬底在与基底固体材料结合的基质中含有长丝。 然后去除基质，使导电迹线悬挂或被长丝支撑。 长丝悬挂或灯丝支撑的信号线的信号强度衰减比嵌入固体电介质材料的信号线要低得多，允许在灯丝悬挂和灯丝支持的信号线中传输明显更高的频率信号。

公开(公告)号：US20050062168A1

公开(公告)日：2005-03-24

申请号：US10936503

申请日：2004-09-09

Applicant: Takeshi Sano ,  Yoshihiro Yoshida ,  Hideaki Ohkura ,  Hirofumi Kobayashi

Inventor： Takeshi Sano ,  Yoshihiro Yoshida ,  Hideaki Ohkura ,  Hirofumi Kobayashi

IPC: H01L21/60 ,  H01L23/485 ,  H05K1/18 ,  H05K3/32 ,  H05K3/36 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13369 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81855 ,  H01L2224/81885 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0379 ,  H05K2203/0425 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29369 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2929 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.

Abstract translation: 所公开的接合结构包括具有第一电极的第一电结构，具有第二电极的第二电结构和用于电和机械地结合第一电极和第二电极的中间部分。 中间部分由导电粘合剂组成，其中金属颗粒的熔融粘合提供给第一电极和第二电极中的至少一个。 金属颗粒能够在低于导电粘合剂的热硬化温度的温度下熔合。 导电性粘合剂含有导电性填料片，其导电性填充片具有在比导电性粘合剂的热硬化温度低的温度下不发生熔融粘结的粒径。

公开(公告)号：US06818155B2

公开(公告)日：2004-11-16

申请号：US10039300

申请日：2002-01-02

Applicant: George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: H01L2943

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.

Abstract translation: 使用聚合物和磁性材料颗粒的组合物将组分偶联到下面的衬底上。 当在组件和印刷电路板之间施加组合物时，可以对组合物进行磁场以将磁性材料颗粒对准到组件和下层衬底之间的导电路径中。 同时，聚合物基材料可以固化或固化，以固定由磁性材料颗粒形成的导电路径。