Method of Manufacturing Circuit Boards
    3.
    发明申请

    公开(公告)号:US20180279481A1

    公开(公告)日:2018-09-27

    申请号:US15761366

    申请日:2017-05-18

    Inventor: Michael Gay

    Abstract: Methods for manufacturing electrical circuits on laminates from low profile copper layers where one or more of the circuits have known and reproducible signal losses. The method for manufacturing printed circuit boards (40) comprising the steps of: providing a planar sheet (16) including a planar dielectric material layer having a first planar surface and a second planar surface, and first copper foil sheet (10) having a first planar surface and a second planar surface wherein the first copper foil planar surface is associated with the first dielectric material layer planar surface and wherein the first copper foil sheet first surface and second surface each include a bond enhancement layer (12, 14); and forming a circuit pattern (32, 34, 36) in the first planar copper sheet by removing unnecessary portions of the first planar copper sheet while leaving the circuit pattern copper in place to form an inner layer sheet including a circuit pattern wherein a bond enhancement layer is not applied to the circuit pattern after forming the circuit pattern.

    Mounting board connector with reinforcing plate
    8.
    发明授权
    Mounting board connector with reinforcing plate 失效
    带加强板的安装板连接器

    公开(公告)号:US08282416B2

    公开(公告)日:2012-10-09

    申请号:US13059677

    申请日:2008-08-22

    Abstract: A reinforcing plate fixed to a connector main body is arranged on a bottom surface of the connector main body to come into surface contact with a surface of a substrate while a plurality of holes is provided on a surface, which contacts the substrate, of the reinforcing plate. When the reinforcing plate is soldered to the substrate, therefore, a solder wraps around not only a peripheral edge of the reinforcing plate but also an edge of each of the holes so that a soldering portion between the reinforcing plate and the substrate can be sufficiently ensured.

    Abstract translation: 固定到连接器主体的加强板设置在连接器主体的底表面上以与基板的表面进行表面接触,同时在与基板接触的表面上设置多个孔,该加强板与加强件 盘子。 因此,当加强板焊接到基板上时,焊料不仅包围加强板的周缘,而且还包围每个孔的边缘,使得能够充分地确保加强板和基板之间的焊接部分 。

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