公开(公告)号：US07534648B2

公开(公告)日：2009-05-19

申请号：US11479246

申请日：2006-06-29

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: H01L21/00

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且可以将复合材料的开口形成为对应于在纳米丝阵列中提供的空间的复合材料。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US20090121195A1

公开(公告)日：2009-05-14

申请号：US12130441

申请日：2008-05-30

Applicant: Eun Sung Lee ,  Sang Mock Lee ,  Young Hun Byun

Inventor： Eun Sung Lee ,  Sang Mock Lee ,  Young Hun Byun

IPC: H01B1/00

CPC classification number: H01G4/33 ,  B82Y10/00 ,  H01G4/206 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323

Abstract: A high dielectric polymer composite having a high dielectric constant is disclosed herein. The high dielectric polymer composite includes a conductive material doped with oxidizable metal nanoparticles or metal oxide nanoparticles to decrease dielectric loss, and a surfactant having a head portion containing an acidic functional group to form a passivation layer that surrounds the conductive material, resulting in increased dielectric constant.

Abstract translation: 本文公开了具有高介电常数的高介电聚合物复合材料。 高介电聚合物复合材料包括掺杂有可氧化金属纳米颗粒或金属氧化物纳米颗粒以降低介电损耗的导电材料，以及具有包含酸性官能团的头部的表面活性剂，以形成围绕导电材料的钝化层，导致增加的电介质 不变。

公开(公告)号：US20090038832A1

公开(公告)日：2009-02-12

申请号：US11891350

申请日：2007-08-10

Applicant: Sterling Chaffins ,  Kevin P. DeKam ,  David P. Markel ,  Karl S. Weibezahn

Inventor： Sterling Chaffins ,  Kevin P. DeKam ,  David P. Markel ,  Karl S. Weibezahn

IPC: H05K1/09 ,  H05H1/32

CPC classification number: H05K3/323 ,  B82Y10/00 ,  H05K1/0293 ,  H05K3/4038 ,  H05K2201/026 ,  H05K2203/105

Abstract: Carbon nanotubes are dispersed in a curable polymer matrix to form a dispersion. When electrical energy is applied to the dispersion, the carbon nanotubes become oriented to form an electrical path. The polymer matrix is cured to fix the electrical path.

Abstract translation: 将碳纳米管分散在可固化聚合物基质中以形成分散体。 当将电能施加到分散体时，碳纳米管变为取向以形成电路径。 固化聚合物基质以固定电路径。

公开(公告)号：US20080286447A1

公开(公告)日：2008-11-20

申请号：US12098329

申请日：2008-04-04

Applicant: Jonathan S. Alden ,  Haixia Dai ,  Michael R. Knapp ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid ,  Adrian Winoto ,  Jeffrey Wolk

Inventor： Jonathan S. Alden ,  Haixia Dai ,  Michael R. Knapp ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid ,  Adrian Winoto ,  Jeffrey Wolk

IPC: B05D5/12

CPC classification number: H01B1/22 ,  B22F1/0025 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是光学透明和柔性的。 它可以涂覆或层压在各种基材上，包括柔性和刚性基材。

公开(公告)号：US20080169563A1

公开(公告)日：2008-07-17

申请号：US11898750

申请日：2007-09-14

Applicant: Yuji Awano ,  Masataka Mizukoshi

Inventor： Yuji Awano ,  Masataka Mizukoshi

IPC: H01L23/49 ,  H01L21/60

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/12 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1134 ,  H01L2224/13193 ,  H01L2224/13582 ,  H01L2224/13693 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/026 ,  H05K2201/09472 ,  H05K2201/209 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, the connection mechanism electrically connecting the semiconductor device and the circuit board via the first conductive terminal and the second conductive terminal. At least one of the first conductive terminal and the second conductive terminal of the connection mechanism includes one or more carbon nanotubes each having one end thereof fixed to the surface of the at least one of the first conductive terminal and the second conductive terminal, and extending in a direction away from the surface. The first conductive terminal and the second conductive terminal engage each other through the carbon nanotubes.

Abstract translation: 公开了一种包括半导体器件的半导体封装; 电路板; 以及连接机构，其包括设置在所述半导体器件上的第一导电端子和设置在所述电路板侧的第二导电端子，所述连接机构经由所述第一导电端子和所述第二导电端子电连接所述半导体器件和所述电路板。 连接机构的第一导电端子和第二导电端子中的至少一个包括一个或多个碳纳米管，每个碳纳米管的一端固定到第一导电端子和第二导电端子中的至少一个的表面，并且延伸 在远离表面的方向上。 第一导电端子和第二导电端子通过碳纳米管彼此接合。

公开(公告)号：US20080144319A1

公开(公告)日：2008-06-19

申请号：US11627601

申请日：2007-01-26

Applicant: CHANG-SHEN CHANG ,  JUEI-KHAI LIU ,  CHAO-HAO WANG ,  HSIEN-SHENG PEI

Inventor： CHANG-SHEN CHANG ,  JUEI-KHAI LIU ,  CHAO-HAO WANG ,  HSIEN-SHENG PEI

IPC: F21V29/02

CPC classification number: F21V29/51 ,  B82Y10/00 ,  F21V29/004 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21V29/767 ,  F21V29/773 ,  F21V29/777 ,  F21V29/89 ,  F21Y2115/10 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/046 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

Abstract translation: 发光二极管（LED）组件包括电路板（10），至少一个LED（20）与电路板的一侧电连接并布置在电路板的一侧;散热装置（40） 电路板的相对侧。 电路板限定对应于至少一个LED的位置的至少一个通孔（102）。 热界面材料（140）填充在电路板的至少一个孔中，以热连接至少一个LED和散热装置。 热界面材料是纳米材料和大分子材料的组成。

公开(公告)号：US20080137307A1

公开(公告)日：2008-06-12

申请号：US11608384

申请日：2006-12-08

Applicant: Chris Erwin Orr ,  David S. Slaton

Inventor： Chris Erwin Orr ,  David S. Slaton

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  B82Y10/00 ,  F28D15/00 ,  F28D15/0266 ,  F28D2015/0225 ,  F28F3/12 ,  H01L23/467 ,  H01L2224/16 ,  H05K1/0272 ,  H05K1/112 ,  H05K2201/026 ,  H05K2201/064

Abstract: A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.

Abstract translation: 提供了一种从电子设备提取热量的系统。 该系统包括位于印刷电路板内的散热装置，以形成板内散热器结构和设置在散热装置中的流体传热介质。 介质通过散热装置循环，从电子设备携带热量。

公开(公告)号：US20080086876A1

公开(公告)日：2008-04-17

申请号：US11897077

申请日：2007-08-29

Applicant: Joel S. Douglas

Inventor： Joel S. Douglas

IPC: H05K3/10

CPC classification number: H05K1/095 ,  B82Y10/00 ,  H05K3/245 ,  H05K3/328 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/0285 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A method for producing a circuit assembly having a non-conductive substrate upon which printed conductors may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.

Abstract translation: 一种用于制造具有非导电基底的电路组件的方法，印刷导体可以容易且选择性地互连到另一个电路组件装置和/或装置。

公开(公告)号：US20080054255A1

公开(公告)日：2008-03-06

申请号：US11625791

申请日：2007-01-22

Applicant: Lih-Hsiung Chan ,  Ming-Chun Hsiao ,  Wei-Ling Lin ,  Gary Wei

Inventor： Lih-Hsiung Chan ,  Ming-Chun Hsiao ,  Wei-Ling Lin ,  Gary Wei

IPC: H01L29/08

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  H01L29/0673 ,  H01L29/43 ,  H01L51/0097 ,  H05K1/0393 ,  H05K3/207 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2203/016

Abstract: Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).

Abstract translation: 基板结构及其制造方法。 基板结构包括可弯曲基板和可弯曲结构上的无机电极结构，其中无机电极结构包括导电层或半导体层。 无机电极结构包括碳纳米管，碳纳米纤维，纳米线材或微线材。 可弯曲基材包括聚乙烯（PE），聚酰亚胺（PI），聚乙烯醇（PVA）或聚甲基丙烯酸甲酯（PMMA）。

公开(公告)号：US20080035370A1

公开(公告)日：2008-02-14

申请号：US11829951

申请日：2007-07-29

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H05K1/09 ,  C23C18/54

CPC classification number: C25D15/00 ,  B82Y10/00 ,  C25D5/02 ,  C25D5/18 ,  C25D5/56 ,  C25D7/123 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/242 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0738 ,  H05K2203/105

Abstract: An electronic device comprising voltage switchable dielectric material (VSD) material that is composed in part of organic particles.

Abstract translation: 一种电子装置，包括部分由有机颗粒组成的可变压介电材料（VSD）材料。