公开(公告)号：US08766102B2

公开(公告)日：2014-07-01

申请号：US13663303

申请日：2012-10-29

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H05K1/03 ,  H05K7/02

CPC classification number: H05K1/056 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09054 ,  H05K2203/0323 ,  H05K2203/0384 ,  H05K2203/063 ,  H01L2924/00

Abstract: A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board.

Abstract translation: 公开了至少包括金属基板，阻挡层，桨，绝缘层，电路层和阻焊剂的芯片支撑板结构。 电路层与桨连接。 阻挡层的材料与金属基板的材料不同，并且在金属基板和板之间设置阻挡层，使得桨的形状和深度保持恒定，并且具有不同深度并容易剥离的问题 从而提高了芯片支撑板的成品率。

公开(公告)号：US20140119000A1

公开(公告)日：2014-05-01

申请号：US13806751

申请日：2012-11-08

Applicant: Tian Zhang ,  Yuchun Hsiao

Inventor： Tian Zhang ,  Yuchun Hsiao

IPC: F21V29/00 ,  F21V21/005

CPC classification number: F21V29/70 ,  F21V21/005 ,  G02B6/0083 ,  G02B6/0085 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10522

Abstract: The present invention provides an LED light bar and a backlight module using the LED light bar. The LED light bar includes a heat dissipation strip, a PCB mounted on the heat dissipation strip, LED chips mounted on the heat dissipation strip and electrically connected to the PCB, and a thermal interface material layer arranged between the LED chips and the heat dissipation strip. The LED light bar and the backlight module using the LED light bar according to the present invention arrange LED chips to be mounted to a heat dissipation strip that is of bettered thermal conduction performance to thereby avoid the conventional process of transferring terminal energy through a PCB that is of poor heat dissipation. The art is simple and the entire heat dissipation path is shortened to achieve excellent heat dissipation performance and thus ensure the quality of backlighting.

Abstract translation: 本发明提供一种LED灯条和使用该LED灯条的背光模组。 LED灯条包括散热条，安装在散热条上的PCB，安装在散热条上并电连接到PCB的LED芯片，以及布置在LED芯片和散热条之间的热界面材料层 。 根据本发明的LED灯条和使用LED灯条的背光模块将LED芯片安排在具有更好的导热性能的散热条上，从而避免了将终端能量传递到PCB的传统工艺 散热差。 艺术简单，整个散热路径缩短，达到优异的散热性能，从而保证了背光的质量。

公开(公告)号：US20140116757A1

公开(公告)日：2014-05-01

申请号：US13663303

申请日：2012-10-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H05K1/05

CPC classification number: H05K1/056 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09054 ,  H05K2203/0323 ,  H05K2203/0384 ,  H05K2203/063 ,  H01L2924/00

Abstract: A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board.

Abstract translation: 公开了至少包括金属基板，阻挡层，桨，绝缘层，电路层和阻焊剂的芯片支撑板结构。 电路层与桨连接。 阻挡层的材料与金属基板的材料不同，并且在金属基板和板之间设置阻挡层，使得桨的形状和深度保持恒定，并且具有不同深度并容易剥离的问题 从而提高了芯片支撑板的成品率。

公开(公告)号：US08633643B2

公开(公告)日：2014-01-21

申请号：US12956812

申请日：2010-11-30

Applicant: Young Jin Lee ,  Hyung Kun Kim

Inventor： Young Jin Lee ,  Hyung Kun Kim

IPC: H01J1/62 ,  F21V1/00 ,  H01L21/00 ,  H01L33/00

CPC classification number: H01L33/647 ,  F21S41/147 ,  F21V29/677 ,  F21V29/89 ,  H01L2224/13 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10174 ,  H05K2201/10969

Abstract: Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.

Abstract translation: 公开了一种LED封装，具有该LED封装的LED封装模块及其制造方法以及具有该LED封装模块及其控制方法的头灯模块。 发光二极管封装包括：封装衬底; 安装在所述封装基板的一个表面上的发光二极管芯片; 电极焊盘，形成在所述封装基板的另一个表面上并电连接到所述发光二极管芯片; 以及形成在所述封装基板的另一表面上并与所述电极焊盘电绝缘的散热焊盘。

公开(公告)号：US08525214B2

公开(公告)日：2013-09-03

申请号：US13111966

申请日：2011-05-20

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

IPC: H01L33/00 ,  H01L23/367 ,  H01L23/34

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace, an adhesive and a support layer. The heat spreader includes a post, a base, an underlayer and a thermal via. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post, the support layer is sandwiched between the base and the underlayer and the thermal via extends from the base through the support layer to the underlayer. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线，粘合剂和支撑层。 散热器包括柱，基座，​​底层和热通孔。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 柱从基部向上延伸到粘合剂中的开口中，基部从柱延伸，支撑层夹在基部和底层之间，并且热通孔从基部延伸穿过支撑层到底层。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20130206459A1

公开(公告)日：2013-08-15

申请号：US13878319

申请日：2011-10-05

Applicant: Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

Inventor： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC: H05K1/02

CPC classification number: H05K1/021 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/73203 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract translation: 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US20130021769A1

公开(公告)日：2013-01-24

申请号：US13629740

申请日：2012-09-28

Applicant: FUJITSU LIMITED

Inventor： Kenji FUKUZONO

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H01L23/4006 ,  H01L23/13 ,  H01L23/36 ,  H01L25/18 ,  H01L2023/4037 ,  H01L2023/4062 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/141 ,  H05K3/0061 ,  H05K2201/09054 ,  Y10T29/49139 ,  H01L2924/00

Abstract: A multichip module includes an arithmetic element that is a semiconductor element that executes arithmetic processing and a memory element that is arranged opposite the arithmetic element and that is a semiconductor element that stores therein data. Then, the multichip module includes the arithmetic element mounted thereon and includes a package board that includes, on a surface on which the arithmetic element is mounted, an external terminal that connects another part. Furthermore, the multichip module includes a reinforcing part on a surface at the opposite side from the surface of the package board on which the external terminal and that is arranged such that the reinforcing part covers an area from outside the peripheral portion of the arithmetic element to a predetermined position located on the central side of the package board.

Abstract translation: 多芯片模块包括作为执行算术处理的半导体元件的运算元件和与算术元件相对配置的存储元件，并且是存储数据的半导体元件。 然后，多芯片模块包括安装在其上的运算元件，并且包括封装板，其在安装有运算元件的表面上包括连接另一部分的外部端子。 此外，多芯片模块在与封装基板的与外部端子的表面相反一侧的表面上具有加强部，该加强部配置成使得加强部覆盖从运算元件的周边部分的外部到达的区域 位于包装板的中心侧的预定位置。

公开(公告)号：US20130003306A1

公开(公告)日：2013-01-03

申请号：US13611203

申请日：2012-09-12

Applicant: Shinsuke Oota ,  Mitsuhiro Saitou ,  Yutaka Oohashi

Inventor： Shinsuke Oota ,  Mitsuhiro Saitou ,  Yutaka Oohashi

IPC: H05K7/20

CPC classification number: H05K7/20854 ,  B60R16/0239 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/42 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/42 ,  H05K5/0082 ,  H05K2201/0187 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/1056 ,  Y10T29/49117 ,  H01L2924/00

Abstract: An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

Abstract translation: 公开了一种电子控制单元。 电子控制单元包括：树脂板; 表面安装在树脂板上的功率器件; 微型计算机，被配置为控制所述功率器件; 第一散热装置，用于散热，第一散热装置设置在树脂板与动力装置相反的一侧; 以及第一热传导装置，用于将由功率装置产生的热量传导到第一散热装置。

公开(公告)号：US08310043B2

公开(公告)日：2012-11-13

申请号：US12975429

申请日：2010-12-22

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/60 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L33/483 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/0104 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base, an ESD protection layer and an underlayer. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace, electrically isolated from the underlayer and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ESD protection layer is sandwiched between the base and the underlayer. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括支柱，基座，​​ESD保护层和底层。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线，与底层电隔离并热连接到散热器。 柱从基部向上延伸到粘合剂中的开口中，基部从柱延伸，并且ESD保护层夹在基部和底层之间。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US08288792B2

公开(公告)日：2012-10-16

申请号：US12987166

申请日：2011-01-10

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L23/367 ,  H01L23/34

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 散热器包括第一柱，第二柱和基部。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 第一柱从第一垂直方向的基部延伸到第一粘合剂中的第一开口中，第二柱从第二垂直方向的基部延伸到第二粘合剂中的第二开口中，并且基部夹在两侧之间并且横向延伸 从帖子。 导电迹线提供焊盘和端子之间的信号路由。