公开(公告)号：US11936968B2

公开(公告)日：2024-03-19

申请号：US17726135

申请日：2022-04-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Hae Sik Kim ,  So Hee Choi ,  Jee Heum Paik ,  Na Kyung Kwon

IPC: H05K1/18 ,  H04N23/54 ,  H04N23/57

CPC classification number: H04N23/54 ,  H04N23/57 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0338 ,  H05K2201/09409 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10969

Abstract: A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion disposed on the second insulating region and separated from the second-first pattern portion.

公开(公告)号：US11769247B2

公开(公告)日：2023-09-26

申请号：US17544896

申请日：2021-12-07

Applicant: Texas Instruments Incorporated

Inventor： Reynaldo Corpuz Javier ,  Alok Kumar Lohia ,  Andy Quang Tran

IPC: G06T7/00 ,  H01L23/495 ,  H01L23/00 ,  H05K3/34

CPC classification number: G06T7/0008 ,  H01L23/49503 ,  H01L23/49555 ,  H01L23/49568 ,  H01L24/00 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H05K3/3421 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An IC assembly including an exposed pad integrated circuit (“IC”) package having a thermal pad with a top surface and a bottom surface and with at least one peripheral surface portion extending transversely of and continuous with the bottom surface. The bottom surface and the at least one peripheral surface are exposed through a layer of mold compound. Also, methods of making an exposed pad integrated circuit (“IC”) package assembly. One method includes optically inspecting a solder bond bonding a thermal pad of an exposed pad IC package to a printed circuit board. Another method includes wave soldering an exposed pad of an IC package to a printed circuit board.

公开(公告)号：US09743521B2

公开(公告)日：2017-08-22

申请号：US13496539

申请日：2010-09-10

Applicant: Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

Inventor： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

IPC: F21V9/00 ,  H05K1/18 ,  F21S2/00 ,  H05B33/08 ,  F21V23/06 ,  G02F1/1335 ,  H01L25/075 ,  H05K1/11 ,  F21Y115/10 ,  F21Y113/13

CPC classification number: H05K1/181 ,  F21S2/005 ,  F21V23/06 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133612 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05B33/0824 ,  H05K1/117 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

Abstract: A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module.

公开(公告)号：US09686887B2

公开(公告)日：2017-06-20

申请号：US14854402

申请日：2015-09-15

Applicant: Nicholas Michael D'Onofrio

Inventor： Nicholas Michael D'Onofrio

IPC: H05K7/20 ,  H05K1/05 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K7/20218 ,  H05K1/0209 ,  H05K1/05 ,  H05K3/0061 ,  H05K2201/064 ,  H05K2201/10409 ,  H05K2201/10969

Abstract: The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board. In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.

公开(公告)号：US20160192493A1

公开(公告)日：2016-06-30

申请号：US14910712

申请日：2014-08-07

Applicant: BROSE FAHRZEUGTEILE GMBH & CO. KOMMANDITGESELLSCHAFT, WÜRZBURG

Inventor： Steffen Ehrmann ,  Stefan Zick

IPC: H05K1/18 ,  H03K17/687 ,  H05K1/02 ,  H03K17/567 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  H03K17/567 ,  H03K17/687 ,  H05K1/021 ,  H05K1/111 ,  H05K1/119 ,  H05K3/202 ,  H05K3/3452 ,  H05K2201/066 ,  H05K2201/09118 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  Y02P70/611

Abstract: The present invention relates to a circuit board assembly, comprising a circuit board which has a first and a second solder region, which is galvanically separated from the first, and which furthermore has a separator arranged between the solder regions and rising out from the solder regions, having a power semiconductor component which has a housing having an output connection side, from which at least one control connection and a plurality of output connections protrude, which are arranged substantially adjacent to each other on the output connection side, wherein the control connection is electrically and mechanically connected to the first solder region and the output connections are electrically and mechanically connected to the second solder region and the control connection is separated from the output connections via the raised separator. The present invention furthermore relates to a control device for a cooler fan module of a motor vehicle and a method for assembling a power semiconductor component on a circuit board.

Abstract translation: 电路板组件技术领域本发明涉及一种电路板组件，其包括具有第一和第二焊料区域的电路板，所述第一和第二焊料区域与第一焊料区域电流分离，并且还具有布置在焊料区域之间并从焊接区域上升出的隔板 具有功率半导体部件，所述功率半导体部件具有壳体，所述壳体具有输出连接侧，至少一个控制连接和多个输出连接突出，所述至少一个控制连接和多个输出连接在所述输出连接侧彼此基本相邻配置，其中所述控制连接 电气和机械连接到第一焊料区域，并且输出连接件电连接和机械连接到第二焊接区域，并且控制连接经由升高的分离器与输出连接件分离。 本发明还涉及一种用于机动车辆的冷却器风扇模块的控制装置和用于在电路板上组装功率半导体部件的方法。

公开(公告)号：US09307675B2

公开(公告)日：2016-04-05

申请号：US13878637

申请日：2011-10-10

Applicant: Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

Inventor： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC: F21V29/00 ,  H05K7/20 ,  H01L23/367 ,  H01L25/075 ,  H01L33/64 ,  H05K3/30 ,  H05K13/00 ,  G02F1/1335 ,  H05K1/02 ,  H05K3/46 ,  F21V29/70 ,  H05K1/05 ,  H05K1/11

CPC classification number: H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract translation: 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US09265144B2

公开(公告)日：2016-02-16

申请号：US13994253

申请日：2012-10-18

Applicant: Panasonic Corporation

Inventor： Masanori Minamio ,  Hiroki Ikeuchi

IPC: H05K1/00 ,  H05K1/03 ,  H01L23/29 ,  H01L23/427 ,  H01L23/433 ,  H01L23/495 ,  H01L23/498 ,  H05K3/46 ,  H01L23/31 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/0306 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/4275 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49861 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0224 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/186 ,  H05K3/284 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0227 ,  H05K2201/0376 ,  H05K2201/0723 ,  H05K2201/1056 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

Abstract translation: 半导体器件是包括用第一树脂6模制的半导体元件T1的树脂封装结构。第一树脂6包含填充物7，填充物7包括用相变材料包围的电绝缘胶囊，其吸收周围热量和相变 以提高介电强度。 填料7的效果达到具有令人满意的散热和高耐受电压的结构。

公开(公告)号：US09167703B2

公开(公告)日：2015-10-20

申请号：US12576542

申请日：2009-10-09

Applicant: Laurent Vivet ,  Jean-Michel Morelle ,  Sandra Dimelli ,  Laurent Deneu-Fontaine ,  Romaric Lenoir

Inventor： Laurent Vivet ,  Jean-Michel Morelle ,  Sandra Dimelli ,  Laurent Deneu-Fontaine ,  Romaric Lenoir

IPC: H05K3/34 ,  B23K1/005 ,  H01L23/00 ,  B23K3/06

CPC classification number: H05K3/34 ,  B23K1/0056 ,  B23K3/0607 ,  B23K2101/36 ,  H01L24/75 ,  H01L2924/12042 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/10969 ,  H05K2203/0195 ,  H05K2203/0415 ,  H05K2203/107 ,  H05K2203/163 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.

Abstract translation: 在该方法中，垂直堆叠形成在与重力方向基本重合的轴上，并且包括从顶部到底部的元件; 质量处于固体状态; 和基板。 然后将该质量加热以使其进入液态，使其能够在基底上扩散。 更具体地说，在堆叠已经形成之后，元件可以自由地垂直移动，并且在加热期间，测量元件的垂直位置的变化。

公开(公告)号：US20150271922A1

公开(公告)日：2015-09-24

申请号：US14428008

申请日：2012-11-13

Applicant: Ryohei Kawabata ,  Yuichiro Takarabe

Inventor： Ryohei Kawabata ,  Yuichiro Takarabe

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/18 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10659 ,  H05K2201/10757 ,  H05K2201/10969

Abstract: A printed circuit board mounted with a power module having both a plurality of lead terminals for soldering and at least one screw terminal for screwing includes a through hole which receives the lead terminal and is soldered to the lead terminal, and an electrode section provided with a screw hole fastened to the screw terminal via a screw. A groove is formed between the electrode section and the through hole so as to intersect with two common tangents each connecting, to an outer periphery of a land of the through hole, an outer periphery of a contact area of the electrode section which is in contact with a head bearing surface of a screw or a washer.

Abstract translation: 安装有具有用于焊接的多个引线端子和用于螺纹连接的至少一个螺钉端子的功率模块的印刷电路板包括：接纳引线端子并被焊接到引线端子的通孔;以及电极部， 螺丝孔通过螺钉固定在螺丝端子上。 在电极部分和通孔之间形成一个沟槽，以便与两个共同的切线相交，所述两个共同的切线连接到通孔的焊盘的外围，与接触的电极部分的接触区域的外周 具有螺钉或垫圈的头部轴承表面。

公开(公告)号：US09018667B2

公开(公告)日：2015-04-28

申请号：US12758040

申请日：2010-04-12

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/495 ,  H05K1/02 ,  H01L33/48 ,  H01L33/64 ,  H05K3/00 ,  H05K3/38

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49575 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部穿过第一粘合剂中的开口向上延伸，并且基部从柱横向延伸。 第一粘合剂在基部和导电迹线之间延伸，并且第二粘合剂在柱和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。