公开(公告)号：US20140137928A1

公开(公告)日：2014-05-22

申请号：US14165933

申请日：2014-01-28

Applicant: Global Solar Energy, Inc.

Inventor： Scott WIEDEMAN ,  Jeffrey S. BRITT

IPC: H01L31/05

CPC classification number: H01L31/0508 ,  H01L31/0445 ,  H01L31/048 ,  H01L31/05 ,  H01L31/0504 ,  H01L31/0512 ,  H01L31/18 ,  H05K1/181 ,  H05K2201/10143 ,  Y02E10/50 ,  Y10T156/1051 ,  Y10T428/24314

Abstract: Thin film photovoltaic cells and strings of cells may be electrically joined in series. More specifically, electrical contacts between photovoltaic cells may be formed by positioning the cells between a pair of interconnection substrates, each of which includes a conductive grid. By positioning the cells appropriately between the substrates, an electrical connection is formed between one polarity of a given cell and the opposite polarity of an adjacent cell.

Abstract translation: 薄膜光伏电池和电池串可以串联电连接。 更具体地，可以通过将单元定位在一对互连基板之间来形成光伏电池之间的电接触，每对互连基板包括导电栅格。 通过将电池适当地定位在基板之间，在给定电池的一个极性与相邻电池的相反极性之间形成电连接。

公开(公告)号：US20130323526A1

公开(公告)日：2013-12-05

申请号：US13904221

申请日：2013-05-29

Applicant: Essence Solar Solutions Ltd.

Inventor： Slava HASIN ,  Ron Helfan

IPC: H05K13/04 ,  B32B3/06 ,  B32B7/12

CPC classification number: H01L31/052 ,  B32B3/06 ,  B32B7/12 ,  H01L21/683 ,  H01L31/02008 ,  H01L31/0232 ,  H01L31/0543 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/05 ,  H05K13/0465 ,  H05K2201/10143 ,  Y02E10/52 ,  Y10T29/5313 ,  Y10T428/12382 ,  H01L2924/00014

Abstract: A substrate pad for soldering at least one self-aligning component thereon, wherein at least one edge of a body of the substrate pad is shaped to conform to a corresponding edge of a component pad, and the at least one edge of the body of the substrate pad further include a plurality of pad fingers leading away from the substrate pad. Related apparatus and methods are also described.

Abstract translation: 一种用于在其上焊接至少一个自对准部件的衬底焊盘，其中所述衬底焊盘的主体的至少一个边缘被成形为符合部件焊盘的对应边缘，并且所述主体的所述至少一个边缘 衬底焊盘还包括引导离开衬底焊盘的多个焊盘指状物。 还描述了相关装置和方法。

公开(公告)号：US20130247977A1

公开(公告)日：2013-09-26

申请号：US13896853

申请日：2013-05-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koichi Kumai ,  Ryuji Ueda ,  Kentaro Kubota ,  Shigeki Kudo ,  Minoru Kawasaki

IPC: H01L31/02 ,  H05K1/02 ,  H05K3/20

CPC classification number: H01L31/02008 ,  H01L31/02021 ,  H01L31/0516 ,  H05K1/02 ,  H05K1/181 ,  H05K3/20 ,  H05K3/202 ,  H05K2201/10143 ,  H05K2203/0221 ,  H05K2203/033 ,  H05K2203/1545 ,  Y02E10/50 ,  Y10T29/49156 ,  Y10T156/1002

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract translation: 一种制造电路板的方法包括：通过切割保持在保持片上的金属箔来除去金属箔的一部分，在保持片上形成多个金属电极以彼此分离; 在所述多个金属电极的表面上形成粘合剂层; 通过使粘合剂层与基材紧密接触，将粘合剂层粘合到基材上; 以及通过从多个金属电极分离保持片，将粘合剂层和多个金属电极转印到基材上。

公开(公告)号：US20130160841A1

公开(公告)日：2013-06-27

申请号：US13561477

申请日：2012-07-30

Applicant: Susumu Kawakami

Inventor： Susumu Kawakami

IPC: C09J139/04 ,  H01L31/02 ,  H05K1/14

CPC classification number: C09J139/04 ,  C08L2312/08 ,  C09J143/04 ,  H01L31/0512 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10143 ,  H05K2203/121 ,  Y02E10/50

Abstract: Provided is an adhesive composition containing an organoaluminum complex (A), a silane coupling agent (B), and a curable component (C).

Abstract translation: 提供了含有有机铝配合物（A），硅烷偶联剂（B）和可固化组分（C）的粘合剂组合物。

公开(公告)号：US20130089990A1

公开(公告)日：2013-04-11

申请号：US13688089

申请日：2012-11-28

Applicant: ELECTRONVAULT, INC.

Inventor： Robert R. Ferber, JR.

IPC: H01R12/00 ,  H01R11/30

CPC classification number: H01R12/00 ,  H01L31/0504 ,  H01M2/202 ,  H01M2/348 ,  H01M8/0202 ,  H01M10/4235 ,  H01M2200/10 ,  H01R11/30 ,  H05K1/189 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/083 ,  H05K2201/10037 ,  H05K2201/10143 ,  Y02E10/50

Abstract: A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.

Abstract translation: 提供了可释放模块化互连形式的模块化互连系统。 可释放的模块化互连可以包括具有多个可释放接触区域的基板，其中每个可释放的接触区域可以被定位成覆盖功率单元的相应端子。 可释放的模块化互连还可以包括固定到衬底的至少一个导电互连构件，其中导电互连构件包括设置在衬底的可释放接触区域内的至少一个导电可释放触点。 当向朝向动力单元的端子的方向向第一可释放接触区域施加力时，导电可释放接触件可被定位成与功率单元的端子形成可释放的电连接。 还提供了附加的和相关的方法和装置。

公开(公告)号：US20120167954A1

公开(公告)日：2012-07-05

申请号：US13419176

申请日：2012-03-13

Applicant: David H. Meakin ,  Fares Bagh

Inventor： David H. Meakin ,  Fares Bagh

IPC: H01L31/05

CPC classification number: H01L31/0516 ,  H01L31/048 ,  H01L31/0504 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/10143 ,  H05K2203/0522 ,  Y02E10/50

Abstract: Embodiments of the invention contemplate the formation of a solar cell module comprising an array of interconnected solar cells that are formed using an automated processing sequence that is used to form a novel solar cell interconnect structure. In one embodiment, the module structure described herein includes a patterned adhesive layer that is disposed on a backsheet to receive and bond a plurality of patterned conducting ribbons thereon. The bonded conducting ribbons are then used to interconnect an array of solar cell devices to form a solar cell module that can be electrically connected to external components that can receive the solar cell module's generated electricity.

Abstract translation: 本发明的实施例考虑了太阳能电池模块的形成，该太阳能电池模块包括使用用于形成新型太阳能电池互连结构的自动化处理顺序形成的互连太阳能电池阵列。 在一个实施例中，本文所述的模块结构包括图案化的粘合剂层，其设置在底片上以在其上接收和结合多个图案化的导电带。 接合的导电带然后用于互连太阳能电池阵列阵列以形成太阳能电池模块，该太阳能电池模块可以电连接到可以接收太阳能电池模块的发电的外部组件。

公开(公告)号：US20120000502A1

公开(公告)日：2012-01-05

申请号：US12980201

申请日：2010-12-28

Applicant: Scott Wiedeman ,  Jeffrey S. Britt ,  Zulima Rhodes ,  Eric Sheehan

Inventor： Scott Wiedeman ,  Jeffrey S. Britt ,  Zulima Rhodes ,  Eric Sheehan

IPC: H01L31/05 ,  H01L31/042 ,  H01L31/18 ,  B32B3/10

CPC classification number: H01L31/0508 ,  H01L31/0445 ,  H01L31/048 ,  H01L31/05 ,  H01L31/0504 ,  H01L31/0512 ,  H01L31/18 ,  H05K1/181 ,  H05K2201/10143 ,  Y02E10/50 ,  Y10T156/1051 ,  Y10T428/24314

Abstract: Photovoltaic modules may include multiple flexible thin film photovoltaic cells electrically connected in series, and laminated to a substantially transparent top sheet having a conductive grid pattern facing the cells. Methods of manufacturing photovoltaic modules including integrated multi-cell interconnections are provided. Methods may include steps of coordinating, integrating, and registering multiple rolls of substrates in continuous processes.

Abstract translation: 光伏模块可以包括串联电连接的多个柔性薄膜光伏电池，并且层压到具有面向电池单元的导电栅格图案的基本上透明的顶片上。 提供了包括集成多单元互连的光伏模块的制造方法。 方法可以包括在连续过程中协调，整合和记录多个基板的步骤。