公开(公告)号：US20130247977A1

公开(公告)日：2013-09-26

申请号：US13896853

申请日：2013-05-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koichi Kumai ,  Ryuji Ueda ,  Kentaro Kubota ,  Shigeki Kudo ,  Minoru Kawasaki

IPC: H01L31/02 ,  H05K1/02 ,  H05K3/20

CPC classification number: H01L31/02008 ,  H01L31/02021 ,  H01L31/0516 ,  H05K1/02 ,  H05K1/181 ,  H05K3/20 ,  H05K3/202 ,  H05K2201/10143 ,  H05K2203/0221 ,  H05K2203/033 ,  H05K2203/1545 ,  Y02E10/50 ,  Y10T29/49156 ,  Y10T156/1002

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract translation: 一种制造电路板的方法包括：通过切割保持在保持片上的金属箔来除去金属箔的一部分，在保持片上形成多个金属电极以彼此分离; 在所述多个金属电极的表面上形成粘合剂层; 通过使粘合剂层与基材紧密接触，将粘合剂层粘合到基材上; 以及通过从多个金属电极分离保持片，将粘合剂层和多个金属电极转印到基材上。