公开(公告)号：US11976179B2

公开(公告)日：2024-05-07

申请号：US17005619

申请日：2020-08-28

Applicant: ADMATECHS CO., LTD.

Inventor： Kenta Hori ,  Takeshi Yanagihara ,  Sachie Nagano ,  Susumu Abe ,  Yuji Oono ,  Haruka Katsurayama

IPC: C08K9/06 ,  C08K3/22 ,  C08K3/36 ,  C08K5/54 ,  C08K9/02

CPC classification number: C08K9/06 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5403 ,  C08K9/02 ,  C08K2003/2227 ,  C08K2201/006 ,  C08K2201/011

Abstract: Provided is a particle material that achieves excellent mechanical properties and optical properties when dispersed in a transparent resin material in order to solve the problem. In a case where primary particles having particle sizes in a certain range are formed into an aggregate, mechanical properties are enhanced while optical properties are maintained. The primary particles each have compositions different between the inside thereof and the surface thereof. Therefore, the optical properties to be obtained are easily controlled unlike an inorganic substance in which both of the compositions are mixed at an atomic level. The particle material of the present invention is an aggregate including primary particles in which a specific surface area. diameter is not less than 0.8 nm and not greater than 80 nm, the primary particles formed of an inorganic substance in which a composition of a surface and a composition of an inside are different.

公开(公告)号：US11091647B2

公开(公告)日：2021-08-17

申请号：US17060138

申请日：2020-10-01

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta Hagimoto ,  Nobutaka Tomita ,  Masaru Kuraki

IPC: C09C1/40 ,  C01B39/20 ,  C01B39/36 ,  C09D11/037

Abstract: A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an “NH3-TPD” method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.

公开(公告)号：US20200071471A1

公开(公告)日：2020-03-05

申请号：US16674119

申请日：2019-11-05

Applicant: ADMATECHS CO., LTD.

Inventor： Hiroyuki ONDA ,  Nobutaka Tomita ,  Yuki Arai

IPC: C08J3/12 ,  C08J3/215 ,  C08K9/06 ,  C08K9/02

Abstract: A composite material includes a resinous particulate material, and an inorganic particulate material having a particle diameter being smaller than that of the resinous particulate material, fused welded onto a surface of the resinous particulate material, formed of an inorganic oxide, and including OH groups generated by fuse welding in the surface. The composite particulate material exhibits a degree of sphericity of 0.8 or more, and a has volumetric average particle diameter of from 0.1 to 100 μm.

公开(公告)号：US20190055132A1

公开(公告)日：2019-02-21

申请号：US16169268

申请日：2018-10-24

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta Hagimoto ,  Nobutaka Tomita

IPC: C01B33/18 ,  C08J3/11 ,  C08K3/36 ,  C08K9/02

CPC classification number: C01B33/18 ,  C01P2002/02 ,  C01P2004/03 ,  C01P2004/60 ,  C08J3/11 ,  C08J2300/22 ,  C08J2300/24 ,  C08K3/36 ,  C08K9/02 ,  C08K9/06 ,  C08K2201/005 ,  C08L101/00

Abstract: A crystalline silica particulate material contains zinc (Zn) in an amount of 1 ppm or more, exhibits a volume average particle diameter of 200 μm or less, and is composed mainly of crystalline silica.

公开(公告)号：US20240034908A1

公开(公告)日：2024-02-01

申请号：US18380228

申请日：2023-10-16

Applicant: ADMATECHS CO., LTD.

Inventor： Yusuke TOMIOKA ,  Tempo NAKAMURA

IPC: C09G1/02

CPC classification number: C09G1/02

Abstract: Provided is a ferrule polishing material suitable for polishing a ferrule. A ferrule polishing material of the present invention solving the above object includes a binder formed from a resin material and abrasive grains dispersed in the binder. The resin material is formed from an epoxy resin. The abrasive grains are contained in an amount of not less than 80% and not greater than 91% with respect to the sum of masses of the abrasive grains and the binder, include small-diameter particles being particles having a particle diameter of not greater than 100 nm, the small-diameter particles being present in an amount of not less than 62.5% and not greater than 80% with respect to the mass of the abrasive grains, and are formed from silica.

公开(公告)号：US20230219823A1

公开(公告)日：2023-07-13

申请号：US18125179

申请日：2023-03-23

Applicant: ADMATECHS CO., LTD.

Inventor： Tempo Nakamura ,  Ikuya Matsue

IPC: C01F7/422 ,  C01F7/025 ,  C01F7/026

CPC classification number: C01F7/422 ,  C01F7/025 ,  C01F7/026 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2006/80

Abstract: Provided is a method for manufacturing a spherical particle material in which the particle size distribution is easily controlled. This method has: a granulation step of granulating a raw particle material formed of an inorganic material having a D50 of not larger than 5 μm to form a granulated body; and a spherizing step of heating and melting the granulated body to form the spherical particle material having a D50 larger than a D50 of the raw particle material. A melting method is used as a basic method for manufacturing the spherical particle material having a necessary particle size distribution. The granulated body is used to manufacture the spherical particle material having the necessary particle size distribution by the melting method.

公开(公告)号：US20220355581A1

公开(公告)日：2022-11-10

申请号：US17640500

申请日：2020-12-09

Applicant: SEKISUI CHEMICAL CO., LTD. ,  Admatechs Co., Ltd.

Inventor： Yuu SAKAMOTO ,  Junichi NAKADATE ,  Satoshi MAEDA ,  Yuji OONO ,  Kazuma OOSAWA ,  Takeshi YANAGIHARA ,  Susumu ABE

IPC: B32B17/10 ,  B32B7/027 ,  B32B27/08 ,  B32B27/30 ,  B32B27/20 ,  B32B27/22

Abstract: An interlayer film for laminated glass of the present invention is an interlayer film for laminated glass, the interlayer film having a structure of one or two or more layers, and comprising a first layer comprising a thermoplastic resin and a composite silica particle, in which the composite silica particle comprises a silica particle and an organic covering material with which a surface of the silica particle is covered, and a remaining fraction at dissolution in THF after still standing at 230° C. for 6 hours of the first layer is 15% by mass or less.

公开(公告)号：US20210238421A1

公开(公告)日：2021-08-05

申请号：US17237294

申请日：2021-04-22

Applicant: ADMATECHS CO., LTD.

Inventor： Shingi NOGUCHI ,  Masaru KURAKI ,  Tempo NAKAMURA ,  Yoshinori OKAWAUCHI

IPC: C08L83/06 ,  C08K3/013 ,  C08K3/22

Abstract: Provided is a filler that has a low viscosity when mixed in a resin material and has reduced permittivity and dielectric loss tangent. The filler includes: a metal oxide particle material; and a polyorganosiloxane compound with which a surface treatment is performed on the metal oxide particle material and which is represented by general formula (1): (RO)3Si—(SiR2—O—)n—SiR3 (in general formula (1), each R is independently selected from among alkyl groups having 1 to 4 carbon atoms, and n is not less than 10 and not greater than 200). A resin composition obtained by containing the filler in a resin is suitable for an electronic material.

公开(公告)号：US20210017392A1

公开(公告)日：2021-01-21

申请号：US17060138

申请日：2020-10-01

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta HAGIMOTO ,  Nobutaka TOMITA ,  Masaru KURAKI

IPC: C09C1/40 ,  C01B39/20 ,  C01B39/36 ,  C09D11/037

Abstract: A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an “NH3-TPD” method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.

公开(公告)号：US10358354B2

公开(公告)日：2019-07-23

申请号：US16169268

申请日：2018-10-24

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta Hagimoto ,  Nobutaka Tomita

IPC: C08J3/11 ,  C08K3/36 ,  C08K9/02 ,  C01B33/18

Abstract: A crystalline silica particulate material contains zinc (Zn) in an amount of 1 ppm or more, exhibits a volume average particle diameter of 200 μm or less, and is composed mainly of crystalline silica.