公开(公告)号：US4081600A

公开(公告)日：1978-03-28

申请号：US709457

申请日：1976-07-28

Applicant: Joseph A. Kueneman ,  Kenneth W. Nestor ,  Adolph J. Miera

Inventor： Joseph A. Kueneman ,  Kenneth W. Nestor ,  Adolph J. Miera

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  H05K3/38 ,  H05K3/06

CPC classification number: H05K3/4691 ,  H05K3/0014 ,  H05K3/281 ,  H05K1/0263 ,  H05K1/118 ,  H05K2201/2009 ,  H05K2203/0108 ,  H05K2203/0156 ,  H05K2203/1105 ,  H05K3/007 ,  H05K3/107 ,  H05K3/386 ,  Y10T156/1048 ,  Y10T156/1093 ,  Y10T428/24612 ,  Y10T428/31518 ,  Y10T428/31721

Abstract: Improvements are disclosed in the conventional process for the laminated packaging of etched circuitry consisting of:(1) A unitized form tool which is produced by photomasking a metal plate, with the same pattern master transparency that is used for producing the photoetched circuitry, followed by chemical milling of the exposed areas to a depth equal to the thickness of the circuitry,(2) the manufacturer's low pressure dwell cycle in the press for prepreg containing epoxy resin or polyimide resin is for either resin changed to 210.+-. 15 secs. at 10.+-. 1 psi and 340.degree. F. Thereafter the process returns to the manufacturer's specification for the specific resin for the remaining steps of the press and cure cycle, except that the cure is interrupted 60 minutes short of complete cure,(3) the cavity is preformed in the press in the precursor of the laminated board using the form tool of (1) and the conventional press cycle as modified per (2), and the interrupted post cure cycle per (2) is completed in the press under conditions specified for the specific resin by the manufacturer, to provide a completely bonded laminated circuit package.An improved process and, as new articles of manufacture, a laminated board with preformed cavity and a void-free laminated circuit package are disclosed.