公开(公告)号：US20130206725A1

公开(公告)日：2013-08-15

申请号：US12725367

申请日：2010-03-16

Applicant: Karl Leeser ,  Ishtak Karim ,  Alexandre de Chambrier ,  Liqi Wu ,  Chunming Zhou

Inventor： Karl Leeser ,  Ishtak Karim ,  Alexandre de Chambrier ,  Liqi Wu ,  Chunming Zhou

IPC: C23F1/00 ,  C23F1/08 ,  C23C16/52 ,  C23C16/00

CPC classification number: H01J37/147 ,  C23C14/32 ,  C23C14/35 ,  H01J37/30 ,  H01J37/3266 ,  H01J37/34

Abstract: Disclosed are methods and associated apparatus for depositing layers of material on a substrate (e.g., a semiconductor substrate) using ionized physical vapor deposition (iPVD). Also disclosed are methods and associated apparatus for plasma etching (e.g., resputtering) layers of material on a semiconductor substrate.

Abstract translation: 公开了使用电离物理气相沉积（iPVD）在衬底（例如，半导体衬底）上沉积材料层的方法和相关设备。 还公开了用于在半导体衬底上等离子体蚀刻（例如，再溅射）材料层的方法和相关装置。

公开(公告)号：US5986874A

公开(公告)日：1999-11-16

申请号：US868041

申请日：1997-06-03

Applicant: Eric Ross ,  Jae Park ,  Alexandre de Chambrier

Inventor： Eric Ross ,  Jae Park ,  Alexandre de Chambrier

IPC: H01L21/302 ,  H01L21/205 ,  H01L21/683 ,  H02N13/00

CPC classification number: H02N13/00 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23

Abstract: An electrostatic support assembly for supporting a substrate. The support assembly includes a non-metallic body having a support surface for supporting the substrate and an integral peripheral outer portion extending outwardly from and substantially surrounding the support surface of the substrate. The support assembly also includes at least one electrode carried by the non-metallic body for electrostatically coupling a substrate to the support surface of the non-metallic body and a base coupled to the underside of the non-metallic body for the transfer of heat between the non-metallic body and the base.

Abstract translation: 一种用于支撑衬底的静电支撑组件。 支撑组件包括非金属主体，其具有用于支撑基板的支撑表面和从基板的支撑表面向外延伸并基本上围绕基板的支撑表面的整体外围外部部分。 支撑组件还包括由非金属体承载的用于将基底静电耦合到非金属体的支撑表面的至少一个电极和耦合到非金属体的下侧的基底，用于在非金属体之间传递热量 非金属体和底座。