公开(公告)号：US09579722B1

公开(公告)日：2017-02-28

申请号：US14596307

申请日：2015-01-14

Applicant: Mary Anne Alvin ,  Iver Anderson ,  Andy Heidlof ,  Emma White ,  Bruce McMordie

Inventor： Mary Anne Alvin ,  Iver Anderson ,  Andy Heidlof ,  Emma White ,  Bruce McMordie

IPC: B22F1/00 ,  B22F3/11 ,  C22C19/05 ,  B22F3/24

CPC classification number: B22F1/0062 ,  B22F3/1143 ,  B22F7/004 ,  B22F2003/242 ,  B22F2201/03 ,  B22F2201/20 ,  B22F2301/15 ,  B22F2999/00 ,  C22C1/0433 ,  C22C19/058

Abstract: A method and apparatus for generating transpiration cooling using an oxidized porous HTA layer metallurgically bonded to a substrate having micro-channel architectures. The method and apparatus generates a porous HTA layer by spreading generally spherical HTA powder particles on a substrate, partially sintering under O2 vacuum until the porous HTA layer exhibits a porosity between 20% and 50% and a neck size ratio between 0.1 and 0.5, followed by a controlled oxidation generating an oxidation layer of alumina, chromia, or silica at a thickness of about 20 to about 500 nm. In particular embodiments, the oxidized porous HTA layer and the substrate comprise Ni as a majority element. In other embodiments, the oxidized porous HTA layer and the substrate further comprise Al, and in additional embodiments, the oxidized porous HTA layer and the substrate comprise γ-Ni+γ′-Ni3Al.

Abstract translation: 一种使用冶金结合到具有微通道结构的衬底的氧化多孔HTA层产生蒸发冷却的方法和设备。 该方法和装置通过在基底上铺展通常为球形的HTA粉末颗粒产生多孔HTA层，在O 2真空下部分烧结直到多孔HTA层呈现20％至50％的孔隙率和0.1至0.5之间的颈部尺寸比，随后 通过控制氧化产生厚度为约20至约500nm的氧化铝，氧化铬或二氧化硅的氧化层。 在具体实施方案中，氧化的多孔HTA层和衬底包含Ni作为多数元素。 在其它实施方案中，氧化的多孔HTA层和基底还包含Al，并且在另外的实施方案中，氧化的多孔HTA层和基底包含γ-Ni +γ'-Ni3Al。