公开(公告)号：US08466553B2

公开(公告)日：2013-06-18

申请号：US12902840

申请日：2010-10-12

Applicant: Bing-Hong Cheng ,  Meng-Jen Wang

Inventor： Bing-Hong Cheng ,  Meng-Jen Wang

IPC: H01L23/48

CPC classification number: H01L24/11 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/14181 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00

Abstract: The present invention relates to a semiconductor device and a semiconductor package having the same. The semiconductor device includes a conductive element. The conductive element is disposed on a protruded conductive via and liner, and covers a sidewall of the liner. Whereby, the conductive element can protect the protruded conductive via and liner from being damaged. Further, the size of the conductive element is large, thus it is easy to perform a probe test process.

Abstract translation: 本发明涉及半导体器件和具有该半导体器件的半导体封装。 半导体器件包括导电元件。 导电元件设置在突出的导电通孔和衬垫上，并且覆盖衬套的侧壁。 由此，导电元件可以保护突出的导电通孔和衬垫不被损坏。 此外，导电元件的尺寸大，因此容易进行探针测试处理。