公开(公告)号：US07662662B2

公开(公告)日：2010-02-16

申请号：US11685751

申请日：2007-03-13

Applicant: Jun-Chung Hsu ,  Bing-Kuen Lin ,  Chao-Lung Wang

Inventor： Jun-Chung Hsu ,  Bing-Kuen Lin ,  Chao-Lung Wang

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H05K3/421 ,  H05K1/116 ,  H05K3/108 ,  H05K3/426 ,  H05K2201/09545 ,  H05K2201/09563 ,  Y10T29/49162

Abstract: A carrier substrate and a method for manufacturing the carrier substrate are disclosed herein. The method includes the steps of: providing a core substrate; forming a build-up material layer on the core substrate; forming a via in the build-up material layer; forming a patterned photoresist layer on the build-up material layer covering a portion of the via and exposing an opening from uncovered portion of the via, and a wiring slot connected to the opening; and forming a metal-electroplated layer on the via and the wiring slot. In forming a trace according to the present invention, the metal-electroplated layer is formed as the trace and directly connected to the via, striding or not striding over the via. Additionally, in the carrier substrate structure, there is no need an annular ring to connect the trace to the via, and thus the wiring space is increased.

Abstract translation: 本文公开了载体基板和用于制造载体基板的方法。 该方法包括以下步骤：提供芯基板; 在所述芯基板上形成积层材料层; 在积层材料层中形成通孔; 在所述积层材料层上形成图案化的光致抗蚀剂层，所述图案化的光致抗蚀剂层覆盖所述通孔的一部分，并且从所述通孔的未覆盖部分露出开口，以及连接到所述开口的布线槽; 以及在通孔和布线槽上形成金属电镀层。 在形成根据本发明的迹线的情况下，金属电镀层形成为迹线，并且直接连接到通孔，跨越通道或跨过通孔。 此外，在载体基板结构中，不需要环形环来将迹线连接到通孔，因此布线空间增加。

公开(公告)号：US20080222886A1

公开(公告)日：2008-09-18

申请号：US11685751

申请日：2007-03-13

Applicant: Jun-Chung Hsu ,  Bing-Kuen Lin ,  Chao-Lung Wang

Inventor： Jun-Chung Hsu ,  Bing-Kuen Lin ,  Chao-Lung Wang

IPC: H01K3/10

CPC classification number: H05K3/421 ,  H05K1/116 ,  H05K3/108 ,  H05K3/426 ,  H05K2201/09545 ,  H05K2201/09563 ,  Y10T29/49162

Abstract: A carrier substrate and a method for manufacturing the carrier substrate are disclosed herein. The method includes the steps of: providing a core substrate; forming a build-up material layer on the core substrate; forming a via in the build-up material layer; forming a patterned photoresist layer on the build-up material layer covering a portion of the via and exposing an opening from uncovered portion of the via, and a wiring slot connected to the opening; and forming a metal-electroplated layer on the via and the wiring slot. In forming a trace according to the present invention, the metal-electroplated layer is formed as the trace and directly connected to the via, striding or not striding over the via. Additionally, in the carrier substrate structure, there is no need an annular ring to connect the trace to the via, and thus the wiring space is increased.

Abstract translation: 本文公开了载体基板和用于制造载体基板的方法。 该方法包括以下步骤：提供芯基板; 在所述芯基板上形成积层材料层; 在积层材料层中形成通孔; 在所述积层材料层上形成图案化的光致抗蚀剂层，所述图案化的光致抗蚀剂层覆盖所述通孔的一部分，并且从所述通孔的未覆盖部分露出开口，以及连接到所述开口的布线槽; 以及在通孔和布线槽上形成金属电镀层。 在形成根据本发明的迹线的情况下，金属电镀层形成为迹线，并且直接连接到通孔，跨越通道或跨过通孔。 此外，在载体基板结构中，不需要环形环来将迹线连接到通孔，因此布线空间增加。