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Patent Agency Ranking
公开(公告)号：US08246867B2
公开(公告)日：2012-08-21
申请号：US12580490
申请日：2009-10-16
Applicant: John W. Botelho , Diane K. Guilfoyle , Linda F. Reynolds-Heffer , Brian P. Strines , Kathleen A. Wexell
Inventor： John W. Botelho , Diane K. Guilfoyle , Linda F. Reynolds-Heffer , Brian P. Strines , Kathleen A. Wexell
CPC classification number: H01L51/5246
Abstract: Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area.
Abstract translation: 提供组装光电器件的方法。 光电子器件包括第一透明衬底，第二衬底和环境敏感组件。 所述方法包括将填充材料施加到至少一个基底的表面并降低填充材料的粘度的步骤。 所述方法还包括将第一透明基板和第二基板压在一起的步骤，使得填充材料基本上填充第一透明基板和第二基板之间的区域，并基本上封装环境敏感部件的暴露部分。 所述方法还包括将第一透明基板和第二基板密封在一起以将填充材料气密密封在该区域内的步骤。
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2.发明申请METHODS FOR FORMING FRITTED COVER SHEETS AND GLASS PACKAGES COMPRISING THE SAME 有权用于形成封面的方法和包含其的玻璃包装公开(公告)号：US20110014427A1
公开(公告)日：2011-01-20
申请号：US12821581
申请日：2010-06-23
Applicant: Debra L. Burgess , Edward J. Sever , Brian P. Strines
Inventor： Debra L. Burgess , Edward J. Sever , Brian P. Strines
CPC classification number: C03C27/06 , H01L51/5246 , Y10T428/24421
Abstract: A method for forming a fritted cover sheet includes providing a substrate and depositing an initial frit bead on the substrate. Thereafter, at least one additional frit bead is deposited on the substrate such that a base of the at least one additional frit head contacts a base of an adjacent frit bead thereby forming a frit seal on the substrate.
Abstract translation: 用于形成烧结覆盖片的方法包括提供基底并在基底上沉积初始玻璃料珠。 此后，至少一个另外的玻璃料珠沉积在基底上，使得至少一个附加玻璃料头的基部接触相邻玻璃料珠的基部，从而在基底上形成玻璃料密封。
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公开(公告)号：US06590116B1
公开(公告)日：2003-07-08
申请号：US09423727
申请日：2001-10-01
Applicant: Joseph S. Flynn , Dale R. Powers , Brian P. Strines
Inventor： Joseph S. Flynn , Dale R. Powers , Brian P. Strines
IPC: C07F708
CPC classification number: G01N30/482 , B01D15/00 , B01J20/103 , B01J2220/54 , C03B19/1415 , C03B37/01413 , C03B2201/02 , C03B2207/32 , C03B2207/81 , C03C1/00 , C03C1/02 , C03C3/06 , C03C2203/00 , C07F7/089 , C07F7/20 , C08G77/34
Abstract: The present invention is directed to a process for purifying siloxane. The invention relates to a method of making a purified siloxane feedstock for use in the manufacturing of silica glass. The invention further relates to solid phase extracting impurities from a polyalkylsiloxane starting material.
Abstract translation: 本发明涉及一种纯化硅氧烷的方法。 本发明涉及一种制备用于制造石英玻璃的纯化硅氧烷原料的方法。 本发明还涉及从聚烷基硅氧烷起始材料中固相萃取杂质。
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4.发明授权Methods for forming fritted cover sheets and glass packages comprising the same 有权用于形成烧结覆盖片和包括其的玻璃包装的方法公开(公告)号：US08505337B2
公开(公告)日：2013-08-13
申请号：US12821581
申请日：2010-06-23
Applicant: Edward J. Sever , Brian P. Strines , Michael D. Burgess
Inventor： Debra L. Burgess , Edward J. Sever , Brian P. Strines
CPC classification number: C03C27/06 , H01L51/5246 , Y10T428/24421
Abstract: A method for forming a fritted cover sheet includes providing a substrate and depositing an initial frit bead on the substrate. Thereafter, at least one additional frit bead is deposited on the substrate such that a base of the at least one additional frit bead contacts a base of an adjacent frit bead thereby forming a frit seal on the substrate.
Abstract translation: 用于形成烧结覆盖片的方法包括提供基底并在基底上沉积初始玻璃料珠。 此后，至少一个另外的玻璃料珠沉积在基底上，使得至少一个附加玻璃料珠的基部接触相邻玻璃料珠的基部，从而在基底上形成玻璃料密封。
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公开(公告)号：US20110089587A1
公开(公告)日：2011-04-21
申请号：US12580490
申请日：2009-10-16
Applicant: John W. Botelho , Diane K. Guilfoyle , Linda F. Reynolds-Heffer , Brian P. Strines , Kathleen A. Wexell
Inventor： John W. Botelho , Diane K. Guilfoyle , Linda F. Reynolds-Heffer , Brian P. Strines , Kathleen A. Wexell
IPC: B29D11/00
CPC classification number: H01L51/5246
Abstract: Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area.
Abstract translation: 提供组装光电器件的方法。 光电子器件包括第一透明衬底，第二衬底和环境敏感组件。 所述方法包括将填充材料施加到至少一个基底的表面并降低填充材料的粘度的步骤。 所述方法还包括将第一透明基板和第二基板压在一起的步骤，使得填充材料基本上填充第一透明基板和第二基板之间的区域，并基本上封装环境敏感部件的暴露部分。 所述方法还包括将第一透明基板和第二基板密封在一起以将填充材料气密密封在该区域内的步骤。
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