公开(公告)号：US06828512B2

公开(公告)日：2004-12-07

申请号：US10267158

申请日：2002-10-08

Applicant: C. Key Chung ,  Sook Chien Chan ,  Kum Foo Leong

Inventor： C. Key Chung ,  Sook Chien Chan ,  Kum Foo Leong

IPC: H05K116

CPC classification number: H05K3/3436 ,  H05K1/113 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A substrate has at least one via-in-pad that includes a bond pad and a bore. In addition, the substrate has a plug coupled to the at least one via-in-pad, the plug has a first conductive material and adapted to couple with a solder ball having a second conductive material, the first conductive material having a higher reflow temperature than the second conductive material.

Abstract translation: 衬底具有至少一个包括焊盘和孔的通孔内焊盘。 另外，衬底具有耦合到至少一个通孔焊盘中的插塞，该插头具有第一导电材料并且适于与具有第二导电材料的焊料球耦合，第一导电材料具有较高的回流温度 比第二导电材料。