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    COMPOSITE MATERIAL BASED BUILDING MATERIAL STRUCTURE
    1.
    发明申请
    COMPOSITE MATERIAL BASED BUILDING MATERIAL STRUCTURE 有权

    公开(公告)号：US20210254326A1

    公开(公告)日：2021-08-19

    申请号：US16793706

    申请日：2020-02-18

    Applicant: CHENG-HUNG YANG

    Inventor： CHENG-HUNG YANG

    IPC: E04B1/24 ,  E04B1/08 ,  E04B1/10 ,  E04B1/14

    Abstract: A composite material based building material structure includes a metal member and a combination member. The metal member includes a connection plate and two lateral plates disposed on two ends of the connection plate. The two lateral plates extend toward an identical side of the connection plate, forming a combination groove. The metal member includes a plurality of first connection portions on an outer periphery of each lateral plate. The combination member is formed of wood plastic composites, and has a recess for receiving the metal member. The combination member includes a plurality of second connection portions on an inner periphery of the recess, for correspondingly receiving the first connection portions, such that the combination member is mounted on an outer side of the metal member. Thus, the metal member is prevented from moisture, achieving increased life span of the building material structure.

    DOCKING STATION AND EXPANDABLE COMPUTER SYSTEM
    3.
    发明申请
    DOCKING STATION AND EXPANDABLE COMPUTER SYSTEM 审中-公开
    锁定站和可扩展计算机系统

    公开(公告)号：US20090043936A1

    公开(公告)日：2009-02-12

    申请号：US12138974

    申请日：2008-06-13

    Applicant: Cheng-Hung YANG ,  Kuei-Kang Chang ,  Chi-Chun Chen ,  Wan-Shan Lin ,  Wen-Chi Kuo

    Inventor： Cheng-Hung YANG ,  Kuei-Kang Chang ,  Chi-Chun Chen ,  Wan-Shan Lin ,  Wen-Chi Kuo

    IPC: G06F13/00

    CPC classification number: G06F1/1632

    Abstract: A docking station is used for cooperating with a computer host, and the computer host has a first power connecting portion and a first peripheral component connecting portion. The docking station includes a casing, a second power connecting portion and a second peripheral component connecting portion. The casing is used for disposing the computer host. The second power connecting portion and the second peripheral component connecting portion are disposed at the casing. When the computer host is disposed at the casing, the second power connecting portion is connected to the first power connecting portion to transmit a power signal to the computer host, and the second peripheral component connecting portion is connected to the first peripheral component connecting portion to transmit at least one peripheral component signal to the computer host. An expandable computer system is also disclosed.

    Abstract translation: 对接站用于与计算机主机协作，计算机主机具有第一电源连接部分和第一外围部件连接部分。 对接站包括壳体，第二电力连接部分和第二外围部件连接部分。 外壳用于处理计算机主机。 第二电源连接部分和第二外围部件连接部分设置在壳体上。 当计算机主机设置在壳体上时，第二电源连接部分连接到第一电力连接部分以将电力信号传送到计算机主机，并且第二外围部件连接部分连接到第一外围部件连接部分 向计算机主机发送至少一个外围组件信号。 还公开了可扩展计算机系统。

    Package substrate and light emitting device using the same
    4.
    发明授权
    Package substrate and light emitting device using the same 有权
    封装衬底和使用其的发光器件

    公开(公告)号：US08049244B2

    公开(公告)日：2011-11-01

    申请号：US12334476

    申请日：2008-12-14

    Applicant: Chih-Ming Chen ,  Cheng-Hung Yang

    Inventor： Chih-Ming Chen ,  Cheng-Hung Yang

    IPC: H01L33/00 ,  H01L33/44

    CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A package substrate of the present invention at least comprises a metal substrate and a plurality of light emitting dies. The metal substrate is provided thereon with at least one trench. The trench is recessed into the surface of the metal substrate through an insulating layer. The light emitting dies are secured in the trench and electrically connected to a predetermined wiring layer on the metal substrate by metal wires, thereby obtaining a light emitting die package substrate with good thermal conductivity, high heat dissipation, separate electrical and thermal paths and a simple and firm structure.

    Abstract translation: 本发明的封装基板至少包括金属基板和多个发光管芯。 金属基底上设置有至少一个沟槽。 沟槽通过绝缘层凹陷到金属基板的表面中。 发光管芯固定在沟槽中，并通过金属线与金属基板上的预定布线层电连接，从而获得具有良好导热性，高散热性，分开的电路和热路径以及简单的发光模组封装基板 和坚定的结构。

    LAMP
    5.
    发明申请
    LAMP 有权
    灯

    公开(公告)号：US20100284188A1

    公开(公告)日：2010-11-11

    申请号：US12549350

    申请日：2009-08-27

    Applicant: Chih-Ming Chen ,  Cheng-Hung Yang

    Inventor： Chih-Ming Chen ,  Cheng-Hung Yang

    IPC: F21S4/00

    CPC classification number: F21K9/232 ,  F21Y2107/30 ,  F21Y2115/10

    Abstract: A lamp including a carrier and a plurality of light source modules stacked to the carrier is provided. Each light source module includes a circuit board and a plurality of light-emitting diodes, wherein the light-emitting diodes are disposed on at least one side of the circuit board and electrically connected to the circuit board.

    Abstract translation: 提供一种包括载体和堆叠在载体上的多个光源模块的灯。 每个光源模块包括电路板和多个发光二极管，其中发光二极管设置在电路板的至少一侧并电连接到电路板。

    Package Substrate and Light Emitting Device Using the Same
    6.
    发明申请
    Package Substrate and Light Emitting Device Using the Same 有权
    封装衬底和使用其的发光器件

    公开(公告)号：US20100072492A1

    公开(公告)日：2010-03-25

    申请号：US12334476

    申请日：2008-12-14

    Applicant: Chih-Ming CHEN ,  Cheng-Hung YANG

    Inventor： Chih-Ming CHEN ,  Cheng-Hung YANG

    IPC: H01L33/00

    CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A package substrate of the present invention at least comprises a metal substrate and a plurality of light emitting dies. The metal substrate is provided thereon with at least one trench. The trench is recessed into the surface of the metal substrate through an insulating layer. The light emitting dies are secured in the trench and electrically connected to a predetermined wiring layer on the metal substrate by metal wires, thereby obtaining a light emitting die package substrate with good thermal conductivity, high heat dissipation, separate electrical and thermal paths and a simple and firm structure.

    Abstract translation: 本发明的封装基板至少包括金属基板和多个发光管芯。 金属基底上设置有至少一个沟槽。 沟槽通过绝缘层凹陷到金属基板的表面中。 发光管芯固定在沟槽中，并通过金属线与金属基板上的预定布线层电连接，从而获得具有良好导热性，高散热性，分开的电路和热路径以及简单的发光模组封装基板 和坚定的结构。

    Pergola
    7.
    外观设计
    Pergola 有权

    公开(公告)号：USD988539S1

    公开(公告)日：2023-06-06

    申请号：US29809615

    申请日：2021-09-29

    Applicant: Cheng-Hung Yang

    Designer： Cheng-Hung Yang

    Abstract: FIG. 1 is a perspective view of a pergola showing my new design;
    FIG. 2 is a front elevational view thereof;
    FIG. 3 is a rear elevational view thereof;
    FIG. 4 is a left side elevational view thereof;
    FIG. 5 is a right side elevational view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof;
    FIG. 8 is a partial enlarged view of label 8 from FIG. 2;
    FIG. 9 is a partial enlarged view of label 9 from FIG. 2;
    FIG. 10 is a partial enlarged view of label 10 from FIG. 2;
    FIG. 11 is a partial enlarged view of label 11 from FIG. 4;
    FIG. 12 is a partial enlarged view of label 12 from FIG. 4; and,
    FIG. 13 is a partial enlarged view of label 13 from FIG. 4.
    The broken lines in FIGS. 2, 4, and 8 through 13 identify the locations and boundaries of the areas of enlargement for the partial enlarged views, and form no part of the claimed design.

    COMBINATION FRAME MATERIAL
    9.
    发明申请
    COMBINATION FRAME MATERIAL 审中-公开
    组合框架材料

    公开(公告)号：US20150240501A1

    公开(公告)日：2015-08-27

    申请号：US14601163

    申请日：2015-01-20

    Applicant: CHENG-HUNG YANG

    Inventor： CHENG-HUNG YANG

    IPC: E04F15/02 ,  E04F15/10

    CPC classification number: E04F15/02044 ,  E04F15/105 ,  E04F2015/0205 ,  E04F2015/02116 ,  E04F2201/0511 ,  E04F2203/08

    Abstract: A combination frame material includes an outer frame and an inner frame. Therein, the outer frame has an outer side and an inner side, with the inner side provided with two parallel combining grooves with a middle pillar disposed therebetween for dividing the two combining grooves. The inner frame has two parallel combining parts for being received in the two combining grooves, with a pillar groove disposed between the two combining parts for receiving the middle pillar. Thus, the outer frame and the inner frame are allowed to be combined easily and efficiently.

    Abstract translation: 组合框架材料包括外框架和内框架。 其中，外框架具有外侧和内侧，内侧设置有两个平行的组合槽，其间设置有用于分隔两个组合槽的中间柱。 内框架具有两个平行组合部分，用于容纳在两个组合槽中，其中一个柱槽设置在用于接收中间柱的两个组合部分之间。 因此，允许外框架和内框架容易且有效地组合。

    Lamp
    10.
    发明授权
    Lamp 有权
    灯

    公开(公告)号：US08322885B2

    公开(公告)日：2012-12-04

    申请号：US12549350

    申请日：2009-08-27

    Applicant: Chih-Ming Chen ,  Cheng-Hung Yang

    Inventor： Chih-Ming Chen ,  Cheng-Hung Yang

    IPC: F21V21/00

    CPC classification number: F21K9/232 ,  F21Y2107/30 ,  F21Y2115/10

    Abstract: A lamp including a carrier and a plurality of light source modules stacked to the carrier is provided. Each light source module includes a circuit board and a plurality of light-emitting diodes, wherein the light-emitting diodes are disposed on at least one side of the circuit board and electrically connected to the circuit board.

    Abstract translation: 提供一种包括载体和堆叠在载体上的多个光源模块的灯。 每个光源模块包括电路板和多个发光二极管，其中发光二极管设置在电路板的至少一侧并电连接到电路板。

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