公开(公告)号：US07329942B2

公开(公告)日：2008-02-12

申请号：US11131395

申请日：2005-05-18

Applicant: Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

Inventor： Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

IPC: H01L31/00 ,  H01L27/15 ,  H01L33/00 ,  H01L23/58

CPC classification number: H01L33/641 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/00

Abstract: An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper substrate fixed on the lower substrate. A material with high heat conductivity is selected as the material of the upper substrate. The upper substrate is formed with multiple arrayed dents and through holes on the bottom of each dent. A material with high heat conductivity is selected as the material of the lower substrate. The surface of the lower substrate is formed with a predetermined circuit layout card. The bottom face of the upper substrate is placed on the upper face of the lower substrate with the through holes of the dents respectively corresponding to the contact electrodes of the circuit layout card of the lower substrate. Multiple light-emitting diode crystallites are respectively fixed on the bottoms of the dents. Via the through holes, the electrodes of the light-emitting diode crystallites are electrically connected with the contact electrodes. Then the dents of the upper substrate are sealed to prevent the light-emitting diode crystallites from being oxidized.

Abstract translation: 阵列式模块化发光二极管结构及封装结构的方法。 阵列型模块化发光二极管结构包括下基板和固定在下基板上的上基板。 选择具有高导热性的材料作为上基板的材料。 上基板在每个凹陷的底部形成多个排列的凹槽和通孔。 选择具有高导热性的材料作为下基板的材料。 下基板的表面形成有预定的电路布局卡。 上基板的底面被放置在下基板的上表面上，凹部的通孔分别对应于下基板的电路布局卡的接触电极。 多个发光二极管晶体分别固定在凹陷的底部。 通过通孔，发光二极管晶体的电极与接触电极电连接。 然后将上基板的凹痕密封，以防止发光二极管晶体被氧化。

公开(公告)号：US20060261357A1

公开(公告)日：2006-11-23

申请号：US11131395

申请日：2005-05-18

Applicant: Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

Inventor： Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

IPC: H01L29/06

CPC classification number: H01L33/641 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/00

Abstract: An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper substrate fixed on the lower substrate. A material with high heat conductivity is selected as the material of the upper substrate. The upper substrate is formed with multiple arrayed dents and through holes on the bottom of each dent. A material with high heat conductivity is selected as the material of the lower substrate. The surface of the lower substrate is formed with a predetermined circuit layout card. The bottom face of the upper substrate is placed on the upper face of the lower substrate with the through holes of the dents respectively corresponding to the contact electrodes of the circuit layout card of the lower substrate. Multiple light-emitting diode crystallites are respectively fixed on the bottoms of the dents. Via the through holes, the electrodes of the light-emitting diode crystallites are electrically connected with the contact electrodes. Then the dents of the upper substrate are sealed to prevent the light-emitting diode crystallites from being oxidized.

Abstract translation: 阵列式模块化发光二极管结构及封装结构的方法。 阵列型模块化发光二极管结构包括下基板和固定在下基板上的上基板。 选择具有高导热性的材料作为上基板的材料。 上基板在每个凹陷的底部形成多个排列的凹槽和通孔。 选择具有高导热性的材料作为下基板材料。 下基板的表面形成有预定的电路布局卡。 上基板的底面被放置在下基板的上表面上，凹部的通孔分别对应于下基板的电路布局卡的接触电极。 多个发光二极管晶体分别固定在凹陷的底部。 通过通孔，发光二极管晶体的电极与接触电极电连接。 然后将上基板的凹痕密封，以防止发光二极管晶体被氧化。

公开(公告)号：US07406185B2

公开(公告)日：2008-07-29

申请号：US10414214

申请日：2003-04-16

Applicant: Bruce C. S. Chou ,  Yuan-Wei Cheng ,  Ching-Fu Tsou ,  Ming-Lin Tsai

Inventor： Bruce C. S. Chou ,  Yuan-Wei Cheng ,  Ching-Fu Tsou ,  Ming-Lin Tsai

IPC: G06K9/00 ,  G05B19/00 ,  F25B21/02

CPC classification number: G06K9/0002 ,  G01J5/12

Abstract: The present invention provides a fingerprint sensing mechanism using a two-dimensional thermoelectric sensor array to capture the thermal image related to the ridges and valleys on the finger, wherein its fabricating method is totally compatible with integrated circuits processing. Using the body temperature of a human being as the stimulation source for biometrics, a temperature difference is produced from a ridge of a fingerprint contacting the thermoelectric sensor and the temperature gradient is converted into an electrical signal. A plurality of thermoelectric sensors arranged in a two-dimensional array forms a fingerprint sensor so as to obtain the electrical signal output of the ridge profile of the fingerprint.

Abstract translation: 本发明提供一种使用二维热电传感器阵列捕获与手指上的脊和谷有关的热图像的指纹感测机构，其中其制造方法与集成电路处理完全兼容。 使用人体的体温作为生物测定的刺激源，从与热电传感器接触的指纹的脊产生温差，并将温度梯度转换为电信号。 以二维阵列布置的多个热电传感器形成指纹传感器，以获得指纹的脊形轮廓的电信号输出。