公开(公告)号：US11908753B2

公开(公告)日：2024-02-20

申请号：US17520631

申请日：2021-11-06

Applicant: Kao-Shan Yang ,  Ching-Li Lin

Inventor： Kao-Shan Yang ,  Ching-Li Lin

IPC: H01L21/66 ,  H01L21/683 ,  G01R1/00 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/00 ,  G01R31/26 ,  G01R31/28

CPC classification number: H01L22/12 ,  G01R1/07342 ,  H01L21/6838

Abstract: Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.

公开(公告)号：US20220068726A1

公开(公告)日：2022-03-03

申请号：US17520631

申请日：2021-11-06

Applicant: Kao-Shan YANG ,  Ching-Li LIN

Inventor： Kao-Shan YANG ,  Ching-Li LIN

IPC: H01L21/66 ,  G01R1/073 ,  H01L21/683

Abstract: Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.