公开(公告)号：US20050082086A1

公开(公告)日：2005-04-21

申请号：US10711795

申请日：2004-10-06

Applicant: Chun-Yang Lin ,  Shu-Chih Chen ,  Wen-Hsinung Shih

Inventor： Chun-Yang Lin ,  Shu-Chih Chen ,  Wen-Hsinung Shih

IPC: H05K1/00 ,  H05K1/02 ,  H05K7/06

CPC classification number: H05K1/0271 ,  H05K1/0298 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: A printed circuit board (PCB) includes a plastic substrate, and a layout formed on the plastic substrate. The layout comprises a first layout and a second layout, the second layout is less dense than the first layout. The second layout comprises a pseudo-layout to prevent the PCB from being bent when heated.

Abstract translation: 印刷电路板（PCB）包括塑料基板和在塑料基板上形成的布局。 布局包括第一布局和第二布局，第二布局不如第一布局密集。 第二布局包括伪布局以防止PCB在加热时弯曲。