公开(公告)号：US08783863B2

公开(公告)日：2014-07-22

申请号：US13604130

申请日：2012-09-05

Applicant: Chung Lin Wang

Inventor： Chung Lin Wang

IPC: G02C7/04

CPC classification number: G02C7/044 ,  A61F9/00 ,  G02C7/04 ,  G02C2202/24

Abstract: This invention provides a contact lens for myopia control comprising: an object-side surface comprising a central zone, a transition zone and a peripheral zone which are concentric and have different refractive power, at least one of the three zones being aspheric; and an image-side surface; wherein the central zone provides correction power to focus a foveal image on the retina, the peripheral zone provides a myopic defocus effect by generating a para-fovea image in front of the retina, and the transition zone with one or more focuses provides a refractive power in diopter (D) ranging from +0.25 D to +8.00 D.

Abstract translation: 本发明提供了一种用于近视控制的隐形眼镜，包括：物体侧表面，包括同心且具有不同屈光力的中心区域，过渡区域和周边区域，所述三个区域中的至少一个是非球面的; 和图像侧表面; 其中中心区域提供校正力以将视网膜聚焦在中心凹图像上，周边区域通过在视网膜前方产生对中央凹图像来提供近视散焦效果，并且具有一个或多个焦点的过渡区域提供折射力 屈光度（D）范围从+0.25 D到+8.00 D.

公开(公告)号：US20120267262A1

公开(公告)日：2012-10-25

申请号：US13180334

申请日：2011-07-11

Applicant: Chung-Lin Wang ,  Chen-Yi Huang ,  Tsung-Lin Wu

Inventor： Chung-Lin Wang ,  Chen-Yi Huang ,  Tsung-Lin Wu

IPC: A45C11/04

CPC classification number: A45C11/005

Abstract: This invention provides a container for a contact lens, comprising: a central recess; a peripheral groove surrounding the central recess; and a rim surrounding the peripheral groove; wherein the central recess is a curved surface having one or a plurality of continuous R values less than an R value of the contact lens in its natural state, and wherein the R value is a radius of curvature of a curved surface.

Abstract translation: 本发明提供了一种用于隐形眼镜的容器，包括：中央凹部; 围绕中心凹部的周边凹槽; 以及围绕所述周缘槽的边缘; 其中所述中央凹部是具有小于其天然状态下的隐形眼镜的R值的一个或多个连续R值的曲面，并且其中R值是曲面的曲率半径。

公开(公告)号：US20200068754A1

公开(公告)日：2020-02-27

申请号：US16548715

申请日：2019-08-22

Applicant: Chung-Lin WANG

Inventor： Chung-Lin WANG

IPC: H05K13/02 ,  H01L33/00 ,  H05K13/04

Abstract: The present invention provides a method of arranging a huge amount of chips, comprising the sequential steps: a providing step of providing a substrate and a plurality of chips; a spreading step of spreading a plurality of chips on the surface of the substrate; a tilting step of tilting the substrate by an angle to slide down the plurality of chips along the surface of the substrate so that the trapping stoppers trap the plurality of chips respectively in such a manner that the blocked chips are placed in the chip placing areas respectively; an adhering step of adhering, onto the chip placing areas, the chips with the working surface upward; and a removing step of removing, from the substrate, the chips which are not adhered onto the chip placing areas. A huge number of chips can be transferred efficiently by the method of the present invention.

公开(公告)号：US10128326B2

公开(公告)日：2018-11-13

申请号：US15922896

申请日：2018-03-15

Applicant: Chung Lin Wang

Inventor： Chung Lin Wang

IPC: H01C7/10 ,  H01L49/02 ,  H01C7/102

Abstract: A resistor comprises a substrate, an upper ohmic region disposed on a selective one of an upper surface and a lower surface of the substrate and a lower ohmic region disposed on the other one of the upper surface and the lower surface of the substrate. An upper metal conducting layer overlies on the substrate and the upper ohmic region, and a lower metal conducting layer overlies on the lower ohmic region. When the upper and lower metal conducting layers are electrified, the upper ohmic region and the lower ohmic region are electrically connected, and a contact interface between the substrate and the upper metal conducting layer forms an enlarged depletion region to block electrical conduction therebetween. As a result, a resistance value of the resistor is increased when an applied voltage on the resistor is increased.

公开(公告)号：US20180277617A1

公开(公告)日：2018-09-27

申请号：US15922896

申请日：2018-03-15

Applicant: CHUNG LIN WANG

Inventor： CHUNG LIN WANG

IPC: H01L49/02 ,  H01C7/102

CPC classification number: H01L28/20 ,  H01C7/102

Abstract: A resistor comprises a substrate, an upper ohmic region disposed on a selective one of an upper surface and a lower surface of the substrate and a lower ohmic region disposed on the other one of the upper surface and the lower surface of the substrate. An upper metal conducting layer overlies on the substrate and the upper ohmic region, and a lower metal conducting layer overlies on the lower ohmic region. When the upper and lower metal conducting layers are electrified, the upper ohmic region and the lower ohmic region are electrically connected, and a contact interface between the substrate and the upper metal conducting layer forms an enlarged depletion region to block electrical conduction therebetween. As a result, a resistance value of the resistor is increased when an applied voltage on the resistor is increased.

公开(公告)号：US20130293834A1

公开(公告)日：2013-11-07

申请号：US13604130

申请日：2012-09-05

Applicant: Chung Lin Wang

Inventor： Chung Lin Wang

IPC: G02C7/04 ,  G02C7/06

CPC classification number: G02C7/044 ,  A61F9/00 ,  G02C7/04 ,  G02C2202/24

Abstract: This invention provides a contact lens for myopia control comprising: an object-side surface comprising a central zone, a transition zone and a peripheral zone which are concentric and have different refractive power, at least one of the three zones being aspheric; and an image-side surface; wherein the central zone provides correction power to focus a foveal image on the retina, the peripheral zone provides a myopic defocus effect by generating a para-fovea image in front of the retina, and the transition zone with one or more focuses provides a refractive power in diopter (D) ranging from +0.25 D to +8.00 D.

Abstract translation: 本发明提供了一种用于近视控制的隐形眼镜，包括：物体侧表面，包括同心且具有不同屈光力的中心区域，过渡区域和周边区域，所述三个区域中的至少一个是非球面的; 和图像侧表面; 其中中心区域提供校正力以将视网膜聚焦在中心凹图像上，周边区域通过在视网膜前方产生对中央凹图像来提供近视散焦效果，并且具有一个或多个焦点的过渡区域提供折射力 屈光度（D）范围从+0.25 D到+8.00 D.

公开(公告)号：US20120272866A1

公开(公告)日：2012-11-01

申请号：US13456878

申请日：2012-04-26

Applicant: Chung-Lin Wang ,  Wei-Yuan Chen

Inventor： Chung-Lin Wang ,  Wei-Yuan Chen

IPC: A61L31/14 ,  B29D11/00

CPC classification number: C08J9/26 ,  C08J2201/0444 ,  C08J2333/10

Abstract: Contact lenses with pores having high oxygen permeability and a manufacturing method thereof. The manufacturing method comprises the steps of uniformly mixing water-soluble salts and the formula of contact lenses having hydrophilic monomers to form a mixed formula; molding and forming the mixed formula to obtain contact lenses; dissolving and dialyzing the water-soluble salts by a water solution so as to form a plurality of pores with a predetermined diameter on a surface and in the interior of the contact lenses. The diameter of pore size has an allowable range between 0.03 μm and 0.05 μm such that the contact lenses with high oxygen permeability can be obtained.

Abstract translation: 具有高氧渗透性的孔的隐形眼镜及其制造方法。 该制造方法包括以下步骤：将具有亲水性单体的水溶性盐和隐形眼镜配方混合形成混合配方; 模制和形成混合配方以获得隐形眼镜; 通过水溶液溶解和透析水溶性盐，以在隐形眼镜的表面和内部形成具有预定直径的多个孔。 孔径的直径为0.03μm〜0.05μm的允许范围，可以得到透氧性高的隐形眼镜。

公开(公告)号：US20110130064A1

公开(公告)日：2011-06-02

申请号：US12955074

申请日：2010-11-29

Applicant: CHUNG-LIN WANG

Inventor： CHUNG-LIN WANG

IPC: H01J9/00

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0806 ,  H05B33/0809 ,  H01L2924/00

Abstract: The present invention discloses a method for fabricating an AC LED package device, which comprises steps: providing a plurality of LED modular chips each having a plurality of LEDs in same polar direction in series; connecting forward and reversely the LED modular chips with a wire-bonding method to form an AC LED package device; and connecting the AC LED package device with an AC power source. In the present invention, the LED modular chips, each of which have LEDs all connected in same polar direction, are used to form an AC LED package device. Therefore, the present invention is using less-complicated photomasks compared with prior art. Accordingly, the present invention simplifies the process, promotes the yield and lowers the cost.

Abstract translation: 本发明公开了一种制造AC LED封装器件的方法，包括以下步骤：提供多个LED模块芯片，每个LED模块芯片具有串联在相同极性方向上的多个LED; 通过引线键合方式正向和反向连接LED模块化芯片，形成交流LED封装器件; 并将AC LED封装器件与AC电源连接。 在本发明中，使用LED模块化芯片，其各LED均具有相同的极性方向连接的LED，以形成AC LED封装器件。 因此，与现有技术相比，本发明使用不太复杂的光掩模。 因此，本发明简化了工艺，提高了产量并降低了成本。

公开(公告)号：US20140209937A1

公开(公告)日：2014-07-31

申请号：US14159565

申请日：2014-01-21

Applicant: CHUNG-LIN WANG

Inventor： CHUNG-LIN WANG

IPC: H01L27/15 ,  H01L33/00

CPC classification number: H01L33/005 ,  H01L27/156 ,  H01L33/0095 ,  H01L2224/14 ,  H01L2224/16225

Abstract: The present invention discloses a package-free and circuit board-free LED device and a method for fabricating the same. The LED device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one LED chip having two electrodes able to directly connect with external wires and at least one chip unit. A DC power or an AC power is directly electrically connected with the two electrodes through wires to drive the LED device to emit light. The present invention minimizes device components and fabrication steps, effectively reduces cost and promotes reliability and yield.

Abstract translation: 本发明公开了一种无封装和无电路板的LED器件及其制造方法。 LED器件免于半导体封装衬底和印刷电路板，并且包括至少一个LED芯片，其具有能够直接连接外部电线和至少一个芯片单元的两个电极。 直流电源或交流电源通过电线与两个电极直接电连接，以驱动LED器件发光。 本发明使器件组件和制造步骤最小化，有效地降低了成本并提高了可靠性和产量。

公开(公告)号：US20090104471A1

公开(公告)日：2009-04-23

申请号：US12076284

申请日：2008-03-17

Applicant: Chung-Lin Wang

Inventor： Chung-Lin Wang

IPC: B32B15/00

CPC classification number: B32B15/017 ,  C22C21/00 ,  Y10T428/12229

Abstract: The present invention discloses a solderable aluminum-based material, wherein electron donors combine with the non-bonded atoms on the surface of an aluminum-based material. The bonding between the electron donors and the aluminum atoms on the surface generates a protective film to prevent from the formation of an aluminum oxide layer on the surface of the aluminum-based material. The present invention improves the conventional aluminum-based material, and has lightweightness, a low price, a high economic value, a high electric conductivity, a high thermal conductivity and a superior solderability. Thereby, a normal soldering, a total-face soldering or a double-side soldering can be easily performed on the solderable aluminum-based material of the present invention with a common soldering technology.

Abstract translation: 本发明公开了一种可焊接铝基材料，其中电子给体与铝基材料表面上的非键合原子结合。 电子给体和表面上的铝原子之间的键合产生保护膜，以防止在铝基材料的表面上形成氧化铝层。 本发明改进了传统的铝基材料，具有轻便性，低价格，高经济价值，高导电性，高导热性和优异的可焊性。 因此，通过普通的焊接技术，可以容易地对本发明的可焊接的铝基材料进行正常的焊接，总面焊接或双面焊接。