INTEGRATED DEVICES WITH PHOTOEMISSIVE STRUCTURES
    2.
    发明申请
    INTEGRATED DEVICES WITH PHOTOEMISSIVE STRUCTURES 审中-公开
    具有结构结构的集成器件

    公开(公告)号:US20160203938A1

    公开(公告)日:2016-07-14

    申请号:US15076556

    申请日:2016-03-21

    Abstract: An apparatus is disclosed for the examination and inspection of integrated devices such as integrated circuits. X-rays are transmitted through the integrated device, and are incident on a photoemissive structure that absorbs x-rays and emits electrons. The electrons emitted by the photoemissive structure are shaped by an electron optical system to form a magnified image of the emitted electrons on a detector. This magnified image is then recorded and processed.For some embodiments of the invention, the photoemissive structure is deposited directly onto the integrated device. In some embodiments, the incidence angle of the x-rays is varied to allow internal three-dimensional structures of the integrated device to be determined. In other embodiments, the recorded image is compared with a reference data to enable inspection for manufacturing quality control.

    Abstract translation: 公开了用于集成电路等集成装置的检查和检查的装置。 X射线通过集成器件传输,入射到吸收x射线并发射电子的光发射结构上。 由发光结构发射的电子通过电子光学系统成形,以在检测器上形成发射电子的放大图像。 然后记录和处理该放大的图像。 对于本发明的一些实施例,光发射结构直接沉积在集成器件上。 在一些实施例中,X射线的入射角度被改变以允许确定集成器件的内部三维结构。 在其他实施例中,将记录的图像与参考数据进行比较,以使得能够进行制造质量控制的检查。

    Apparatus for field-programmable gate array with configurable architecture and associated methods
    4.
    发明授权
    Apparatus for field-programmable gate array with configurable architecture and associated methods 有权
    具有可配置架构和相关方法的现场可编程门阵列的装置

    公开(公告)号:US09165931B1

    公开(公告)日:2015-10-20

    申请号:US14187185

    申请日:2014-02-21

    CPC classification number: G06F17/5054 G06F15/7867 H01L27/115 H03K19/17728

    Abstract: An integrated circuit (IC) includes a substrate that is common to the IC and variants of the IC. The IC also includes a first set of interconnect layers fabricated above the substrate. The first set of interconnect layers is used to couple programmable interconnect of the IC to a first circuit in the substrate. The IC further includes a second set of interconnect layers fabricated above the substrate. The second set of interconnect layers is used to differentiate features of the IC from variants of the IC by selectively coupling the programmable interconnect to a second circuit in the substrate.

    Abstract translation: 集成电路(IC)包括IC的通用基板和IC的变体。 IC还包括在衬底上方制造的第一组互连层。 第一组互连层用于将IC的可编程互连件耦合到衬底中的第一电路。 IC还包括在衬底上方制造的第二组互连层。 第二组互连层用于通过选择性地将可编程互连连接到衬底中的第二电路来区分IC的特征与IC的变体。

    DEVICES PROCESSED USING X-RAYS
    5.
    发明申请
    DEVICES PROCESSED USING X-RAYS 审中-公开
    使用X-RAYS处理的设备

    公开(公告)号:US20150270023A1

    公开(公告)日:2015-09-24

    申请号:US14732674

    申请日:2015-06-06

    Abstract: Objects undergoing processing by a high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from an extended source having a designated x-ray spectrum. The system also comprises a stage to control the position and orientation of the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

    Abstract translation: 通过具有高通量x射线源的高分辨率X射线显微镜进行处理的物体,允许对诸如集成电路(IC),印刷电路板(PCB)和其他IC封装技术的物体进行高速计量或检验。 待调查对象由来自具有指定的x射线谱的扩展源的准直的高通量X射线照射。 该系统还包括一个控制对象的位置和方位的阶段; 吸收x射线并发射位于与物体非常接近(或接触)的可见光子的闪烁体; 形成由闪烁体发射的光子的高度放大的高分辨率图像的光学成像系统; 以及诸如CCD阵列的检测器,以将图像转换成电子信号。

    Multichip module with reroutable inter-die communication
    6.
    发明授权
    Multichip module with reroutable inter-die communication 有权
    多芯片模块具有可重新进行的管芯间通信

    公开(公告)号:US08895981B2

    公开(公告)日:2014-11-25

    申请号:US13339130

    申请日:2011-12-28

    Applicant: David Lewis

    Inventor: David Lewis

    Abstract: A multichip module (MCM) has redundant I/O connections between its dice. That is, the number of inter-die I/O connections used is larger than the number of connections ordinarily used to provide connectivity between the dice. Defective connections are discovered through testing after MCM assembly and avoided, with signals being rerouted through good (e.g., not defective) redundant connections. The testing can be done at assembly time and the results stored in nonvolatile memory. Alternatively, the MCM can perform the testing itself dynamically, e.g., at power up, and use the test results to configure the inter-die I/O connections.

    Abstract translation: 多芯片模块(MCM)在其骰子之间具有冗余I / O连接。 也就是说,使用的管芯间I / O连接的数量大于通常用于提供骰子之间的连接的连接数。 通过在MCM组装之后的测试发现有缺陷的连接,并避免了信号通过良好(例如,不是有缺陷的)冗余连接被重新路由。 测试可以在汇编时完成,结果存储在非易失性存储器中。 或者,MCM可以动态地执行测试,例如在上电时,并且使用测试结果来配置管芯间I / O连接。

    User interface for a complex order processing system
    7.
    发明授权
    User interface for a complex order processing system 有权
    复杂订单处理系统的用户界面

    公开(公告)号:US08732026B2

    公开(公告)日:2014-05-20

    申请号:US12244558

    申请日:2008-10-02

    Abstract: A method for processing complex orders is disclosed. The method includes generating a customer portal view including a list of products and services associated with an account, a list of quotes associated with the account, a list of orders associated with the account, and a plurality of user-selectable options. The plurality of user-selectable options includes a move option to transfer a service profile by defaulting the existing services at an old location to a new location.

    Abstract translation: 公开了一种处理复杂订单的方法。 该方法包括生成客户门户视图,其包括与帐户相关联的产品和服务的列表,与该帐户相关联的报价列表,与该帐户相关联的订单列表以及多个用户可选择的选项。 多个用户可选择的选项包括通过将旧位置处的现有服务默认地转移到新位置来传送服务简档的移动选项。

    Guide nozzle for use with filter rod manufacturing apparatus
    9.
    发明授权
    Guide nozzle for use with filter rod manufacturing apparatus 有权
    导向管用于过滤杆制造装置

    公开(公告)号:US08652020B2

    公开(公告)日:2014-02-18

    申请号:US13259695

    申请日:2010-02-23

    CPC classification number: A24D3/0212 A24D3/0204

    Abstract: A guide nozzle (112) for use with an apparatus (110) for the manufacture of filter rods for smoking articles. The guide nozzle comprises a support member (130) configured to be fixed relative to said apparatus for the manufacture of filter rods, a funnel (120) through which loose filter material is propelled, mounted to the support member and, an adjuster (140) mounted between the support member and the funnel to enable the relative position of the funnel and the support member to be adjusted to control the direction of flow of loose filter material propelled through the funnel. An apparatus for the manufacture of filter rods for smoking articles having such a guide nozzle, and a method of manufacturing a filter rod using the same.

    Abstract translation: 一种与用于制造用于吸烟物品的过滤棒的设备(110)一起使用的引导喷嘴(112)。 所述引导喷嘴包括构造成相对于所述用于制造过滤杆的装置固定的支撑构件(130),漏斗(120),松散的过滤材料通过所述漏斗安装到所述支撑构件上,以及调节器(140) 安装在支撑构件和漏斗之间以使得能够调节漏斗和支撑构件的相对位置以控制通过漏斗推进的松散过滤材料的流动方向。 一种用于制造具有这种引导喷嘴的吸烟制品的过滤杆的装置,以及使用该过滤棒的过滤杆的制造方法。

    Memory error detection circuitry
    10.
    发明授权
    Memory error detection circuitry 有权
    内存错误检测电路

    公开(公告)号:US08560927B1

    公开(公告)日:2013-10-15

    申请号:US12869666

    申请日:2010-08-26

    CPC classification number: G06F11/10 G06F11/1048

    Abstract: Integrated circuits with memory elements may be provided. Integrated circuits may include memory error detection circuitry that is capable of correcting single-bit errors, correcting adjacent double-bit errors, and detecting adjacent triple-bit errors. The memory error detection circuitry may include encoding circuitry that generates parity check bits interleaved among memory data bits. The memory error detection circuitry may include decoding circuitry that is used to generate output data and error signals to indicate whether a correctable soft error or an uncorrectable soft error has been detected. The output data may be written back to the memory elements if a correctable soft error is detected. The memory error detection circuitry may be operable in a pipelined or a non-pipelined mode depending on the desired application.

    Abstract translation: 可以提供具有存储元件的集成电路。 集成电路可以包括能够校正单位错误,校正相邻双位错误以及检测相邻三位错误的存储器错误检测电路。 存储器错误检测电路可以包括生成在存储器数据位之间交错的奇偶校验位的编码电路。 存储器错误检测电路可以包括用于产生输出数据和错误信号的解码电路,以指示是否检测到可校正的软错误或不可校正的软错误。 如果检测到可校正的软错误,则输出数据可以被写回到存储器元件。 存储器错误检测电路可以根据期望的应用以流水线或非流水线方式工作。

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