Electrical power circuit for an electrical power converter

    公开(公告)号:US11515804B2

    公开(公告)日:2022-11-29

    申请号:US17266418

    申请日:2019-08-06

    Abstract: An electric circuit for a power converter having a substrate having a first face on which electronic components are mounted and a second face intended to cooperate with a cooling system, the substrate having a stack of conductive layers made of electrically and thermally conductive material and at least one insulating layer made of electrically insulating material, two successive conductive layers being separated by an insulating layer, and the conductive and insulating layers extending in parallel planes and being mechanically associated together. Each conductive layer has two opposite faces parallel to the plane in which the first face of the substrate extends and includes, on at least one of its two faces, at least one boss extending in a direction perpendicular to the plane, the at least one boss passing through at least one other conductive layer and opening out onto the first or the second face of the substrate.

    ELECTRICAL POWER CIRCUIT FOR AN ELECTRICAL POWER CONVERTER

    公开(公告)号:US20210297003A1

    公开(公告)日:2021-09-23

    申请号:US17266418

    申请日:2019-08-06

    Abstract: An electric circuit for a power converter having a substrate having a first face on which electronic components are mounted and a second face intended to cooperate with a cooling system, the substrate having a stack of conductive layers made of electrically and thermally conductive material and at least one insulating layer made of electrically insulating material, two successive conductive layers being separated by an insulating layer, and the conductive and insulating layers extending in parallel planes and being mechanically associated together. Each conductive layer has two opposite faces parallel to the plane in which the first face of the substrate extends and includes, on at least one of its two faces, at least one boss extending in a direction perpendicular to the plane, the at least one boss passing through at least one other conductive layer and opening out onto the first or the second face of the substrate.

Patent Agency Ranking