中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

4 records (took 0.014 seconds)

    Digital baseband receiver with DC discharge and gain control circuits
    2.
    发明申请
    Digital baseband receiver with DC discharge and gain control circuits 审中-公开
    具有直流放电和增益控制电路的数字基带接收器

    公开(公告)号：US20080020725A1

    公开(公告)日：2008-01-24

    申请号：US11904063

    申请日：2007-09-25

    Applicant: Alpaslan Demir ,  Leonid Kazakevich ,  Fatih Ozluturk ,  Geetha Narayan

    Inventor： Alpaslan Demir ,  Leonid Kazakevich ,  Fatih Ozluturk ,  Geetha Narayan

    IPC: H04B7/00

    CPC classification number: H04B1/30 ,  H03D3/008

    Abstract: A digital baseband (DBB) receiver for receiving and processing a wireless communication signal. The DBB receiver includes at least one low noise amplifier (LNA), at least one demodulator, a direct current (DC) discharge circuit and an LNA control circuit. The LNA selectively amplifies the communication signal. The demodulator outputs analog real and imaginary signal components on real and imaginary signal paths, respectively, in response to receiving the communication signal from the LNA. The DC discharge circuit selectively discharges DC accumulating on at least one of the real and imaginary signal paths. The LNA control circuit turns the LNA on or off.

    Abstract translation: 一种用于接收和处理无线通信信号的数字基带（DBB）接收机。 DBB接收器包括至少一个低噪声放大器（LNA），至少一个解调器，直流（DC）放电电路和LNA控制电路。 LNA选择性地放大通信信号。 解调器响应于接收到来自LNA的通信信号，分别在实信号路径和虚信号路径上输出模拟实信号和虚信号分量。 直流放电电路选择性地放电积累在实信号路径和虚信号路径中的至少一个上的DC。 LNA控制电路打开或关闭LNA。

    Digital baseband receiver with DC discharge and gain control circuits
    4.
    发明申请
    Digital baseband receiver with DC discharge and gain control circuits 失效
    具有直流放电和增益控制电路的数字基带接收器

    公开(公告)号：US20050003777A1

    公开(公告)日：2005-01-06

    申请号：US10832594

    申请日：2004-04-27

    Applicant: Alpaslan Demir ,  Leonid Kazakevich ,  Fatih Ozluturk ,  Geetha Narayan

    Inventor： Alpaslan Demir ,  Leonid Kazakevich ,  Fatih Ozluturk ,  Geetha Narayan

    IPC: H03D3/00 ,  H04B1/30 ,  H04B1/16 ,  H04B1/18 ,  H04B1/26

    CPC classification number: H04B1/30 ,  H03D3/008

    Abstract: A method for manufacturing a plurality or metal core substrates for a surface-mounted light emitting diode includes steps of adhering a pair of metal base plates and a plurality of insulation layers, adhering a pair of metal base plates interposing one of the insulation layers as a first insulation layer to form a set plate, stacking a plurality of set plates between a pair of guide plates, interposing a separation gap between adjacent set plates to form a set plate block, cutting the set plate block in a stacking direction to form a set plate aggregation, securing a second insulation layer to a cut surface of the set plate aggregation, securing a circuit pattern aggregation layer to the second insulation layer to form a metal core substrate aggregation, forming a separation groove on the circuit pattern aggregation layer between adjacent set plates, corresponding to the separation gap, forming a groove along a center line of the set plate to separate the set plate into first and second circuit pattern aggregations, forming electrodes on both sides of the substrate aggregation, separating the guide plates, and cutting off the substrate aggregation into independent substrates.

    Abstract translation: 用于制造表面安装发光二极管的多个或金属芯基板的方法包括以下步骤：粘附一对金属基板和多个绝缘层，将一个绝缘层中的一个金属基板粘附在一起 第一绝缘层以形成固定板，在一对引导板之间堆叠多个固定板，在相邻的固定板之间插入分隔间隙以形成固定板块，在堆叠方向上切割固定板块以形成一组 将第二绝缘层固定到固定板聚集体的切割表面上，将电路图案聚集层固定到第二绝缘层以形成金属芯基板聚集，在相邻集合之间的电路图案聚集层上形成分隔槽 对应于分离间隙的板，沿着固定板的中心线形成凹槽，以将固定板分离成第一和第二 d电路图案聚集，在基板聚集的两侧形成电极，分离引导板，并将基板聚集体切割成独立的基板。

Patent Agency Ranking