公开(公告)号：US5543108A

公开(公告)日：1996-08-06

申请号：US257643

申请日：1994-06-09

Applicant: Walter Bacher ,  Hans Biedermann ,  Heinz Dinglreiter ,  Helmut Kalb

Inventor： Walter Bacher ,  Hans Biedermann ,  Heinz Dinglreiter ,  Helmut Kalb

IPC: B29C33/52 ,  B29C33/00 ,  B29C67/00 ,  B29D99/00 ,  B81C1/00 ,  B32B31/00

CPC classification number: B29C43/021 ,  B29C33/0033 ,  B81C99/0085 ,  B29C2059/023 ,  B29L2011/0016 ,  B29L2031/14 ,  B29L2031/7506 ,  B29L2031/7532 ,  B81C2201/0183 ,  B81C2201/056

Abstract: A method of making microstructure bodies of plastic material. A microstructured plate-like base body which is made by any known molding procedure and which has a first side serving as a first reference plane and a second side which has plastic microstructures projecting therefrom is covered at its second side with a material layer that engages the microstructures, whereupon the material layer is machined to provide a second reference surface parallel to the first reference surface and the base body is then machined parallel to the second reference surface to expose the microstructures projecting therefrom and the material layer is finally removed selectively with respect to the plastic material to release the microstructured bodies.

Abstract translation: 一种制造塑料材料微结构体的方法。 通过任何已知的模制步骤制成并具有第一侧作为第一参考平面的微结构的板状基体，以及具有从其突出的具有塑性微结构的第二侧在其第二侧被覆盖有材料层 微结构，然后材料层被加工以提供平行于第一参考表面的第二参考表面，然后平行于第二参考表面加工基体，以暴露从其突出的微结构，并且材料层最终相对于 塑料材料释放出微结构体。

公开(公告)号：US5512161A

公开(公告)日：1996-04-30

申请号：US404173

申请日：1995-03-06

Applicant: Heinz Dinglreiter ,  Helmut Kalb ,  Richard Rapp

Inventor： Heinz Dinglreiter ,  Helmut Kalb ,  Richard Rapp

IPC: B29C59/02 ,  B81B1/00 ,  C25D1/10

CPC classification number: B81B1/00 ,  B29C59/026 ,  C25D1/10 ,  B29C2059/023

Abstract: In a process for galvanically forming structured plate-like bodies, wherein a layer of a plastic material is structured at one side and structure bodies with plane front surfaces are formed thereon so as to rise from a contiguous electrically conductive base, the front surfaces of the structure bodies are provided with isolated spangles of electrically conductive material which are electrically insulated from each other and sized and spaced such that a line across a front surface intersects at least one of the spangles and the structure base--used as a cathode--and the structured bodies are then galvanically covered with a metal to form the structured plate on the layer of plastic material.

Abstract translation: 在电镀形成结构化的板状体的方法中，其中塑料材料层被构造在一侧，并且在其上形成具有平面前表面的结构体，以便从连续的导电基底上升， 结构体设置有导电材料的隔离的矩形，它们彼此电绝缘并且尺寸和间隔使得穿过前表面的线与至少一个矩形和用作阴极的结构基底相交，并且结构化 然后用金属电镀覆盖体，以在塑料材料层上形成结构化板。