Abstract:
Disclosed is a method of measuring thickness or a surface profile of a thin film layer formed on a base layer through a white light scanning interferometry, the method including: preparing simulation interference signals corresponding to thicknesses by assuming a plurality of sample thin film layers different in thickness from one another and simulating interference signals with respect to the respective sample thin film layers; acquiring a real interference signal with respect to an optical-axis direction of entering the thin film layer by illuminating the thin film layer with white light; preparing a plurality of estimated thicknesses that the thin film layer may have on the basis of the real interference signal; comparing whether the simulation interference signal having thickness corresponding to the estimated thickness is substantially matched with the real interference signal; and determining the thickness of the simulation interference signal substantially matched with the real interference signal as the thickness of the thin film layer.
Abstract:
A measurement and compensation system for thermal errors in a machine tool is disclosed. A module is provided to compensate thermal errors of the machine tool. The module comprises an operating part, a data bank, an analog to digital converter, a counter and a digital input/output part. The data bank stores in all the coefficients applied to a thermal error modeling equation which governs a relation between temperatures and thermal errors at various operating conditions. The operating part determines all the coefficients of the thermal error modeling equation which are stored in the data bank and calculates the thermal errors corresponding to the temperatures of a plurality of the thermocouples by the temperatures of a plurality of thermocouples inputted from the A/D converter and the positional coordinates of the bed inputted from the counter. Then, digital data of the calculated thermal errors are inputted into the digital input/output part and the digital input/output part converts the digital data to digital signal to input the digital signals into the controller. A controller orders the machine tool to compensate the thermal errors at the positional coordinates of the bed and the feed of the spindle. Accordingly, since the machine tool compensates the thermal errors in advance, the machine tool processes precisely workpieces in spite of the occurrence of the thermal errors.
Abstract:
A non-contacting measuring method for three dimensional micro pattern in a measuring object is disclosed. Three dimensional micro pattern of the surface of the measuring object is measured using blur of light. For measurement, a mechanism of an optical window with a slit is inserted between light source and the measuring object. The blurred image is captured by charge coupled device sensor based image frame grabber, and is analyzed in personal computers. All the values of the relative height differences are obtained in overall scanning measurement area of the measuring object. The relative height differences are the distances from the reference position to the other positions. The reference position is selected when its image is sharp in focus on the screen. At this time, images of the other positions except the reference position are blurred out of focus on the screen. Also, from the law of geometric optics and the geometric similarity of triangles, the relation equation between the height difference and the ratio of blurred image size to sharp image size can be constructed. When the size of the image of the reference position and the sizes of the images with the blurred image of the other positions are measured, all the height differences between the reference position and the other position can be calculated if the coefficients of the relation equation are evaluated.
Abstract:
Provided is an ultra-precision feeding apparatus. The feeding apparatus comprises an actuator horizontally positioned between a base and a motion stage movably provided to the top of the base, first hinge member which is fixed to the base and one end of the actuator, second hinge member which is fixed to the other end of the actuator, third hinge member with two hinges which is fixed to the motion stage, and a lever member with a notch hinge which is fixed to the base and cooperates with the second hinge member and the third hinge member.
Abstract:
An apparatus for measuring a thickness, which includes: a first beam splitter for reflecting or transmitting a ray irradiated from an optical source or a ray reflected by a measurement object; a first lens part which condenses a ray to the measurement object and generates a reference ray having a difference of a light path in comparison with a ray reflected by the measurement object; a second lens part for condensing a ray to the object to be measured; an interference light detector which corresponds to at the first lens part so as to form a light path and detects an interference signal generated by the ray reflected by the measurement object and the reference ray; a spectroscopic detector which corresponds to the second lens part so as to form a light path different from the light path formed by the interference light detector and splits the ray reflected by the measurement object so as to detect an intensity and a wavelength of each split ray; and a light path converter for selectively transmitting a ray to one of the interference light detector and the spectroscopic detector, wherein position exchanging is performed between the first lens part and the second lens part.
Abstract:
Disclosed is a method for measuring a thickness of a subjecting layer attacked on a base layer by means of an interferometer, which includes the steps of: obtaining a correlation equation of a phase difference with respect to thicknesses of sample layers, the thicknesses being different from each other, the sample layers being made from a material substantially equal to a material of the subjecting layer; obtaining a first interference signal with respect to an optical axial direction incident to the base layer at a boundary surface between an air layer and the base layer; obtaining a second interference signal with respect to the optical axial direction at a boundary surface between the subjecting layer and the base layer; obtaining a phase difference between a phase of the first interference signal and a phase of the second interference signal at respective heights substantially equal to each other with respect to the optical axial direction; and determining a thickness of the subjecting layer by inserting the phase difference into the correlation equation.
Abstract:
A method of assessing three-dimensional volumetric errors of multiaxis machine tools in three-dimensional working space is disclosed. Each three-dimensional volumetric error component can be systematically measured and analyzed on the modeling of polynominal functions in accordance with the volumetric errors and the kinematic chain in accordence with the corresponding machine tool. The method inputs the measured radial data performed on the three orthogonal planes, analyzing the parametric errors such as positional, straightness, angular, squareness, and backlash errors. The positional error components along each of three orthogonal axes are modeled as a dimensionless polynominal function with corresponding positional error coefficients. The method also can assess dynamic performance of the machine tools such errors due to the servo gain mismatch. The method employs the kinematic ball bar to assess the volumetric errors.
Abstract:
Disclosed is a method of measuring thickness or a surface profile of a thin film layer formed on a base layer through a white light scanning interferometry, the method including: preparing simulation interference signals corresponding to thicknesses by assuming a plurality of sample thin film layers different in thickness from one another and simulating interference signals with respect to the respective sample thin film layers; acquiring a real interference signal with respect to an optical-axis direction of entering the thin film layer by illuminating the thin film layer with white light; preparing a plurality of estimated thicknesses that the thin film layer may have on the basis of the real interference signal; comparing whether the simulation interference signal having thickness corresponding to the estimated thickness is substantially matched with the real interference signal; and determining the thickness of the simulation interference signal substantially matched with the real interference signal as the thickness of the thin film layer.
Abstract:
Disclosed is a method for measuring a thickness of a subjecting layer attached on a base layer by means of an interferometer, which includes the steps of: obtaining a correlation equation of a phase difference with respect to thicknesses of sample layers, the thicknesses being different from each other, the sample layers being made from a material substantially equal to a material of the subjecting layer; obtaining a first interference signal with respect to an optical axial direction incident to the base layer at a boundary surface between an air layer and the base layer; obtaining a second interference signal with respect to the optical axial direction at a boundary surface between the subjecting layer and the base layer; obtaining a phase difference between a phase of the first interference signal and a phase of the second interference signal at respective heights substantially equal to each other with respect to the optical axial direction; and determining a thickness of the subjecting layer by inserting the phase difference into the correlation equation.
Abstract:
Disclosed is a laser processing device for processing a surface of an object with laser beams. The laser processing device includes: a laser beam generating unit for projecting laser beams; and a micromirror device having a plurality of micromirrors, the micromirrors being configured to reflect and transfer at least a part of laser beams projected from the laser beam generating unit to the surface of the object in a pattern for processing the surface of the object in a desired shape. The micromirrors of the micromirror device are capable of selectively switching the light path of the laser beams projected from the laser beam generating unit. According to the present invention, a surface of an object can be either two-dimensionally or three-dimensionally processed in a desired shape with laser beams.