Printed wiring board and method for manufacturing printed wiring board
    1.
    发明授权
    Printed wiring board and method for manufacturing printed wiring board 有权
    印刷电路板及制造印刷线路板的方法

    公开(公告)号:US08901431B2

    公开(公告)日:2014-12-02

    申请号:US13307499

    申请日:2011-11-30

    Abstract: A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.

    Abstract translation: 一种印刷电路板,包括层间树脂绝缘层,形成在层间树脂绝缘层上并用于安装电子部件的焊盘,形成在层间树脂绝缘层和焊盘上的阻焊层,并且在焊盘上具有开口部分 以及形成在焊盘上并通过阻焊层的开口部露出的涂层。 阻焊层具有在开口部的底部朝向开口部的内侧突出的突出部,并且阻焊层的突出部在突出部的端部具有平坦的表面。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    2.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
    印刷线路板和制造印刷线路板的方法

    公开(公告)号:US20120152600A1

    公开(公告)日:2012-06-21

    申请号:US13307499

    申请日:2011-11-30

    Abstract: A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.

    Abstract translation: 一种印刷电路板,包括层间树脂绝缘层,形成在层间树脂绝缘层上并用于安装电子部件的焊盘,形成在层间树脂绝缘层和焊盘上的阻焊层,并且在焊盘上具有开口部分 以及形成在焊盘上并通过阻焊层的开口部露出的涂层。 阻焊层具有在开口部的底部朝向开口部的内侧突出的突出部,并且阻焊层的突出部在突出部的端部具有平坦的表面。

    Fluoroscopic and radiographic X-ray imaging system
    3.
    发明授权
    Fluoroscopic and radiographic X-ray imaging system 失效
    荧光镜和放射X光成像系统

    公开(公告)号:US4658413A

    公开(公告)日:1987-04-14

    申请号:US874472

    申请日:1986-06-16

    CPC classification number: H04N5/32 H05G1/46 H05G1/60

    Abstract: An X-ray imaging system which enables recording of an X-ray image of an object at a desired time without substantial delay while fluoroscopically observing the X-ray image with the eye, and in which the filament current of the X-ray tube is kept at a constant level at all times, and the tube voltage is supplied in synchronism with the vertical scanning of a TV camera in the form of pulses, the width of which is changed depending upon whether the X-ray image is fluoroscopically observed with the eye or a picture thereof is radiographically recorded.

    Abstract translation: 一种X射线成像系统,其能够在利用眼睛荧光观察X射线图像的同时在期望的时间记录物体的X射线图像,而X射线管的细丝电流为 始终保持恒定水平,并且以脉冲形式的电视摄像机的垂直扫描同步地供给管电压,其宽度根据X射线图像是否被透视观察而改变 眼睛或其图片被放射摄影记录。

Patent Agency Ranking