Abstract:
A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.
Abstract:
A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.
Abstract:
An X-ray imaging system which enables recording of an X-ray image of an object at a desired time without substantial delay while fluoroscopically observing the X-ray image with the eye, and in which the filament current of the X-ray tube is kept at a constant level at all times, and the tube voltage is supplied in synchronism with the vertical scanning of a TV camera in the form of pulses, the width of which is changed depending upon whether the X-ray image is fluoroscopically observed with the eye or a picture thereof is radiographically recorded.