公开(公告)号：US20240258732A1

公开(公告)日：2024-08-01

申请号：US18289701

申请日：2022-07-02

Applicant: Interplex Industries, Inc.

Inventor： Richard Schneider

IPC: H01R13/187 ,  H01R12/57 ,  H01R12/70 ,  H01R12/91

CPC classification number: H01R13/187 ,  H01R12/57 ,  H01R12/7082 ,  H01R12/91

Abstract: A coupler for connection to a substrate for mounting electronic devices. The coupler includes a coupling contact formed from metal and having opposing planar surfaces. The coupling contact includes a body having a pair of arms and a pair of legs joined thereto. The coupling contact is pivotally mounted to a frame formed from metal. The frame includes a body having a center plate with front and rear appendages joined thereto. The center plate has a top edge about which the coupling contact may pivot. The frame further includes a pair of holders having holding slots formed therein, respectively. The holders are disposed on opposing sides of the center plate, respectively, whereby portions of the arms are disposed in the holding slots, respectively.

公开(公告)号：US20240014580A1

公开(公告)日：2024-01-11

申请号：US18214407

申请日：2023-06-26

Applicant: Interplex Industries, Inc.

Inventor： Richard Schneider

IPC: H01R4/58 ,  H01R4/48

CPC classification number: H01R4/58 ,  H01R4/48

Abstract: A canted coil for use in a connector to make an electrical connection between conductors to form a conductor assembly. The canted coil includes a substantially cylindrical body formed from at least one length of conductive wire and having a series of adjacent loops with gaps in-between. The body has opposing first and second end portions. A blocking bar extends through the body of the canted coil, between the first and second end portions of the body.

公开(公告)号：US11824298B2

公开(公告)日：2023-11-21

申请号：US17427632

申请日：2020-02-07

Applicant: Interplex Industries, Inc.

Inventor： Richard Schneider

IPC: H01R13/24 ,  H01R12/52 ,  H01R12/58 ,  H01R12/70

CPC classification number: H01R13/2428 ,  H01R12/523 ,  H01R12/585 ,  H01R12/707

Abstract: An electrical contact is provided for connecting together substrates. The electrical contact has a longitudinal axis and includes first and second structures that are connected together to prevent relative movement between each other. The first structure extends along the longitudinal axis and has a rigid construction. The second structure includes a spring portion and a mounting portion. The spring portion is resiliently deflectable in the direction of the longitudinal axis. The mounting portion is adapted for securement to one of the substrates. A press-fit portion is provided that extends along the longitudinal axis and is adapted for press-fit insertion into a hole of the other one of the substrates. The press-fit portion may be part of the first structure or the second structure. In addition, the first structure may be composed of metal or plastic.

公开(公告)号：US20230209714A1

公开(公告)日：2023-06-29

申请号：US17920960

申请日：2021-04-26

Applicant: Interplex Industries, Inc.

Inventor： Richard Schneider ,  Richard A. Johannes

IPC: H05K1/14 ,  H01R12/52 ,  H01R12/62 ,  H01R12/91 ,  H05K3/36

CPC classification number: H05K1/148 ,  H01R12/52 ,  H01R12/62 ,  H01R12/91 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/10598 ,  H05K2203/167

Abstract: A jumper assembly for connecting together first and second circuit boards. The jumper assembly includes a frame secured to a flexible circuit having a plurality of conductive traces. The frame includes a bridge that connects together first and second side structures, each having a window and a moveable lever. The first side structure is secured over the first circuit board and the second side structure is secured over the second circuit board. First end portions of the traces of the flexible circuit are secured to contact pads of the first circuit board, while second end portions of the traces of the flexible circuit are secured to contact pads of the second circuit board. The bridge of the frame is removed after the jumper assembly is secured to the first and second circuit boards.

公开(公告)号：US20200060022A1

公开(公告)日：2020-02-20

申请号：US16580507

申请日：2019-09-24

Applicant: Interplex Industries, Inc.

Inventor： Richard Schneider ,  Joseph J. Lynch ,  Craig Kennedy ,  Vu Phan

IPC: H05K1/02 ,  H05K1/18 ,  H01R12/52 ,  H02G5/00 ,  H05K3/46 ,  H05K3/42

Abstract: An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.

公开(公告)号：US20240079608A1

公开(公告)日：2024-03-07

申请号：US18029776

申请日：2021-10-18

Applicant: Interplex Industries, Inc.

Inventor： Jeng-De Lin ,  Jeffrey Parrish

IPC: H01M8/0247 ,  H01M8/04537 ,  H01R12/58 ,  H01R13/11 ,  H01R13/641

CPC classification number: H01M8/0247 ,  H01M8/04552 ,  H01R12/58 ,  H01R13/113 ,  H01R13/641 ,  H01R13/639

Abstract: A voltage pick-up connector for connection to a bipolar plate of a fuel cell. The voltage pick-up connector includes a housing having a housing slot for receiving the bipolar plate. A pair of electrically conductive contact plates are disposed inside the housing and have contact elements for engaging the bipolar plate. An actuator is disposed between the contact plates and is disposed inside the housing. The actuator has a slot for receiving the bipolar plate. The actuator is movable between an extended position, wherein the actuator is disposed between the contact elements so as to separate the contact elements, and a retracted position, wherein the actuator is not disposed between the contact elements.

公开(公告)号：US11855398B2

公开(公告)日：2023-12-26

申请号：US17601400

申请日：2020-04-14

Applicant: Interplex Industries, Inc.

Inventor： Yin Qian ,  Keith S. Maranto ,  James M. Pick ,  Richard Schneider

IPC: H01R4/70 ,  H01R4/2429 ,  H01R12/58 ,  H01R12/70 ,  H01R13/11 ,  H01R13/405

CPC classification number: H01R4/2429 ,  H01R4/70 ,  H01R12/58 ,  H01R12/7088 ,  H01R13/113 ,  H01R13/405

Abstract: A multipart connector for electrical connection to a conductor to convey AC power having a frequency greater than 60 Hz. The connector includes a plurality of metal plates. Each metal plate has opposing planar surfaces and includes a pair of legs separated by a space. A plurality of insulation layers adjoin the planar surfaces of the metal plates, respectively. The insulation layers include a pair of legs separated by a space. The metal plates and the insulation layers are arranged in a stack such that the spaces of the metal plates and the insulation layers are aligned to form a groove extending through the stack. The conductor is disposed in the groove.

公开(公告)号：US11432442B2

公开(公告)日：2022-08-30

申请号：US17281170

申请日：2019-09-16

Applicant: Interplex Industries, Inc.

Inventor： Jeffrey D Parrish ,  Gregory Torigian ,  Anthony Miller

IPC: H05K9/00

Abstract: An electromagnetic compatability (EMC) shield and a method of producing the same are disclosed. The EMC shield is for mounting to a substrate having a plurality of holes formed therein, such as a printed circuit board. The EMC shield is formed from a sheet of conductive metal and includes a top wall having opposing side portions. A pair of opposing first side walls are joined to the top wall at first bends, respectively. Each first side wall has a bottom portion with a plurality of mounting contacts extending therefrom. The mounting contacts may have a press-fit construction and are adapted for receipt in the holes of the substrate. The EMC shield further includes a pair of opposing second side walls, each of which is joined by a second bend to one of the first side walls. Each second side wall has a top portion that at least partially adjoins one of the side portions of the top wall.

公开(公告)号：US20210391602A1

公开(公告)日：2021-12-16

申请号：US17284466

申请日：2019-10-15

Applicant: Interplex Industries, Inc.

Inventor： Craig Kennedy ,  Vu Phan

IPC: H01M10/48 ,  H01M10/42 ,  H01M50/507 ,  H01M50/522 ,  H01M50/519

Abstract: A battery module having a plurality of battery cells disposed in a housing and interconnected by upper and lower interconnect panels stamped from sheets of conductive metal. Each of the upper and lower interconnect panels have a plurality of contacts secured to terminals of the battery cells, respectively. The contacts are at least partially disposed in panel openings extending through the upper and lower interconnect panels. A carrier is provided and includes a lead frame molded into a body of thermoplastic resin. The lead frame connects a plurality of locations on the upper and lower interconnect panels to a monitoring module that measures physical properties at the locations.

公开(公告)号：US10784623B2

公开(公告)日：2020-09-22

申请号：US16673298

申请日：2019-11-04

Applicant: Interplex Industries, Inc.

Inventor： Richard Schneider ,  James M. Pick ,  Keith S. Maranto

IPC: H01R4/48 ,  H01R13/631 ,  H01R12/71 ,  H01R13/10 ,  H01R12/58 ,  H01R13/11 ,  H01R12/91 ,  H01R12/70 ,  H01R13/42 ,  H01R12/73

Abstract: A connector for connecting together rigid structures. The connector includes a stack of coupling contacts pivotably disposed within a housing. Each coupling contact is generally H-shaped and defines opposing first and second spaces. The first and second spaces are aligned to form first and second receiving grooves in the stack, respectively. The connector may also include one or more mounting contacts partially disposed within the housing. Each mounting contact has one or more fastening structures joined to a bar section. The fastening structures are adapted for securement to the substrate and the bar section is disposed in the second receiving groove of the stack of coupling contacts.