公开(公告)号：US20200060022A1

公开(公告)日：2020-02-20

申请号：US16580507

申请日：2019-09-24

Applicant: Interplex Industries, Inc.

Inventor： Richard Schneider ,  Joseph J. Lynch ,  Craig Kennedy ,  Vu Phan

IPC: H05K1/02 ,  H05K1/18 ,  H01R12/52 ,  H02G5/00 ,  H05K3/46 ,  H05K3/42

Abstract: An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.

公开(公告)号：US20210391602A1

公开(公告)日：2021-12-16

申请号：US17284466

申请日：2019-10-15

Applicant: Interplex Industries, Inc.

Inventor： Craig Kennedy ,  Vu Phan

IPC: H01M10/48 ,  H01M10/42 ,  H01M50/507 ,  H01M50/522 ,  H01M50/519

Abstract: A battery module having a plurality of battery cells disposed in a housing and interconnected by upper and lower interconnect panels stamped from sheets of conductive metal. Each of the upper and lower interconnect panels have a plurality of contacts secured to terminals of the battery cells, respectively. The contacts are at least partially disposed in panel openings extending through the upper and lower interconnect panels. A carrier is provided and includes a lead frame molded into a body of thermoplastic resin. The lead frame connects a plurality of locations on the upper and lower interconnect panels to a monitoring module that measures physical properties at the locations.

公开(公告)号：US11901524B2

公开(公告)日：2024-02-13

申请号：US17284466

申请日：2019-10-15

Applicant: Interplex Industries, Inc.

Inventor： Craig Kennedy ,  Vu Phan

IPC: H01M10/48 ,  H01M50/519 ,  H01M50/507 ,  H01M50/522 ,  H01M10/42 ,  H01M50/569 ,  H01M50/50

CPC classification number: H01M10/482 ,  H01M10/425 ,  H01M10/486 ,  H01M50/50 ,  H01M50/507 ,  H01M50/519 ,  H01M50/522 ,  H01M50/569 ,  H01M2220/20

Abstract: A battery module having a plurality of battery cells disposed in a housing and interconnected by upper and lower interconnect panels stamped from sheets of conductive metal. Each of the upper and lower interconnect panels have a plurality of contacts secured to terminals of the battery cells, respectively. The contacts are at least partially disposed in panel openings extending through the upper and lower interconnect panels. A carrier is provided and includes a lead frame molded into a body of thermoplastic resin. The lead frame connects a plurality of locations on the upper and lower interconnect panels to a monitoring module that measures physical properties at the locations.

公开(公告)号：US20240405376A1

公开(公告)日：2024-12-05

申请号：US18699176

申请日：2022-10-11

Applicant: INTERPLEX INDUSTRIES, INC.

Inventor： Vu Phan

IPC: H01M50/503 ,  H01M50/213 ,  H01M50/296 ,  H01M50/509 ,  H01M50/522

Abstract: A battery module having a plurality of battery cells arranged in groups. which are located in two or more module sections. A plurality of monolithic interconnect structures is connected to the battery cells. The interconnect structures are connected to the battery cells to have electrical current flow in a first direction in one of the module sections and flow in an opposing second direction in another one of the module sections. The interconnect structures are arranged in a single layer.

公开(公告)号：US10779392B2

公开(公告)日：2020-09-15

申请号：US16580507

申请日：2019-09-24

Applicant: Interplex Industries, Inc.

Inventor： Richard Schneider ,  Joseph J. Lynch ,  Craig Kennedy ,  Vu Phan

IPC: H05K1/02 ,  H02G5/00 ,  H01R12/52 ,  H05K3/42 ,  H05K3/46 ,  H05K1/18

Abstract: An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.