公开(公告)号：US07718901B2

公开(公告)日：2010-05-18

申请号：US11923509

申请日：2007-10-24

Applicant: Michimasa Takahashi ,  Ian Timms

Inventor： Michimasa Takahashi ,  Ian Timms

IPC: H05K1/00 ,  H05K3/02

CPC classification number: H05K3/4652 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/16227 ,  H01L2924/15153 ,  H01L2924/1533 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2203/063 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: An electronic parts substrate includes a base substrate, a plurality of insulating resin layers provided on the base substrate, at least one conductive circuit, and at least one filled via provided in the plurality of insulating resin layers. The at least one conductive circuit is sandwiched between the plurality of insulating resin layers and/or between the base substrate and the plurality of insulating resin layers. At least one opening is formed in at least one of the plurality of insulating resin layers.

Abstract translation: 电子部件基板包括基底基板，设置在基底基板上的多个绝缘树脂层，至少一个导电电路和设置在多个绝缘树脂层中的至少一个填充通孔。 所述至少一个导电电路夹在所述多个绝缘树脂层之间和/或所述基底基板与所述多个绝缘树脂层之间。 至少一个开口形成在所述多个绝缘树脂层中的至少一个中。

公开(公告)号：US20090107708A1

公开(公告)日：2009-04-30

申请号：US11923509

申请日：2007-10-24

Applicant: Michimasa Takahashi ,  Ian Timms

Inventor： Michimasa Takahashi ,  Ian Timms

IPC: H05K1/09 ,  H05K3/02

CPC classification number: H05K3/4652 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/16227 ,  H01L2924/15153 ,  H01L2924/1533 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2203/063 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: An electronic parts substrate includes a base substrate, a plurality of insulating resin layers provided on the base substrate, at least one conductive circuit, and at least one filled via provided in the plurality of insulating resin layers. The at least one conductive circuit is sandwiched between the plurality of insulating resin layers and/or between the base substrate and the plurality of insulating resin layers. At least one opening is formed in at least one of the plurality of insulating resin layers.

Abstract translation: 电子部件基板包括基底基板，设置在基底基板上的多个绝缘树脂层，至少一个导电电路和设置在多个绝缘树脂层中的至少一个填充通孔。 所述至少一个导电电路夹在所述多个绝缘树脂层之间和/或所述基底基板与所述多个绝缘树脂层之间。 至少一个开口形成在所述多个绝缘树脂层中的至少一个中。

公开(公告)号：US20090032289A1

公开(公告)日：2009-02-05

申请号：US11888666

申请日：2007-07-31

Applicant: Ian Timms ,  Tomi Sakain Kanninen

Inventor： Ian Timms ,  Tomi Sakain Kanninen

IPC: H05K1/02 ,  H05K3/02

CPC classification number: H05K3/0014 ,  H05K1/0237 ,  H05K1/0284 ,  H05K3/0097 ,  H05K2203/1536 ,  H05K2203/302 ,  Y10T29/4913

Abstract: A single circuit board has at least two planar sections and a bent section linking the planar sections. The circuit board has a circuit layer disposed on an insulating layer to provide routings and electrical connections to the electronic components on the two planar sections. The circuit layer has at least one circuit section on each of the two planer sections and one circuit section on the bent section. The single circuit board can have a ground plane or a second circuit layer disposed on the insulting layer on the opposite side of the circuit layer. The planar sections can be located on the same plane or on different planes. The multi-section circuit board can be made from a single-plane circuit board by using a mechanical tool to bend the board into shape.

Abstract translation: 单个电路板具有至少两个平面部分和连接平面部分的弯曲部分。 电路板具有设置在绝缘层上的电路层，以提供与两个平面部分上的电子部件的布线和电连接。 电路层在两个平面部分中的每一个上具有至少一个电路部分和在弯曲部分上的一个电路部分。 单电路板可以具有设置在电路层相对侧的绝缘层上的接地层或第二电路层。 平面部分可以位于同一平面上或不同的平面上。 多段电路板可以由单平面电路板通过使用机械工具将板弯曲成形。