公开(公告)号：US06334266B1

公开(公告)日：2002-01-01

申请号：US09665932

申请日：2000-09-20

Applicant: Heiko D Moritz ,  Jonathan A. Talbott ,  Mohan Chandra ,  James A. Tseronis ,  Ijaz Jafri

Inventor： Heiko D Moritz ,  Jonathan A. Talbott ,  Mohan Chandra ,  James A. Tseronis ,  Ijaz Jafri

IPC: F26B300

CPC classification number: B01J3/008 ,  B01J3/06 ,  F26B21/14 ,  H01L21/67034 ,  H01L21/67126 ,  H01L21/67757 ,  Y10S134/902

Abstract: A method and apparatus for fabricating and drying wafers, including micro-electro-mechanical system (MEMS) structures, in a second, supercritical processing fluid environment. The apparatus utilizes an inverted pressure vessel connected to a supercritical processing fluid supply and recover system, with an internal heat exchanger connected to external heating and cooling sources, which is closed with a vertically movable base plate. A wafer cassette configured for supporting multiple wafers is submerged in a first processing fluid within a container, which is installed on the base plate for insertion into the pressure vessel. Vessel inlet and outlet tubes extend vertically downward from the ceiling of the pressure vessel to nearly the base plate. Container inlet and outlet tubes extend vertically downward from the ceiling of the pressure vessel to inside the container and nearly to the bottom of the container. The tubes provide for displacement of the first processing fluid with the second processing fluid still in a liquid state, from which it is raised to supercritical state.

Abstract translation: 一种用于在第二超临界处理流体环境中制造和干燥晶片的方法和装置，包括微电子机械系统（MEMS）结构。 该设备利用与超临界加工流体供应和回收系统连接的倒置压力容器，内部热交换器连接到外部加热和冷却源，该外部加热和冷却源用可垂直移动的基板封闭。 构造成用于支撑多个晶片的晶片盒被浸没在容器内的第一处理流体中，该容器安装在基板上用于插入压力容器中。 容器入口和出口管从压力容器的天花板垂直向下延伸到几乎基板。 容器入口和出口管从压力容器的天花板垂直向下延伸到容器内部并且几乎到容器的底部。 这些管提供第一处理流体与第二处理流体的位移，该第二处理流体仍处于液态，从而将其升高到超临界状态。

公开(公告)号：US06497239B2

公开(公告)日：2002-12-24

申请号：US09778124

申请日：2001-02-05

Applicant: Robert B Farmer ,  Jonathan A. Talbott ,  Mohan Chandra ,  James A. Tseronis ,  Heiko D. Moritz

Inventor： Robert B Farmer ,  Jonathan A. Talbott ,  Mohan Chandra ,  James A. Tseronis ,  Heiko D. Moritz

IPC: B08B310

CPC classification number: H01L21/67126 ,  B01J3/008 ,  B01J3/06 ,  H01L21/67034 ,  Y10S134/902

Abstract: An inverted pressure vessel system for conducting automated industrial processes requiring elevated pressure and temperatures has a vertically movable pedestal for opening and closing the underside loading port, with pedestal drive system and locking mechanism located below the pedestal top and isolated from the chamber opening. The chamber is connectible to a pressure control and process fluid supply system, and has heat exchangers connected to an external source for temperature control. Process fluids are distributed across a central process cavity through divergent inflow and convergent outflow process fluid channels.

Abstract translation: 用于进行需要升高的压力和温度的自动化工业过程的倒置压力容器系统具有用于打开和关闭下侧装载口的可垂直移动的底座，底座驱动系统和锁定机构位于基座顶部下方并与腔室开口隔离。 该室可连接到压力控制和过程流体供应系统，并具有连接到外部温度控制源的热交换器。 过程流体通过发散流入和汇流流出流体通道分布在中心过程腔中。

公开(公告)号：US06508259B1

公开(公告)日：2003-01-21

申请号：US09632770

申请日：2000-08-04

Applicant: James A. Tseronis ,  Heiko D. Mortiz ,  Mohan Chandra ,  Robert B. Farmer ,  Ijaz H. Jafri ,  Jonathan Talbott

Inventor： James A. Tseronis ,  Heiko D. Mortiz ,  Mohan Chandra ,  Robert B. Farmer ,  Ijaz H. Jafri ,  Jonathan Talbott

IPC: B08B300

CPC classification number: H01L21/67126 ,  B01J3/008 ,  B01J3/06 ,  H01L21/67034 ,  H01L21/67757 ,  Y10S134/902

Abstract: A pressure vessel for use in production processes requiring elevating and ranging of temperatures and pressures during the process cycle, readily adaptable to production line operation, suitable for wafer processing in the semiconductor industry and for other industries and processes. The pressure vessel is configured within an open support frame with a stationary, preferably inverted, orientation. The cover or closing plate is vertically movable towards the mouth of the pressure vessel and functions as the platform by which the object under process is transferred into the vessel. The moving and locking mechanism for the cover is isolated and shielded from the process environment.

Abstract translation: 用于生产过程中的压力容器，其需要在加工循环期间升高和调节温度和压力，易于适应于生产线操作，适用于半导体工业中的晶片加工以及其它工业和工艺。 压力容器构造在具有固定的，优选地倒置的取向的开放支撑框架内。 盖子或封闭板可以垂直地朝向压力容器的口部移动，并且用作被处理物体转移到容器中的平台。 盖子的移动和锁定机构与工艺环境隔离和隔离。