公开(公告)号：US06232564B1

公开(公告)日：2001-05-15

申请号：US09169693

申请日：1998-10-09

Applicant: Steven Frederick Arndt ,  Mark Budman ,  James Richard Stack

Inventor： Steven Frederick Arndt ,  Mark Budman ,  James Richard Stack

IPC: H05K111

CPC classification number: H05K1/114 ,  H05K2201/09227 ,  H05K2201/10734

Abstract: A printed circuit board having a signal plane with increased channel width for enhanced wireability. The printed circuit board has a top plane having component lands arranged in a grid, wherein the component lands include a first grouping arranged in a first diagonal, and a second grouping arranged in a second diagonal where the second diagonal is parallel and adjacent to the first diagonal, a plurality of offset lands placed within the first diagonal between the component lands therein, and a plurality of electrical connectors electrically coupling component lands in the second diagonal to adjacent offset lands in the first diagonal.

Abstract translation: 一种印刷电路板，其具有增加的通道宽度的信号面以增强线性。 印刷电路板具有顶部平面，其具有以网格布置的分量平台，其中分量平台包括以第一对角线布置的第一分组和布置在第二对角线中的第二分组，其中第二对角线平行并邻近第一对角线 对角线，放置在其中的组件平台之间的第一对角线内的多个偏移平台以及将第二对角线中的组件平台电连接到第一对角线中的相邻偏移平台的多个电连接器。

公开(公告)号：US6078013A

公开(公告)日：2000-06-20

申请号：US168584

申请日：1998-10-08

Applicant: James Richard Stack

Inventor： James Richard Stack

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H05K1/00

CPC classification number: H05K1/114 ,  H05K3/3452 ,  H05K1/116 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K3/429

Abstract: A solder mask having a clover-leaf shaped opening around a PTH for enhanced performance. The solder mask resides on a surface of a printed circuit board comprising lands and PTH's. The opening around the PTH is configured to maintain a minimum channel width between the PTH and an adjacent land while maximizing the opening around the PTH, thereby decreasing the likelihood that the solder mask material will be inadvertently drawn into the PTH.

公开(公告)号：US6150061A

公开(公告)日：2000-11-21

申请号：US483851

申请日：2000-01-17

Applicant: James Richard Stack

Inventor： James Richard Stack

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  G03F9/00

CPC classification number: H05K1/114 ,  H05K3/3452 ,  H05K1/116 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K3/429

Abstract: A solder mask having a clover-leaf shaped opening around a PTH for enhanced performance. The solder mask resides on a surface of a printed circuit board comprising lands and PTH's. The opening around the PTH is configured to maintain a minimum channel width between the PTH and an adjacent land while maximizing the opening around the PTH, thereby decreasing the likelihood that the solder mask material will be inadvertently drawn into the PTH.

Abstract translation: 焊接掩模，具有围绕PTH的三叶草叶形开口，以提高性能。 焊接掩模位于包括焊盘和PTH的印刷电路板的表面上。 围绕PTH的开口被配置为在PTH和相邻区域之间保持最小通道宽度，同时最大化围绕PTH的开口，从而降低焊料掩模材料将被无意地吸入PTH的可能性。