公开(公告)号：US09300062B2

公开(公告)日：2016-03-29

申请号：US13282172

申请日：2011-10-26

Applicant: Christopher P. Hussell ,  Kurt S. Wilcox ,  Peter Scott Andrews ,  Jesse Colin Reiherzer

Inventor： Christopher P. Hussell ,  Kurt S. Wilcox ,  Peter Scott Andrews ,  Jesse Colin Reiherzer

IPC: H01R12/57 ,  H01R12/51 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01R12/515 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01R12/57 ,  Y10T29/49002 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2224/45099

Abstract: Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.

Abstract translation: 提供了用于发光装置的附件装置和方法。 在一个方面，发光器件可以包括设置在所述底座上的基座和发光区域。 该装置还可以包括设置在基座上的至少一个附接构件。 附接构件可以接合电气部件，从而在附接构件和电气部件之间提供气密的，无焊料的连接。

公开(公告)号：USD705181S1

公开(公告)日：2014-05-20

申请号：US29412166

申请日：2012-01-31

Applicant: Christopher P. Hussell ,  Erin R. F. Welch ,  Kurt S. Wilcox ,  Jesse Colin Reiherzer

Designer： Christopher P. Hussell ,  Erin R. F. Welch ,  Kurt S. Wilcox ,  Jesse Colin Reiherzer

公开(公告)号：US08455908B2

公开(公告)日：2013-06-04

申请号：US13336540

申请日：2011-12-23

Applicant: Erin R. F. Welch ,  Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Joseph Clark

Inventor： Erin R. F. Welch ,  Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Joseph Clark

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.

Abstract translation: 公开了发光器件和方法。 在一个实施例中，发光器件可以包括设置在所述底座上的基座和多个发光二极管（LED）。 底座的至少一部分可以包括至少部分地布置在焊接掩模下方的反射层。 底座内的一个或多个层可以包括一个或多个孔，粗糙的表面纹理或其组合以改善装置内的粘附。 该装置还可以包括分配在多个LED周围的保留材料。 公开了用于改善焊接掩模附着力的装置和方法。

公开(公告)号：USD676395S1

公开(公告)日：2013-02-19

申请号：US29408955

申请日：2011-12-19

Applicant: Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

Designer： Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

公开(公告)号：USD703348S1

公开(公告)日：2014-04-22

申请号：US29426661

申请日：2012-07-09

Applicant: Jesse Colin Reiherzer ,  Christopher P. Hussell

Designer： Jesse Colin Reiherzer ,  Christopher P. Hussell

公开(公告)号：US08686445B1

公开(公告)日：2014-04-01

申请号：US12969267

申请日：2010-12-15

Applicant: Christopher P. Hussell ,  Amber C. Abare ,  Jesse Colin Reiherzer

Inventor： Christopher P. Hussell ,  Amber C. Abare ,  Jesse Colin Reiherzer

IPC: H01L33/08

CPC classification number: H01L33/486 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emission package includes at least one solid state emitter, a leadframe including at least one electrical lead and a body structure encasing a portion of the leadframe. A thermal transfer material can be isolated from the at least one electrical lead. The body structure can include a plastic body structure wherein a rim portion can be disposed along a portion of the upper surface of the body structure. The light emission package can also include the at least one solid state emitter mounted over thermal transfer material using a direct metal-to-metal bond such as by eutectic die attachment. The light emission package is operable to emit light with an output of approximately 70% or greater of an initial light output for an extrapolated time of at least approximately 150,000 hours or more.

Abstract translation: 发光封装包括至少一个固态发射器，引线框架，其包括至少一个电引线和封装引线框架的一部分的主体结构。 热转印材料可以与至少一个电引线隔离。 身体结构可以包括塑料体结构，其中边缘部分可以沿着身体结构的上表面的一部分设置。 发光封装还可以包括使用直接金属 - 金属键（例如通过共晶管芯附接）安装在热转印材料上的至少一个固态发射器。 发光包可操作以发射具有大约70％或更大的初始光输出的光，用于至少约150,000小时或更长时间的外推时间。

公开(公告)号：US08624271B2

公开(公告)日：2014-01-07

申请号：US13104558

申请日：2011-05-10

Applicant: Jesse Colin Reiherzer ,  Christopher P. Hussell ,  Peter Scott Andrews ,  David T. Emerson

Inventor： Jesse Colin Reiherzer ,  Christopher P. Hussell ,  Peter Scott Andrews ,  David T. Emerson

IPC: H01L33/62

CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.

Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。

公开(公告)号：US08287759B2

公开(公告)日：2012-10-16

申请号：US12466782

申请日：2009-05-15

Applicant: Brian Thomas Collins ,  Jesse Colin Reiherzer ,  Florin A. Tudorica

Inventor： Brian Thomas Collins ,  Jesse Colin Reiherzer ,  Florin A. Tudorica

IPC: C09K11/08 ,  C09K11/55 ,  C09K11/59 ,  C09K11/64 ,  C09K11/65 ,  C09K11/79 ,  C09K11/80

CPC classification number: C09K11/025 ,  C04B35/584 ,  C04B35/597 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/3852 ,  C04B2235/3865 ,  C09K11/0883 ,  C09K11/59 ,  C09K11/77 ,  C09K11/7706

Abstract: A luminescent particle includes an interior portion of the luminescent particle comprising a luminescent compound that reacts with atmospherically present components and a passivating layer on an outer surface of the luminescent particle that is operable to inhibit the reaction between the luminescent compound and the atmospherically present components.

Abstract translation: 发光颗粒包括发光颗粒的内部，其包含与气氛存在的组分反应的发光化合物和发光颗粒的外表面上的钝化层，其可操作地抑制发光化合物和气氛存在组分之间的反应。

公开(公告)号：US10211380B2

公开(公告)日：2019-02-19

申请号：US13309177

申请日：2011-12-01

Applicant: Shaow Lin ,  James Sievert ,  Jesse Colin Reiherzer ,  Barry Rayfield ,  Christopher P. Hussell

Inventor： Shaow Lin ,  James Sievert ,  Jesse Colin Reiherzer ,  Barry Rayfield ,  Christopher P. Hussell

IPC: H01L23/10 ,  H01L23/34 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/44

Abstract: Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, a component of a light emitting device can include a silver (Ag) portion, which can be silver on a substrate, and a protective layer disposed over the Ag portion. The protective layer can at least partially include an inorganic material for increasing the chemical resistance of the Ag portion.

公开(公告)号：US20130207142A1

公开(公告)日：2013-08-15

申请号：US13444394

申请日：2012-04-11

Applicant: Jesse Colin Reiherzer

Inventor： Jesse Colin Reiherzer

IPC: H01L33/50

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Light emitter devices having improved chemical and physical resistance and related methods are disclosed herein. In one embodiment, the light emitter device includes a light emission area with a cavity with one or more light emitting chips disposed within the cavity. The device can further include a filling material at least partially disposed over the one or more light emitting chips. The filling material can include a first discrete layer of phosphor containing material and a second discrete clear barrier layer. The clear barrier layer can include a layer of glass.

Abstract translation: 本文公开了具有改善的化学和物理电阻的光发射器件及相关方法。 在一个实施例中，光发射器件包括具有空腔的发光区域，该空腔具有设置在空腔内的一个或多个发光芯片。 该装置还可以包括至少部分地布置在一个或多个发光芯片上的填充材料。 填充材料可以包括含荧光体材料的第一离散层和第二离散透明阻挡层。 透明阻挡层可以包括一层玻璃。