公开(公告)号：US09037446B2

公开(公告)日：2015-05-19

申请号：US13224270

申请日：2011-09-01

Applicant: Jianyong Xie ,  Madhavan Swaminathan

Inventor： Jianyong Xie ,  Madhavan Swaminathan

IPC: G06F17/50

CPC classification number: G06F17/5036 ,  G06F17/5018 ,  G06F17/5045 ,  G06F17/5068 ,  G06F2217/80

Abstract: In a method for simulating temperature and electrical characteristics within an circuit, a temperature of at least one volume within the circuit as a function of a resistance within the at least one volume is repeatedly calculated and the resistance as a function of the temperature is repeatedly calculated until the temperature is within a predetermined tolerance of a previous temperature result and until the resistance is within a predetermined tolerance of a previous resistance result. Once the temperature is within a predetermined tolerance of the previous temperature result and the resistance is within a predetermined tolerance of the previous resistance, then an output indicative of the temperature is generated.

Abstract translation: 在用于模拟电路内的温度和电特性的方法中，重复计算作为至少一个体积内的电阻的函数的电路内至少一个体积的温度，并且重复计算作为温度的函数的电阻 直到温度在先前温度结果的预定公差内，直到电阻在先前阻力结果的预定公差内。 一旦温度在先前温度结果的预定公差内，并且电阻在先前电阻的预定公差内，则产生指示温度的输出。

公开(公告)号：US20230207494A1

公开(公告)日：2023-06-29

申请号：US17561726

申请日：2021-12-24

Applicant: Jianyong XIE ,  Andrew P. COLLINS ,  Arghya SAIN ,  Sivaseetharaman PANDI ,  Telesphor KAMGAING

Inventor： Jianyong XIE ,  Andrew P. COLLINS ,  Arghya SAIN ,  Sivaseetharaman PANDI ,  Telesphor KAMGAING

IPC: H01L23/64 ,  H01F27/28 ,  H01L23/15 ,  H01L23/498

CPC classification number: H01L23/645 ,  H01F27/2804 ,  H01L23/15 ,  H01L23/49827

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.

公开(公告)号：US20120053913A1

公开(公告)日：2012-03-01

申请号：US13224270

申请日：2011-09-01

Applicant: Jianyong Xie ,  Madhavan Swaminathan

Inventor： Jianyong Xie ,  Madhavan Swaminathan

IPC: G06F17/50 ,  G06F17/10

CPC classification number: G06F17/5036 ,  G06F17/5018 ,  G06F17/5045 ,  G06F17/5068 ,  G06F2217/80

Abstract: In a method for simulating temperature and electrical characteristics within an circuit, a temperature of at least one volume within the circuit as a function of a resistance within the at least one volume is repeatedly calculated and the resistance as a function of the temperature is repeatedly calculated until the temperature is within a predetermined tolerance of a previous temperature result and until the resistance is within a predetermined tolerance of a previous resistance result. Once the temperature is within a predetermined tolerance of the previous temperature result and the resistance is within a predetermined tolerance of the previous resistance, then an output indicative of the temperature is generated.

Abstract translation: 在用于模拟电路内的温度和电特性的方法中，重复计算作为至少一个体积内的电阻的函数的电路内至少一个体积的温度，并且重复计算作为温度的函数的电阻 直到温度在先前温度结果的预定公差内，直到电阻在先前阻力结果的预定公差内。 一旦温度在先前温度结果的预定公差内，并且电阻在先前电阻的预定公差内，则产生指示温度的输出。