公开(公告)号：US07826212B2

公开(公告)日：2010-11-02

申请号：US11413853

申请日：2006-04-27

Applicant: Gregory Shogan ,  John Maynard Dunham

Inventor： Gregory Shogan ,  John Maynard Dunham

IPC: G06F1/20 ,  H05K5/00 ,  H05K7/20

CPC classification number: G11B33/124 ,  G06F1/20 ,  G11B33/128 ,  G11B33/1426

Abstract: Thermal control through a channel structure is disclosed. In one embodiment, an apparatus includes devices operable at an undesired temperature relative to a desired operating temperature, a vented cover of each of devices, and a channel structure formed along a side face of each of the devices, the channel structure having any number of ridges to transfer a gas between the vented cover and an external location to the apparatus. The gas may modify an operating state of the devices from the undesired temperature to the desired operating temperature. A heat structure coupled to the vented cover and the side face may absorb a portion of an energy dissipated by at least one of the devices. A printed circuit board may be formed along an opposite face relative to the vented cover to enable the gas to escape to the external location through a cavity of the apparatus.

Abstract translation: 公开了通过通道结构的热控制。 在一个实施例中，一种装置包括可在相对于期望的操作温度的不期望的温度下操作的装置，每个装置的通风盖以及沿着每个装置的侧面形成的通道结构，所述通道结构具有任何数量的 将通气盖和外部位置之间的气体传送到设备的脊。 气体可以将装置的操作状态从不期望的温度改变到期望的操作温度。 耦合到通风盖和侧面的热结构可以吸收由至少一个装置消散的能量的一部分。 印刷电路板可以沿着相对于通风盖的相对面形成，以使得气体能够通过设备的空腔逸出到外部位置。

公开(公告)号：US20080049388A1

公开(公告)日：2008-02-28

申请号：US11413853

申请日：2006-04-27

Applicant: Gregory Shogan ,  John Maynard Dunham

Inventor： Gregory Shogan ,  John Maynard Dunham

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00

CPC classification number: G11B33/124 ,  G06F1/20 ,  G11B33/128 ,  G11B33/1426

Abstract: Thermal control through a channel structure is disclosed. In one embodiment, an apparatus includes devices operable at an undesired temperature relative to a desired operating temperature, a vented cover of each of devices, and a channel structure formed along a side face of each of the devices, the channel structure having any number of ridges to transfer a gas between the vented cover and an external location to the apparatus. The gas may modify an operating state of the devices from the undesired temperature to the desired operating temperature. A heat structure coupled to the vented cover and the side face may absorb a portion of an energy dissipated by at least one of the devices. A printed circuit board may be formed along an opposite face relative to the vented cover to enable the gas to escape to the external location through a cavity of the apparatus.

Abstract translation: 公开了通过通道结构的热控制。 在一个实施例中，一种装置包括可在相对于期望的操作温度的不期望的温度下操作的装置，每个装置的通风盖以及沿着每个装置的侧面形成的通道结构，所述通道结构具有任何数量的 将通气盖和外部位置之间的气体传送到设备的脊。 气体可以将装置的操作状态从不期望的温度改变到期望的操作温度。 耦合到通风盖和侧面的热结构可以吸收由至少一个装置消散的能量的一部分。 印刷电路板可以沿着相对于通风盖的相对面形成，以使得气体能够通过设备的空腔逸出到外部位置。