公开(公告)号：US20140210047A1

公开(公告)日：2014-07-31

申请号：US14240453

申请日：2012-05-25

Applicant: Kazunao Tajima ,  Atsuhiko Tanaka

Inventor： Kazunao Tajima ,  Atsuhiko Tanaka

IPC: H01L49/02

CPC classification number: H01L28/10 ,  H01F2027/2819 ,  H01L23/48 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/0239 ,  H05K1/165 ,  H05K2201/09672 ,  H01L2924/00

Abstract: A semiconductor device including: first and second semiconductor chips mounted on a base substrate; a third semiconductor chip, which is mounted on the base substrate, and outputs control signals controlling operations of the first and second semiconductor chips; a first transmission transformer, which is mounted on the base substrate, and has a reception-side terminal connected to the third semiconductor chip and a transmission-side terminal connected to the first semiconductor chip; and a second transmission transformer, which is mounted on the base substrate, and has a reception-side terminal connected to the third semiconductor chip and a transmission-side terminal connected to the second semiconductor chip, wherein the control signals are transmitted from the third semiconductor chip to the first semiconductor chip and the second semiconductor chip individually through the first transmission transformer and the second transmission transformer.

Abstract translation: 一种半导体器件，包括：安装在基底基板上的第一和第二半导体芯片; 第三半导体芯片，其安装在所述基底基板上，并且输出控制所述第一和第二半导体芯片的操作的控制信号; 第一传输变压器，其安装在基底基板上，并且具有连接到第三半导体芯片的接收侧端子和连接到第一半导体芯片的发送侧端子; 以及第二变压器，其安装在所述基底基板上，具有连接到所述第三半导体芯片的接收侧端子和与所述第二半导体芯片连接的发送侧端子，其中，所述控制信号从所述第三半导体 通过第一变速器变压器和第二变速器单独地分别通向第一半导体芯片和第二半导体芯片。