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公开(公告)号：US20070128967A1
公开(公告)日：2007-06-07
申请号：US11599738
申请日：2006-11-15
Applicant: Keith Becken , Stephan Logunov
Inventor： Keith Becken , Stephan Logunov
CPC classification number: H01L51/5246 , H01L51/56
Abstract: A method of minimizing stress in an OLED device laser sealing process using an elongated laser beam. A laser beam having an intensity distribution which decreases as a function of distance from the longitudinal axis of the beam is passed through a mask to create an elongated beam having a length-wise intensity distribution which decreases as a function of distance from the axis of the beam and a substantially constant width-wise intensity distribution. The elongated beam is traversed over a line of frit disposed between two substrates. The tails of the length-wise intensity distribution provide for a slow cool down of the frit as the beam traverses the line of frit.
Abstract translation: 使用细长激光束在OLED器件激光密封过程中使应力最小化的方法。 具有作为距离光束的纵向轴线的距离的函数减小的强度分布的激光束通过掩模以产生具有纵向强度分布的细长光束，该光束分布随着距离光束的轴线的距离而减小 光束和基本恒定的宽度方向强度分布。 细长的横梁穿过设置在两个基板之间的玻璃料线。 长度强度分布的尾部提供了当波束穿过玻璃料线时玻璃料的缓慢冷却。
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2.发明申请Method for backside sealing organic light emitting diode (OLED) displays 审中-公开背面密封有机发光二极管（OLED）显示器的方法公开(公告)号：US20060084348A1
公开(公告)日：2006-04-20
申请号：US11095144
申请日：2005-03-30
Applicant: Keith Becken , Stephan Logunov , Kamjula Reddy , Joseph Schroeder , Holly Strzepek
Inventor： Keith Becken , Stephan Logunov , Kamjula Reddy , Joseph Schroeder , Holly Strzepek
CPC classification number: C03C27/06 , H01L51/5246 , Y10T428/23 , Y10T428/24777
Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.
Abstract translation: 本文描述了一种气密密封的玻璃封装及其制造方法。 在一个实施例中，密封玻璃封装适合于保护对环境环境敏感的薄膜器件。 这种玻璃封装的一些实例是有机发光二极管（OLED）显示器，传感器和其它光学器件。 以OLED显示器为例进行了说明。
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公开(公告)号：US20070128966A1
公开(公告)日：2007-06-07
申请号：US11593768
申请日：2006-11-07
Applicant: Keith Becken , Stephan Logunov
Inventor： Keith Becken , Stephan Logunov
CPC classification number: H05B33/04 , C03C27/06 , H01L51/5246 , H01L51/56 , H01L2251/55
Abstract: A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption α which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with the frit, sealing together the substrates by traversing a laser light having a wavelength λ over the frit at a speed greater than about 5 mm/s, and wherein α·h at λ is between 0.4 and about 1.75
Abstract translation: 一种用玻璃料将基板之间的显示装置封装的方法。 该方法包括将具有波长函数的光吸收α的玻璃料沉积到第一基底上，其中沉积的玻璃料具有高度h，将第二基底与玻璃料接触，通过遍历具有 以大于约5mm / s的速度在玻璃料上方的波长λ，并且其中λ处的alpha.h为0.4至约1.75
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4.发明申请Optimization of parameters for sealing organic emitting light diode (OLED) displays 有权密封有机发光二极管（OLED）显示器的参数优化公开(公告)号：US20060082298A1
公开(公告)日：2006-04-20
申请号：US10970319
申请日：2004-10-20
Applicant: Keith Becken , Stephan Logunov , Kamjula Reddy , Joseph Schroeder , Holly Strzepek
Inventor： Keith Becken , Stephan Logunov , Kamjula Reddy , Joseph Schroeder , Holly Strzepek
CPC classification number: C03C27/06 , H01L51/5246 , Y10T428/23 , Y10T428/24777
Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.
Abstract translation: 本文描述了一种气密密封的玻璃封装及其制造方法。 在一个实施例中，密封玻璃封装适合于保护对环境环境敏感的薄膜器件。 这种玻璃封装的一些实例是有机发光二极管（OLED）显示器，传感器和其它光学器件。 以OLED显示器为例进行了说明。
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