公开(公告)号：US06865081B2

公开(公告)日：2005-03-08

申请号：US10394356

申请日：2003-03-21

Applicant: Heinrich Meyer ,  Konrad Cramer ,  Olaf Kurtz ,  Peter Prechtl ,  Sven Theisen ,  Markus Hohn ,  Ralph Herber

Inventor： Heinrich Meyer ,  Konrad Cramer ,  Olaf Kurtz ,  Peter Prechtl ,  Sven Theisen ,  Markus Hohn ,  Ralph Herber

IPC: F25D9/00 ,  F28F3/12 ,  H01L23/473 ,  H05K7/20

CPC classification number: F28F3/12 ,  F28F9/0253 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 μm, a depth in the range of 25 to 1,000 μm, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 μm, and the base plate 5 has a thickness in the range of 200 to 2,000 μm.

Abstract translation: 本发明涉及一种用于待冷却的物品4的微结构冷却器3，由此冷却器3包括至少两个金属膜1和一个基板5的叠层，该底板5可经由热接触表面6与热接触表面6 如图4所示，金属膜1和基板5以材料配合相互接合，存在于金属膜1中的是用于冷却介质的通道2，通道2的宽度在100〜2000μm的范围内 ，深度为25〜1000μm，平均间隔为50〜1000，金属膜1中的通道2产生的残留膜厚度在50〜300μm的范围内，基底 板5的厚度在200至2,000μm的范围内。

公开(公告)号：US06736983B1

公开(公告)日：2004-05-18

申请号：US09979318

申请日：2002-02-04

Applicant: Andreas Thies ,  Konrad Cramer ,  Heinrich Meyer

Inventor： Andreas Thies ,  Konrad Cramer ,  Heinrich Meyer

IPC: C23F100

CPC classification number: F28F3/048 ,  B01J19/0093 ,  B01J2219/00317 ,  B01J2219/00783 ,  B01J2219/00835 ,  B01J2219/00873 ,  B32B15/01 ,  B81B2201/0214 ,  B81B2201/051 ,  B81B2203/033 ,  B81C1/00206 ,  C40B60/14 ,  F28F2260/02 ,  G03F7/00 ,  H01M8/0631 ,  Y02P70/56

Abstract: Micro-components having at least one individual layer are produced according to the method, which have functional layers 3 on the walls of inner structures, for example of flow channels. The micro-components are intended to be suitable for a large number of different applications in chemical reaction technology, for heat exchanging, for mixing substances or for evaporating liquids. In particular, the micro-components are intended to have no problems in respect of leaks in the flow channels. The method has the following method steps: A. producing the at least one individual layer by: a. producing a first metal layer or a metal foil 1; b. forming the inner structures in and/or on the first metal layer or metal foil 1 by suitable etching methods and/or metal deposition methods; and c. forming the functional layers 3 solely on the walls of the inner structures and thereafter B. stacking up and joining the one individual layer to a segment terminating the inner structures, or a plurality of individual layers to one another and to the terminating segment.

Abstract translation: 根据该方法制备具有至少一个单独层的微组件，该方法在内部结构的壁上（例如流动通道）上具有功能层3。 微型组件旨在适用于化学反应技术中的大量不同应用，用于热交换，混合物质或蒸发液体。 特别地，微组件意在在流动通道中泄漏方面没有问题。 该方法具有以下方法步骤：A.通过以下方式产生至少一个单独的层：a。 制造第一金属层或金属箔1; b。 通过合适的蚀刻方法和/或金属沉积方法在第一金属层或金属箔1上形成内部结构和/或形成内部结构; 和c。 仅在内部结构的壁上形成功能层3，之后B.将一个单独层叠合并连接到终止内部结构的区段，或者将多个单独的层彼此堆叠并连接到终止区段。