公开(公告)号：US6395982B2

公开(公告)日：2002-05-28

申请号：US20934598

申请日：1998-12-11

Applicant: NELSON WILLIAM JOHN ,  TSENG ALICE ,  LEE K. R. ,  LAI STANLEY

Inventor： NELSON WILLIAM JOHN ,  TSENG ALICE ,  LEE K R ,  LAI STANLEY

IPC: H01L23/48 ,  H01L21/48 ,  H01L23/495 ,  H05K3/30 ,  H01L23/02

CPC classification number: H05K3/308 ,  H01L21/4842 ,  H01L23/49555 ,  H01L2924/0002 ,  H05K2201/10818 ,  H01L2924/00

Abstract: A leaded semiconductor device package for nonsoldering assembling is disclosed. In the package of the invention, both leads of a semiconductor device package are flattened, cut and bent by automatic machines on the bais of conventional packaging process. Unlike a conventional semiconductor device package which is electrically connected to a circuit by soldering, the flattened and bent parts of both leads of the semiconductor device package can be electrically connected to a circuit by elastically contacting and directly assembling without soldering.

Abstract translation: 公开了一种用于非焊接组装的引线半导体器件封装。 在本发明的封装中，半导体器件封装的两个引线通过常规封装工艺的自动机械被平坦化，切割和弯曲。 与通过焊接电连接到电路的常规半导体器件封装不同，半导体器件封装的两个引线的扁平和弯曲部分可以通过弹性接触并直接组装而不被焊接而电连接到电路。